Antioxidants for post-CMP cleaning formulations

Patent metadata

Field	Value
Publication number	US-9528078-B2
Application number	US-201414224672-A
Country	US
Kind code	B2
Filing date	Mar 25, 2014
Priority date	Sep 21, 2006
Publication date	Dec 27, 2016
Grant date	Dec 27, 2016

Abstract

An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.

First claim

What is claimed is:

1. A cleaning composition comprising at least one solvent, at least one corrosion inhibitor, at least one quaternary base, at least one reducing agent, and at least one organic amine, wherein the corrosion inhibitor comprises a species selected from the group consisting of: glucuronic acid; squaric acid; adenosine and derivatives thereof; phenanthroline in combination with ascorbic acid; flavonols and derivatives thereof; anthocyanins and derivatives thereof; flavonols in combination with anthocyanins; quercitin and derivatives thereof; quercitin in combination with anthocyanins; and combinations thereof, wherein the at least one reducing agent comprises a species selected from the group consisting of ascorbic acid, L(+)-ascorbic acid, isoascorbic acid, ascorbic acid derivatives, glyoxal, and combinations thereof, wherein the cleaning composition is effective for the removal of residue from a microelectronic device having said residue thereon.

2. The cleaning composition of claim 1 , wherein the cleaning composition further comprises at least one complexing agent.

3. The cleaning composition of claim 1 , wherein the at least one corrosion inhibitor comprises a species selected from the group consisting of adenosine and derivatives thereof, and combinations thereof.

4. The cleaning composition of claim 1 , wherein the solvent comprises water.

5. The cleaning composition of claim 1 , wherein the composition is substantially devoid of oxidizing agent, fluoride source, and/or abrasive material prior to removal of residue material from the microelectronic device.

6. The cleaning composition of claim 1 , further comprising at least one additional corrosion inhibitor, wherein the at least one additional corrosion inhibitor comprises a species selected from the group consisting of benzotriazole, citric acid, ethylenediamine, gallic acid, oxalic acid, tannic acid, ethylenediaminetetraacetic acid (EDTA), uric acid, 1,2,4-triazole (TAZ), tolyltriazole, 5-phenyl-benzotriazole, 5-nitro-benzotriazole, 3-amino-5-mercapto-1,2,4-triazole, 1-amino-1,2,4-triazole, hydroxybenzotriazole, 2-(5-amino-pentyp-benzotriazole, 1-amino-1,2,3-triazole, 1-amino-5-methyl-1,2,3-triazole, 3-amino-1,2,4-triazole, 3-mercapto-1,2,4-triazole, 3-isopropyl-1,2,4-triazole, 5-phenylthiol-benzotriazole, halo-benzotriazoles, naphthotriazole, 2-mercaptobenzimidazole (MBI), 2-mercaptobenzothiazole, 4-methyl-2-phenylimidazole, 2-mercaptothiazoline, 5-aminotetrazole, 5-amino-1,3 ,4-thiadiazole-2-thiol, 2,4-diamino-6-methyl-1,3,5-triazine, thiazole, triazine, methyltetrazole, 1,3-dimethyl-2-imidazolidinone, 1,5-pentamethylenetetrazole, 1-phenyl-5-mercaptotetrazole, diaminomethyltriazine, imidazoline thione, mercaptobenzimidazole, 4-methyl-4H-1,2,4-triazole-3-thiol, 5-amino-1,3,4-thiadiazole-2-thiol, benzothiazole, tritolyl phosphate, imidazole, indiazole, benzoic acid, ammonium benzoate, catechol, pyrogallol, resorcinol, hydroquinone, cyanuric acid, barbituric acid, 1,2-dimethylbarbituric acid, pyruvic acid, adenine, purine, phosphonic acid and derivatives thereof, glycine/ascorbic acid, and combinations thereof.

7. The cleaning composition of claim 1 , wherein the at least one amine has the general formula NR 1 R 2 R 3 , where R 1 , R 2 and R 3 may be the same as or different from one another and are selected from the group consisting of hydrogen, straight-chained C 1 -C 6 alkyl, branched C l -C 6 alkyl, straight-chained C l -C 6 alcohol, and branched C 1 -C 6 alcohol.

