Semiconductor component, lighting device and method for producing a semiconductor component

Patent metadata

Field	Value
Publication number	US-9911719-B2
Application number	US-201515310428-A
Country	US
Kind code	B2
Filing date	Mar 31, 2015
Priority date	May 14, 2014
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

The invention relates to a semiconductor component ( 1 ) comprising: a plurality of semiconductor chips ( 2 ), each having a semiconductor layer sequence ( 200 ) with an active region ( 20 ) for generating radiation; a radiation output side ( 10 ) that runs parallel to the active regions ( 20 ); a mounting side surface ( 11 ) which is provided for securing the semiconductor component, and which runs in a transverse or perpendicular direction to the radiation output side; a molded body ( 4 ) which is shaped in places on the semiconductor chips, and which at least partially forms the mounting side surface; and a contact structure ( 50 ) which is arranged on the molded body, and which connects at least two semiconductor chips of the plurality of semiconductor chips in an electrically conductive manner. The invention also relates to a lighting device ( 9 ) and to a method for producing a semiconductor component.

First claim

The invention claimed is:

1. A semiconductor component comprising:
a plurality of semiconductor chips each comprising a semiconductor layer sequence having an active region for the generation of radiation;
a radiation output side which runs parallel to the active regions;
a mounting side surface which is provided for fastening the semiconductor component and runs inclined or perpendicular to the radiation output side;
a molded body which is formed in places to the semiconductor chips and which at least sectionally forms the mounting side surface; and
a contact structure which is arranged on the molded body and which electrically conductively connects at least two semiconductor chips of the plurality of semiconductor chips,
wherein the semiconductor component has a rectangular basic shape with at least one indentation in a plan view of the radiation output side, wherein the contact structure at least sectionally covers a side surface of the indentation.

2. A semiconductor component according to claim 1 , wherein the contact structure comprises a first contact surface and a second contact surface for the external electric contacting of the semiconductor component and the contact surfaces are accessible on the radiation output side and/or on the mounting side surface.

3. A semiconductor component according to claim 1 , wherein the semiconductor component comprises a plurality of indentations and at least one said indentations is arranged between two neighboring semiconductor chips.

4. A semiconductor component according to claim 3 , wherein the semiconductor chips of the semiconductor component which are provided for the generation of radiation are divided in at least two groups, wherein the groups can be externally electrically contacted independently from one another by means of the contact structure arranged in the indentations.

5. A semiconductor component comprising:
a plurality of semiconductor chips each comprising a semiconductor layer sequence having an active region for the generation of radiation;
a radiation output side which runs parallel to the active regions;
a mounting side surface which is provided for fastening the semiconductor component and runs inclined or perpendicular to the radiation output side;
a molded body which is formed in places to the semiconductor chips and which at least sectionally forms the mounting side surface; and
a contact structure which is arranged on the molded body and which electrically conductively connects at least two semiconductor chips of the plurality of semiconductor chips,
wherein the semiconductor component comprises an insulation layer between the molded body and the contact structure, the insulation layer sectionally covering the molded body and sectionally covering at least one of the semiconductor chips provided for the generation of radiation in a plan view of the radiation output side.

6. A method for producing a semiconductor component comprising the steps:
a) providing a plurality of semiconductor chips which each comprise a semiconductor layer sequence with an active region provided for the generation of radiation;
b) sectionally overmolding the semiconductor chips with a molding material for the formation of a molded body composite;
c) forming a structured coating on the molding material composite for the electric contacting of the semiconductor chips; and
d) singulizing the molded body composite into a plurality of semiconductor components which each comprise a plurality of semiconductor chips, wherein in each case at least two of the semiconductor chips of a semiconductor component are electrically conductively connected to one another by means of a contact structure formed by the structured coating and a side surface of the singulized molded bodies that develops during the singulation process forms a mounting side surface of the semiconductor component,
wherein the molded body composite comprises a recess at least between two neighboring semiconductor chips prior to step c), which recess is provided with the coating.

7. A method according to claim 6 , wherein prior to step b) electrically conductive volume contact bodies are provided, to which the molded body composite is formed in step b) and which are electrically conductively connected to at least one of the semiconductor chips via the structured coating in step c).

8. A semiconductor component, comprising:
a plurality of semiconductor chips each comprising a semiconductor layer sequence having an active region for the generation of radiation;
a radiation output side which runs parallel to the active regions;
a mounting side surface which is provided for fastening the semiconductor component and runs inclined or perpendicular to the radiation output side;
a molded body which is formed in places to the semiconductor chips and which at least sectionally forms the mounting side surface; and
a contact structure which is arranged on the molded body and which electrically conductively connects at least two semiconductor chips of the plurality of semiconductor chips;

wherein the contact structure comprises a first contact surface and a second contact surface for the external electric contacting of the semiconductor component and the contact surfaces are accessible on the mounting side surface.

9. A semiconductor component according to claim 8 , wherein all semiconductor chips of the semiconductor component that are provided for the generation of radiation are arranged next to one another along a longitudinal direction running parallel to the radiation output side.

10. A semiconductor component according to claim 8 , wherein the molded body at least sectionally covers in each case a rear side of the semiconductor chips facing away from the radiation output side.

11. A semiconductor component according to claim 8 , wherein the semiconductor chips each comprise a first contact and a second contact which face the radiation output side and which are electrically conductively connected to the contact structure.

12. A semiconductor component according to claim 8 , wherein the semiconductor component comprises at least one electronic component which is electrically conductively connected to the contact structure and which can be externally electrically contacted via the first contact surface and the second contact surface.

13. A semiconductor component according to claim 8 , wherein the semiconductor component extends in between a first end face and a second end face in a plan view of the radiation output side, wherein the first contact surface is arranged in a first end region adjacent to the first end face and the second contact surface is arranged in a second end region of the semiconductor component adjacent to the second end face.

14. A semiconductor component according to claim 8 , wherein the semiconductor component extends between a first end face and a second end face in a plan view of the radiation output side, wherein the first contact surface and the second contact surface are arranged in a first end region of the semiconductor component adjacent to the first end face.

15. A semiconductor component according to claim 8 , wherein the semiconductor component comprises at least one electrically conductive volume contact body to which the molded body is formed and which is electrically conductively connected to the semiconductor chips.

16. A semiconductor component according to claim 8 , wherein the semiconductor component comprises a plurality of segments with severing spots arranged therebetween, so that the segments are electrically conductively connected to one

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Schwarz Thomas
• Singer Frank
• Moosburger Juergen
• Bogner Georg
• Brunner Herbert
• Sabathil Matthias
• Von Malm Norwin

Classifications

• H10W90/10

  Configurations of laterally-adjacent chips · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H01L25/0753 Primary

  Electricity · mapped topic