Lithium ion battery, integrated circuit and method of manufacturing a lithium ion battery

Patent metadata

Field	Value
Publication number	US-9917333-B2
Application number	US-201414230071-A
Country	US
Kind code	B2
Filing date	Mar 31, 2014
Priority date	Mar 31, 2014
Publication date	Mar 13, 2018
Grant date	Mar 13, 2018

Abstract

A lithium ion battery includes a first substrate having a first main surface, and a lid including an insulating material. The lid is attached to the first main surface of the first substrate, and a cavity is defined between the first substrate and the lid. The lithium ion battery further includes an electrical interconnection element in the lid, the electrical interconnection element providing an electrical connection between a first main surface and a second main surface of the lid. The lithium ion battery further includes an electrolyte in the cavity, an anode at the first substrate, the anode including a component made of a semiconductor material, and a cathode at the lid.

First claim

What is claimed is:

1. A lithium ion battery, comprising:
a first substrate having a first main surface;
a carrier made of an electrically insulating material attached to the first main surface of the first substrate, a cavity being defined between the first substrate and the carrier;
an electrical interconnection element in the carrier, the electrical interconnection element providing an electrical connection between a first main surface and a second main surface of the carrier;
an electrolyte in the cavity;
an anode at the first main surface of the first substrate, the anode comprising a component made of a semiconductor material; and
a cathode in direct contact with the first main surface of the carrier, the cathode being electrically connected to the electrical interconnection element.

2. The lithium ion battery according to claim 1 , wherein the cavity comprises a recess in the carrier, the cathode being disposed in the recess.

3. The lithium ion battery according to claim 1 , wherein the first substrate includes a patterned structure.

4. The lithium ion battery according to claim 1 , wherein the electrical interconnection element comprises a via hole extending from the first main surface to the second main surface, the via hole being filled with a conductive material.

5. The lithium ion battery according to claim 1 , wherein the first substrate is a semiconductor substrate and the carrier is made of glass.

6. The lithium ion battery according to claim 1 , further comprising a thin film disposed over the first substrate and covering a sidewall of the carrier, the thin film sealing a connection portion between the first substrate and the carrier.

7. The lithium ion battery according to claim 1 , wherein the electrical interconnection element comprises a portion of a second substrate made of a conductive or semiconductor material, the portion of the second substrate being embedded into the carrier and the portion of the second substrate being electrically connected to the cathode.

8. The lithium ion battery according to claim 1 , wherein the semiconductor material is silicon.

9. An integrated circuit comprising a lithium ion battery and integrated circuit elements, the lithium ion battery including:
a first substrate having a first main surface;
a carrier made of an electrically insulating material attached to the first main surface of the first substrate, a cavity being defined between the first substrate and the carrier;
an electrical interconnection element in the carrier, the electrical interconnection element providing an electrical connection between a first main surface and a second main surface of the carrier;
an electrolyte in the cavity;
an anode at the first main face of the first substrate, the anode comprising a component made of a semiconductor material; and
a cathode in direct contact with the main surface of the carrier, the cathode being electrically connected to the electrical interconnection element.

10. The integrated circuit of claim 9 , wherein the integrated circuit elements are formed in the first substrate.

11. The integrated circuit of claim 9 , wherein the integrated circuit elements are formed in a further semiconductor substrate.

12. The integrated circuit of claim 9 , wherein the integrated circuit elements are selected from the group consisting of a resistor, a capacitor, a transistor, a sensor, an energy generating device, a processing device, a display device, an actuator and a transmitter.

13. A method of manufacturing a lithium ion battery, the method comprising:
forming an electrical interconnection element in a carrier made of an electrically insulating material, the electrical interconnection element providing an electrical connection between a first main surface and a second main surface of the carrier;
forming a cathode in direct contact with the first main surface of the carrier, the cathode being electrically connected to the electrical interconnection element;
forming an anode at a first main surface of a first substrate, the anode comprising a component made of a semiconductor material, wherein forming the cathode or forming the anode comprises defining a cavity;
filling an electrolyte into the cavity; and
attaching the carrier to the first main surface of the first substrate.

14. The method of claim 13 , wherein attaching the carrier to the first main surface of the first substrate comprises forming a bonding member on the first substrate or on the carrier.

15. The method of claim 14 , wherein the bonding member is made of a UV curable glue.

16. The method of claim 14 , wherein the bonding member is made of a thermally curable glue.

17. The method of claim 13 , wherein forming the electrical interconnection element comprises forming a via hole in the carrier and filling the via hole with a conductive material.

18. The method of claim 17 , wherein the via hole is filled with a conductive material using a screen printing method, an inkjet printing method, a semiconductor embossing method or a metal embossing method.

19. The method of claim 13 , further comprising forming a thin film over the first substrate and covering a sidewall of the carrier, the thin film sealing a connection portion between the first substrate and the carrier.

20. The method of claim 13 , wherein forming an electrical interconnection element in the carrier comprises:
embedding a second substrate made of a conductive or semiconductor material in the carrier, and
defining the cavity comprises forming a recess in a first main surface of the carrier to uncover a portion of the portion of the second substrate.

Assignees

• Infineon Technologies Ag

Inventors

• Rajaraman Vijaye Kumar
• Karlovsky Kamil
• Neidhart Thomas
• Mayer Karl
• Leuschner Rainer
• Moser Christine
• Joshi Ravi Keshav
• Breymesser Alexander
• Goller Bernhard
• Santos Rodriguez Francisco Javier
• Zorn Peter

Classifications

• H01M50/186

  characterised by the disposition of the sealing members · CPC title

• H01M50/172

  Arrangements of electric connectors penetrating the casing · CPC title

• H01M10/4257 Primary

  Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries · CPC title

• H01M10/04

  Construction or manufacture in general (H01M10/058, H01M10/12, H01M10/28, H01M10/38 take precedence) · CPC title

• H01M6/40

  Printed batteries {, e.g. thin film batteries} · CPC title