8. The cleaning composition of claim 1 , wherein the at least one quaternary base has the formula NR 1 R 2 R 3 R 4 OH, wherein R 1 , R 2 , R 3 and R 4 may be the same as or different from one another and are selected from the group consisting of hydrogen, straight-chained C 1 -C 6 alkyl, branched C l -C 6 alkyl, substituted C 6 -C 10 aryl, and unsubstituted C 6 -C 10 aryl.

9. A method of removing residue and contaminants from a microelectronic device having said residue and contaminants thereon, said method comprising contacting the microelectronic device with a cleaning composition for sufficient time to at least partially clean said residue and contaminants from the microelectronic device, wherein the cleaning composition includes at least one solvent, at least one corrosion inhibitor, at least one quaternary base, at least one reducing agent, and at least one organic amine, wherein the corrosion inhibitor comprises a species selected from the group consisting of: glucuronic acid; squaric acid; adenosine and derivatives thereof; phenanthroline in combination with ascorbic acid; flavonols and derivatives thereof; anthocyanins and derivatives thereof; flavonols in combination with anthocyanins; quercitin and derivatives thereof; quercitin in combination with anthocyanins; and combinations thereof, and wherein the at least one reducing agent comprises a species selected from the group consisting of ascorbic acid, L(+)-ascorbic acid, isoascorbic acid, ascorbic acid derivatives, glyoxal, and combinations thereof.

10. The cleaning composition of claim 1 , wherein the at least one organic amine comprises a species selected from the group consisting of aminoethylethanolamine, N-methylaminoethanol, aminoethoxy ethanol, dimethylaminoethoxyethanol, diethanolamine, N-methyldiethanolamine, monoethanolamine, triethanolamine, 1-amino-2-propanol, 2-amino-1-butanol, isobutanolamine, triethylenediamine, other C 1 -C 8 alkanolamines and combinations thereof.

11. The cleaning composition of claim 1 , wherein the at least one quaternary base comprises a species selected from the group consisting of tetraethylammonium hydroxide, tetramethyammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, tributylmethylammonium hydroxide, benzyltrimethylammonium hydroxide, and combinations thereof.

12. The cleaning composition of claim 2 , comprising the at least one complexing agent, wherein the complexing agents comprise a species selected from the group consisting of acetic acid, acetone oxime, acrylic acid, adipic acid, alanine, arginine, asparagine, aspartic acid, betaine, dimethyl glyoxime, formic acid, fumaric acid, gluconic acid, glutamic acid, glutamine, glutaric acid, glyceric acid, glycerol, glycolic acid, glyoxylic acid, histidine, iminodiacetic acid, isophthalic acid, itaconic acid, lactic acid, leucine, lysine, maleic acid, maleic anhydride, malic acid, malonic acid, mandelic acid, 2,4-pentanedione, phenylacetic acid, phenylalanine, phthalic acid, proline, propionic acid, pyrocatecol, pyromellitic acid, quinic acid, serine, sorbitol, succinic acid, tartaric acid, terephthalic acid, trimellitic acid, trimesic acid, tyrosine, valine, xylitol, salts and derivatives thereof, and combinations thereof.

13. The cleaning composition of claim 2 , comprising the at least one complexing agent, wherein the complexing agents comprise a species selected from the group consisting of alanine, arginine, asparagine, aspartic acid, glutamic acid, glutamine, histidine, leucine, lysine, phenylalanine, proline, serine, tyrosine, valine, salts and derivatives thereof, and combinations thereof.

14. The method of claim 9 , wherein the corrosion inhibitor comprises at least one species selected from the group consisting of adenosine and derivatives thereof, and combinations thereof.

15. The method of claim 9 , wherein the corrosion inhibitor comprises adenosine.

16. The method of claim 9 , wherein the solvent comprises water.

17. The method of claim 9 , wherein the cleaning composition further comprises at least one additional corrosion inhibitor, wherein the at least one a

Assignees

• Advanced Tech Materials

Inventors

• Angst David
• Zhang Peng
• Barnes Jeffrey
• Sonthalia Prerna
• Cooper Emanuel
• Boggs Karl

Classifications

• C11D7/32

  containing nitrogen · CPC title

• C11D3/0084 Primary

  Antioxidants; Free-radical scavengers · CPC title

• C11D11/0047

  Chemistry & Metallurgy · mapped topic

• C11D3/0073 Primary

  Anticorrosion compositions · CPC title

• C11D7/3281

  Heterocyclic compounds · CPC title