Self-contained metrology wafer carrier systems

Patent metadata

Field	Value
Publication number	US-9911634-B2
Application number	US-201615193502-A
Country	US
Kind code	B2
Filing date	Jun 27, 2016
Priority date	Jun 27, 2016
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

A self-contained metrology wafer carrier systems and methods of measuring one or more characteristics of semiconductor wafers are provided. A wafer carrier system includes, for instance, a housing configured for transport within the automated material handling system, the housing having a support configured to support a semiconductor wafer in the housing, and a metrology system disposed within the housing, the metrology system operable to measure at least one characteristic of the wafer, the metrology system comprising a sensing unit and a computing unit operably connected to the sensing unit. Also provided are methods of measuring one or more characteristics of a semiconductor wafer within the wafer carrier systems of the present disclosure.

First claim

The invention claimed is:

1. A semiconductor wafer carrier system transportable by an automated material handling system to a plurality of stations, the semiconductor wafer carrier system comprising:
a housing configured and engageable with the automated material handling system for transport within the automated material handling system to the plurality of stations, the housing having a support configured to support a semiconductor wafer in the housing; and
a metrology system disposed within the housing, the metrology system operable to measure at least one characteristic of the wafer, the metrology system comprising:
a sensing unit disposed within the housing; and
a computing unit operably connected to the sensing unit.

2. The system of claim 1 further comprising:
a power source for powering the sensing unit and the computing unit.

3. The system of claim 2 , wherein the power source comprises a battery.

4. The system of claim 1 further comprising a network adaptor operably connected to the computing unit within the housing.

5. The system of claim 1 further comprising a wireless transmitter for transmitting the at least one characteristic of the wafer to a communication network.

6. The system of claim 1 further comprising an enclosure disposed within the housing, wherein at least a portion of the metrology system is secured to the enclosure.

7. The system of claim 1 , wherein the at least one characteristic measured is one or more of film thickness, film temperature, distribution of heat on the wafer, film composition, electrical conductivity, film optical constants, surface roughness, wafer topography, wafer bow, defects on the wafer surface, number of particles on the wafer surface, and reflectivity of the surface of the wafer.

8. The system of claim 1 , wherein the sensing unit is one or more of an ellipsometer, a reflectomer, and a pyrometer.

9. The system of claim 1 , wherein the sensing unit comprises at least one probe operably connected to the computing unit, and wherein the at least one probe is for use in measuring at least one characteristic of the wafer.

10. The system of claim 1 , wherein the sensing unit comprises:
a multiplexer operably connected to the computing unit; and
a plurality of probes operably connected to the multiplexer, and
wherein the plurality of probes are operable for use in measuring at least one characteristic of the wafer.

11. The system of claim 1 , wherein the sensing unit comprises:
an emitting portion comprising:
a laser;
a polarizer operably connected to the laser; and
a focuser operably connected to the polarizer; and

a collecting portion comprising:
a detector;
an analyzer operably connected to the detector; and
a lens collector operably connected to the analyzer; and

wherein the focuser and the lens collector are operable for use in measuring a portion of the wafer.

12. The system of claim 1 , wherein the sensing unit comprises:
an emitting portion;
a collecting portion; and
a multiplexer operably connected to the emitting portion and the collecting portion, for use in measuring at least one characteristic of the wafer on a portion of the wafer.

13. The system of claim 12 , wherein the emitting portion comprises:
a laser; and
a polarizer operably connected to the laser; and
the collecting portion comprises:
a detector; and
an analyzer operably connected to the detector; and

wherein the multiplexer is operably connected to the polarizer and the analyzer, the multiplexer having a plurality of focusers and lens collectors, and
wherein each focuser and lens collector are operable for use in measuring at least one characteristic of the wafer.

14. The system of claim 1 , wherein the housing comprises a front door.

15. A method comprising:
providing a wafer carrier system of claim 1 ;
placing a wafer in the wafer carrier system; and
measuring one or more characteristics of the wafer.

16. The method of claim 15 further comprising:
transmitting the measured one or more characteristics of the wafer to a remote computer.

17. The method of claim 16 , wherein the measured one or more characteristics of the wafer is wirelessly transmitted.

18. A method comprising:
providing a wafer in a housing of a wafer carrier system transportable by an automated material handling system to a plurality of stations;
determining in the wafer carrier system a measurement of at least one characteristic of the wafer; and
transmitting the determined measurement of at least one characteristic of the wafer from the wafer carrier system to a remote location.

19. The method of claim 18 , wherein determining a measurement occurs at a processing station, during transport between stations, during transport between a station and a storage unit, and/or while in a storage unit.

20. The method of claim 18 , wherein the measured at least one characteristic of the wafer is transmitted wirelessly to a remote location.

Assignees

• Globalfoundries Inc

Inventors

• Bello Abner
• Waite Stephanie
• Fosnight William J
• Beeg Thomas

Classifications

• H10P72/3304

  characterised by movements or sequence of movements of transfer devices · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/20

  characterised by the properties tested or measured, e.g. structural or electrical properties · CPC title

• H10P72/1922

  characterised by the construction of the closed carrier · CPC title

• H10P72/1902

  specially adapted for a single substrate · CPC title