Prepreg, metal foil-clad laminate, and printed wiring board

Patent metadata

Field	Value
Publication number	US-9914662-B2
Application number	US-201214007817-A
Country	US
Kind code	B2
Filing date	Mar 15, 2012
Priority date	Mar 29, 2011
Publication date	Mar 13, 2018
Grant date	Mar 13, 2018

Abstract

A prepreg having low water absorption, and having remarkably suppressed deterioration in insulation resistance over time, and further having excellent heat resistance, a metal foil-clad laminate using the prepreg, and a printed wiring board using the metal foil-clad laminate are provided. A prepreg of the present invention is obtained by impregnating or coating a base material (D) with a resin composition comprising: a naphthol-modified dimethylnaphthalene formaldehyde resin (A); an epoxy resin (B) having an epoxy equivalent of 200 to 400 g/eq.; and an inorganic filler (C).

First claim

The invention claimed is:

1. A prepreg obtained by impregnating or coating a base material (D) with a resin composition comprising:
a naphthol-modified dimethylnaphthalene formaldehyde resin (A) having a hydroxyl equivalent of 300 to 600 n/eq.;
an epoxy resin (B) having an epoxy equivalent of 250 to 350 g/eq.; and
an inorganic filler (C),
wherein the naphthol-modified dimethylnaphthalene formaldehyde resin (A) is obtained by condensing a dimethylnaphthalene formaldehyde resin and (c) a naphthol compound represented by the following general formula (1) in the presence of an acidic catalyst,

wherein R 1 and R 2 each independently represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and
the dimethylnaphthalene formaldehyde resin is obtained by condensing (a) at least one dimethylnaphthalene selected from the group consisting of 1,5-dimethylnaphthalene, 1,6-dimethylnaphthalene, 2,6-dimethylnaphthalene, 1,7-dimethylnaphthalene, 1,8-dimethylnaphthalene, and 2,7-dimethylnaphthalene and (b) formaldehyde in the presence of an acidic catalyst, the epoxy resin (B) is represented by the following formula (2):

wherein n represents an integer of 1 or more,
the inorganic filler (C) is silica,
a content of the naphthol-modified dimethylnaphthalene formaldehyde resin (A) is 40 to 70 parts by mass based on 100 parts by mass in total of the naphthol-modified dimethylnaphthalene formaldehyde resin (A) and the epoxy resin (B),
a content of the epoxy resin (B) is 30 to 60 parts by mass based on 100 parts by mass in total of the naphthol-modified dimethylnaphthalene formaldehyde resin (A) and the epoxy resin (B), and
a content of the inorganic filler (C) is 5 to 300 parts by mass based on 100 parts by mass in total of the naphthol-modified dimethylnaphthalene formaldehyde resin (A) and the epoxy resin (B).

2. A metal foil-clad laminate using the prepreg according to claim 1 .

3. A printed wiring board using the metal foil-clad laminate according to claim 2 .

Assignees

• Arii Kenj
• Nomizu Kentaro
• Sogame Masanobu
• Mitsubishi Gas Chemical Co

Inventors

• Arii Kenj
• Nomizu Kentaro
• Sogame Masanobu

Classifications

• C03C25/47

  containing particles, fibres or flakes, e.g. in a continuous phase · CPC title

• C08J2361/34

  Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08J2361/04, C08J2361/18, and C08J2361/20 · CPC title

• H05K3/022

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title

• Y10T442/3407

  Chemically deposited metal layer [e.g., chemical precipitation or electrochemical deposition or plating, etc.] · CPC title

• Y10T442/2221

  Coating or impregnation is specified as water proof · CPC title