Display apparatus
US-2024414942-A1 · Dec 12, 2024 · US
US9466621B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9466621-B2 |
| Application number | US-201414166257-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 28, 2014 |
| Priority date | Dec 16, 2010 |
| Publication date | Oct 11, 2016 |
| Grant date | Oct 11, 2016 |
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Disclosed is a method of forming array substrates having a peripheral wiring area and a display area. The method is processed by only three lithography processes with two multi-tone photomasks and one general photomask. In the peripheral wiring area, the top conductive line directly contacts the bottom conductive line without any other conductive layer. The conventional lift-off process is eliminated, thereby preventing a material (not dissolved by a stripper) from suspending in the stripper or remaining on the array substrate surface.
Opening claim text (preview).
What is claimed is: 1. An array substrate, comprising: a substrate; a first conductive layer disposed on the substrate, wherein the first conductive layer comprises a gate electrode in a display region and a bottom conductive line in a peripheral region; a second conductive layer disposed on the first conductive layer, wherein the second conductive layer comprises a source electrode and a drain electrode in the display region and a top conductive line in the peripheral region; an insulation layer disposed between the first conductive layer and the second conductive layer; and a semiconductor layer disposed between the second conductive layer and the insulation layer; wherein the top conductive line connects to the bottom conductive line through a first contact hole, wherein the source electrode, the drain electrode, and the top conductive line are composed of a same material. 2. The array substrate as claimed in claim 1 , wherein the second conductive layer is disposed on the bottom and the sidewall of the first contact hole. 3. The array substrate as claimed in claim 2 , wherein the second conductive layer disposed on the sidewall of the first contact hole contacts the insulation layer and the semiconductor layer. 4. The array substrate as claimed in claim 1 , wherein the first conductive layer comprises a bottom electrode in the display region, the second conductive layer comprises a top electrode in the display region, and the top electrode overlaps the bottom electrode. 5. The array substrate as claimed in claim 4 , wherein the insulation layer is disposed between the top electrode and the bottom electrode. 6. The array substrate as claimed in claim 5 , wherein the semiconductor layer is disposed between the top electrode and the insulation layer. 7. The array substrate as claimed in claim 1 , further comprising: a passivation layer disposed on the second conductive layer; and a pixel electrode disposed on the passivation layer; wherein the pixel electrode connects to the source electrode or the drain electrode through a second contact hole. 8. The array substrate as claimed in claim 7 , wherein the pixel electrode is disposed on the bottom and the sidewall of the second contact hole. 9. The array substrate as claimed in claim 8 , wherein the pixel electrode disposed on the sidewall of the second contact hole contacts the passivation layer. 10. The array substrate as claimed in claim 7 , wherein the first conductive layer comprises a bottom electrode in the display region, and the second conductive layer comprises a top electrode in the display region, and the top electrode overlaps the bottom electrode. 11. The array substrate as claimed in claim 10 , wherein the pixel electrode connects to the top electrode through a third contact hole. 12. The array substrate as claimed in claim 11 , wherein the pixel electrode is disposed on the bottom and the sidewall of the third contact hole. 13. The array substrate as claimed in claim 12 , wherein the pixel electrode disposed on the sidewall of the third contact hole contacts the passivation layer. 14. The array substrate as claimed in claim 1 , wherein a channel of the semiconductor layer is disposed between the gate electrode, the source electrode, and the drain electrode. 15. The array substrate as claimed in claim 14 , wherein the channel of the semiconductor layer comprises metal oxide. 16. The array substrate as claimed in claim 1 , wherein one of the first conductive layer and the second conductive layer comprises aluminum or copper. 17. The array substrate as claimed in claim 1 , wherein the first conductive layer comprises a gate line contacted to the gate electrode, and the second conductive layer comprises a data line contacted to one of the source electrode or the drain electrode.
Wiring, e.g. gate line, drain line · CPC title
integrated with passive devices, e.g. auxiliary capacitors · CPC title
using masks, e.g. half-tone masks · CPC title
Interconnections, e.g. scanning lines · CPC title
wherein the TFTs are in active matrices · CPC title
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