Method and structure for receiving a micro device

Patent metadata

Field	Value
Publication number	US-9911722-B2
Application number	US-201715405042-A
Country	US
Kind code	B2
Filing date	Jan 12, 2017
Priority date	Jul 30, 2012
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

First claim

What is claimed is:

1. A display comprising:
a display substrate;
an array of bottom conductive layers on the display substrate;
an electrode line on the substrate;
a first passivation layer spanning across the display substrate and directly over the array of bottom conductive layers;
a corresponding array of integrated circuit (IC) devices bonded to the array of bottom conductive layers, and embedded within the first passivation layer;
wherein the first passivation layer laterally surrounds each IC device; and
a transparent top conductive layer spanning directly over the first passivation layer and the array of IC devices and in electrical contact with the electrode line.

2. The display of claim 1 , further comprising a second passivation layer over the display substrate and underneath the first passivation layer, wherein the second passivation layer includes an array of openings exposing the array of bottom conductive layers.

3. The display of claim 1 , further comprising a display driver IC coupled to the display substrate.

4. The display of claim 3 , wherein the display driver IC is a scan driver IC.

5. The display of claim 4 , wherein the array of bottom conductive layers is coupled to the scan driver IC.

6. The display of claim 3 , wherein the display driver IC is a data driver IC.

7. The display of claim 6 , wherein the electrode line is coupled to the data driver IC.

8. The display of claim 1 , wherein the array of IC devices is bonded to the array of bottom conductive layers with a corresponding array of bonding layers.

9. The display of claim 8 , wherein each bonding layer in the array of bonding layers is an alloy bonding layer.

10. The display of claim 1 , further comprising a black matrix layer over the transparent top conductive layer.

11. The display of claim 10 , further comprising a barrier layer between the black matrix layer and the transparent top conductive layer.

12. The display of claim 10 , further comprising a cover layer over the black matrix layer.

13. The display of claim 1 , further comprising an opening in the first passivation layer over the electrode line, wherein the transparent top conductive layer spans within the opening to contact the electrode line.

14. The display of claim 13 , wherein the first passivation layer is a thermoset material.

15. The display of claim 14 , wherein the first passivation is transparent.

16. The display of claim 14 , further comprising a second passivation layer over the display substrate and underneath the first passivation layer, wherein the second passivation layer includes an array of openings exposing the array of bottom conductive layers, wherein the second passivation layer is a thermoset material.

Assignees

• Apple Inc

Inventors

• Higginson John A
• Bibl Andreas
• Hu Hsin Hua

Classifications

• H10W74/01

  Manufacture or treatment · CPC title

• H10W74/137

  the encapsulations being directly on the semiconductor body (H10W74/134 takes precedence) · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H01L25/50

  Electricity · mapped topic

• H01L27/1262

  Electricity · mapped topic