Piezoelectric microelectromechanical resonator device and corresponding manufacturing process
US-2024154599-A1 · May 9, 2024 · US
US8962069B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8962069-B2 |
| Application number | US-201213605019-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 6, 2012 |
| Priority date | Sep 8, 2011 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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A process for making an encapsulation structure comprising the following steps: 1) make at least one portion of material capable of releasing at least one gas when said material is heated, the portion of material communicating with the inside of a hermetically closed cavity of the encapsulation structure, 2) heat all or part of said portion of material such that at least part of the gas is released from said portion of material in the cavity, and in which said portion of material capable of releasing at least one gas when said material is heated comprises elements trapped in said portion of material, said trapped elements being released from said portion of material in gaseous form when said material is heated.
Opening claim text (preview).
The invention claimed is: 1. A process for making an encapsulation structure comprising at least the following steps: making a hermetically closed cavity having therein a first portion of material that contains at least one element trapped within said material, which is released as gas from said material when said material is heated; and heating all or part of said first portion of material such that at least part of the trapped element is released in gaseous form from said firs…
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