Targeted control of the absorption behavior during laser resealing

Patent metadata

Field	Value
Publication number	US-9914640-B2
Application number	US-201615358733-A
Country	US
Kind code	B2
Filing date	Nov 22, 2016
Priority date	Dec 8, 2015
Publication date	Mar 13, 2018
Grant date	Mar 13, 2018

Abstract

A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, includes in a first task, an access opening connecting the first cavity to surroundings of the component is formed in the substrate or cap, in a second task, the first pressure and/or the first chemical composition is adjusted in the first cavity, in a third task, the access opening is sealed by introducing energy or heat into an absorbing part of the substrate or cap with a laser, the introduction of the energy or heat occurring by adjusting the extension of the absorbing part and adjusting the absorption strength in the absorbing part to minimize stresses occurring in the substrate or cap.

First claim

What is claimed is:

1. A method for manufacturing a micromechanical component, which includes a substrate and a cap, which is connected to the substrate and which, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the method comprising:
forming, in a first task, an access opening connecting the first cavity to surroundings of the micromechanical component in the substrate or in the cap;
adjusting, in a second task, the first pressure and/or the first chemical composition in the first cavity; and
sealing, in a third task, the access opening by introducing energy or heat into an absorbing part of the substrate or the cap, with a laser;
wherein the introduction of the energy or heat takes place by adjusting an extension of the absorbing part and by adjusting the absorption strength in the absorbing part to minimize stresses occurring in the substrate or in the cap, and
wherein the adjustment of the extension of the absorbing part and the adjustment of the absorption strength in the absorbing part take place as a function of a temperature of the substrate or of the cap.

2. The method of claim 1 , wherein the adjustment of the extension of the absorbing part and the adjustment of the absorption strength in the absorbing part take place as a function of an applied laser wavelength of a laser beam.

3. The method of claim 1 , wherein the adjustment of the extension of the absorbing part and the adjustment of the absorption strength in the absorbing part take place as a function of a material of the substrate or of the cap.

4. The method of claim 1 , wherein the adjustment of the extension of the absorbing part and the adjustment of the absorption strength in the absorbing part take place as a function of a doping of the substrate or of the cap.

5. The method of claim 1 , wherein the adjustment of the extension of the absorbing part and the adjustment of the absorption strength in the absorbing part take place as a function of a layer and/or a structure in the substrate and/or on the substrate or in the cap and/or on the cap.

6. The method of claim 1 , wherein the adjustment of the extension of the absorbing part and the adjustment of the absorption strength in the absorbing part take place as a function of the layer and/or of the structure so that the layer and/or the structure is a deposited layer and/or structure.

7. The method of claim 1 , wherein the adjustment of the extension of the absorbing part and the adjustment of the absorption strength in the absorbing part take place as a function of the layer and/or of the structure so that the layer and/or the structure is a doped layer and/or structure.

8. A micromechanical component, comprising:
a substrate;
a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the substrate or the cap including a sealed access opening;
wherein the substrate or the cap includes a material area that solidifies and seals the access opening to minimize stresses occurring in the substrate or in the cap after an introduction of energy or heat into an absorbing part of the substrate or of the cap by adjusting the extension of the absorbing part and by adjusting the absorption strength in the absorbing part, and
wherein the adjustment of the extension of the absorbing part and the adjustment of the absorption strength in the absorbing part take place as a function of a temperature of the substrate or of the cap.

9. The micromechanical component of claim 8 , further comprising:
at least one of the following:
a material of the substrate or of the cap for introducing the energy or heat;
a doping of the substrate or of the cap for introducing the energy or heat; and
a layer and/or structure in the substrate and/or on the substrate or in the cap and/or on the cap for introducing the energy or heat.

Assignees

• Bosch Gmbh Robert

Inventors

• Ametowobla Mawuli
• Kappe Philip

Classifications

• B81B2201/0235

  Accelerometers · CPC title

• B81C1/00325 Primary

  for reducing stress inside of the package structure · CPC title

• B81C2203/0181

  Using microheaters for bonding the lid · CPC title

• B81C2203/0109

  Bonding an individual cap on the substrate · CPC title

• B81B7/02

  containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title