Thermopile temperature sensor field of view narrowing using integrated light blocking layer and lens

Patent metadata

Field	Value
Publication number	US-9917242-B2
Application number	US-201514865593-A
Country	US
Kind code	B2
Filing date	Sep 25, 2015
Priority date	Mar 27, 2015
Publication date	Mar 13, 2018
Grant date	Mar 13, 2018

Abstract

A sensor device, a sensor package, and method for fabricating a sensor device are described that include an integrated light blocker disposed on the thermopile device and a lens configured to direct light to the thermopile device. In an implementation, the thermopile device includes a substrate; a thermopile membrane disposed on the substrate, the thermopile membrane including at least one passivation layer; a thermopile disposed within the thermopile membrane, the thermopile including at least one thermocouple; and a light blocking layer disposed proximate to the thermopile membrane, the light blocking layer including an aperture disposed proximate to the thermopile.

First claim

What is claimed is:

1. A thermopile device, comprising:
a substrate including a support structure;
a thermopile membrane disposed on the substrate and the support structure, the support structure configured to form a cavity between the thermopile membrane and a hermetic package, the thermopile membrane including at least one passivation layer;
a thermopile disposed within the thermopile membrane, the thermopile including at least one thermocouple; and
a light blocking layer disposed proximate to the thermopile membrane, the light blocking layer including an aperture disposed proximate to the thermopile.

2. The thermopile device of claim 1 , wherein the light blocking layer includes a light reflecting layer disposed on the thermopile membrane.

3. The thermopile device of claim 1 , wherein the light blocking layer is disposed between the thermopile membrane and a package lid.

4. The thermopile device of claim 1 , wherein the aperture includes an absorber layer.

5. A sensor package, comprising:
a hermetic package; and
a sensor device disposed within the hermetic package, the sensor device including a substrate including a support structure;
a sensor disposed on the substrate and the support structure, the support structure configured to form a cavity between the sensor and the hermetic package; and
a light blocking layer including a light reflecting layer disposed on the sensor, the light blocking layer including an aperture disposed proximate to an active portion of the sensor; and
a package lid disposed on the hermetic package.

6. The sensor package in claim 5 , wherein the sensor package includes a thermopile temperature sensor package having
a thermopile device including
a thermopile membrane disposed on the substrate;
a thermopile disposed within the thermopile membrane, the thermopile including at least one thermocouple; and
the light blocking layer including the light reflecting layer is disposed on the thermopile membrane and the aperture is disposed proximate to the thermopile.

7. The sensor package of claim 5 , wherein the sensor includes an optical sensor.

8. The sensor package of claim 5 , wherein the sensor includes a thermal sensor.

9. The sensor package of claim 5 , wherein the sensor includes at least one of a microbolometer, a pyroelectric detector, or a carbon nanotube detector.

10. The sensor package of claim 5 , wherein the package lid includes a metal layer configured to at least one of block or reflect light.

11. The sensor package of claim 10 , wherein the metal layer includes an aperture configured to allow light.

12. The sensor package of claim 5 , wherein the package lid includes a lens disposed in the package lid and configured to direct light to the sensor device.

13. The sensor package of claim 12 , wherein the package lid includes a filter disposed on the lens.

14. The sensor package of claim 13 , wherein the filter includes an infrared radiation filter.

15. The sensor package of claim 13 , wherein the filter includes an anti-reflective filter.

16. The sensor package of claim 5 , wherein the package lid is hermetically sealed to the hermetic package.

17. The thermopile device of claim 1 , wherein the support structure comprises a pedestal.

Assignees

• Maxim Integrated Products

Inventors

• Barnett Stanley
• Pei Cheng-Wei
• Emadi Arvin
• Bhat Jerome C

Classifications

• H01L35/34 Primary

  Electricity · mapped topic

• G01J5/04

  Casings · CPC title

• H01L35/32

  Electricity · mapped topic

• G01J5/20

  using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices · CPC title

• B81C2203/0109

  Bonding an individual cap on the substrate · CPC title