Integrated circuit device assembly

Patent metadata

Field	Value
Publication number	US-9913361-B2
Application number	US-201614989271-A
Country	US
Kind code	B2
Filing date	Jan 6, 2016
Priority date	Jan 6, 2016
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

First claim

The invention claimed is:

1. An assembly comprising:
a printed circuit board having an electronic component positioned thereon;
a load frame mounted onto the electronic component, the load frame having an open region onto which the electronic component extends;
a thermal interface material (TIM) disposed on the electronic component;
a heat sink in thermal contact with the electronic component through the TIM;
a first fastener configured to fasten the heat sink to the load frame and the printed circuit board, wherein fastening the first fastener creates a TIM bond line between the heat sink and the electronic component; and
a second fastener disposed within a bore of the heat sink and threaded into the load frame to fasten the heat sink to the load frame after the first fastener has been fastened, wherein the second fastener comprises a threaded fastener with a head, a first ring disposed on the threaded fastener below the head of the threaded fastener, and a second ring disposed below the first ring, wherein at least one of the first and second rings are configured to expand radially to lock the heat sink into the load frame in a direction generally parallel to the TIM bond line,
wherein the first fastener is removable to replace the component while the second fastener remains fastened.

2. The assembly of claim 1 , wherein the first fastener comprises a screw fastener which comprises a head, a shoulder portion, and a threaded portion.

3. The assembly of claim 2 , wherein the shoulder portion of the first fastener is positioned on the load frame.

4. The assembly of claim 2 , wherein the first fastener further comprises compression springs positioned between the head and the shoulder portion.

5. The assembly of claim 4 , wherein the first fastener further comprises wave springs located below the shoulder portion.

6. The assembly of claim 5 , wherein:
the compression springs are positioned between the head of the first fastener and the heat sink for the compression springs to be seated on the heat sink; and
the wave springs are positioned below a stiffener support of the printed circuit board.

7. An assembly comprising:
a field-replaceable unit (FRU) comprising an electronic component;
a printed circuit board having the FRU positioned thereon;
a load frame mounted onto the printed circuit board, the load frame having an open region onto which the FRU extends, exposing a surface of the FRU;
a thermal interface material (TIM) disposed on the FRU;
a heat sink in thermal contact with the FRU through the TIM;
a first fastener configured to fasten the heat sink to the load frame and the printed circuit board; and
a second fastener disposed within a bore of the heat sink and threaded into the load frame, the second fastener configured to fasten the heat sink to the load frame after the first fastener has been fastened, wherein the second fastener comprises a threaded fastener with a head, a first ring disposed on the threaded fastener below the head of the threaded fastener, and a second ring disposed below the first ring, wherein at least one of the first and second rings are configured to expand radially to lock the heat sink into the load frame in a direction generally parallel to a length of the printed circuit board,
wherein the first fastener is removable to replace the FRU while the second fastener remains fastened.

8. The assembly of claim 7 , wherein the first fastener comprises a screw fastener which comprises a head, a shoulder portion, and a threaded portion.

9. The assembly of claim 8 , wherein the shoulder portion of the first fastener is positioned on the load frame.

10. The assembly of claim 8 , wherein the first screw fastener includes compression springs located between the head and the shoulder portion.

11. The assembly of claim 10 , wherein the compression springs include conical springs.

12. The assembly of claim 7 , wherein the first fastener is seated on the load frame prior to being actuated.

13. The assembly of claim 7 , wherein the second fastener is configured to expand upon being tightened.

14. The assembly of claim 7 , wherein the first fastener radially locks the heat sink into the load frame.

15. The assembly of claim 1 , wherein the compression springs include conical springs.

16. The assembly of claim 1 , wherein the first fastener is seated on the load frame prior to being actuated.

17. The assembly of claim 4 , wherein the compression springs are positioned between the head of the first screw fastener and the heat sink for the compression springs to be seated on the heat sink.

Assignees

• IBM

Inventors

• Barron David
• Eagle Jason R
• Hamilton Roger D
• Hoffmeyer Mark K
• Mann Christopher W
• Richardson Matthew T

Classifications

• H05K7/2049

  Pressing means used to urge contact, e.g. springs · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H05K3/30

  Assembling printed circuits with electric components, e.g. with resistors · CPC title

• H05K1/181

  associated with surface mounted components · CPC title