Infrared thermal sensor with beam without thermocouple

Patent metadata

Field	Value
Publication number	US-9909924-B2
Application number	US-201415107065-A
Country	US
Kind code	B2
Filing date	Dec 13, 2014
Priority date	Dec 22, 2013
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

An infrared thermal sensor for sensing infrared radiation is disclosed. The infrared thermal sensor comprises a substrate and a cap structure together forming a sealed cavity, a membrane arranged in said cavity for receiving infrared radiation (IR) through a window or aperture and a plurality of beams for suspending the membrane. At least one beam has a thermocouple arranged therein or thereon for measuring a temperature difference (ΔT) between the membrane and the substrate, the plurality of beams. Furthermore at least one beam is mechanically supporting the membrane without a thermocouple being present therein or thereon.

First claim

The invention claimed is:

1. An infrared thermal sensor for sensing infrared radiation, the infrared thermal sensor comprising
a substrate and a cap structure together forming a sealed cavity;
a membrane arranged in said cavity for receiving infrared radiation (IR) through a window or aperture;
a plurality of beams configured for suspending the membrane comprising at least one beam having a thermocouple arranged therein or thereon for measuring a temperature difference (ΔT) between the membrane and the substrate, the plurality of beams furthermore comprising at least one beam mechanically supporting the membrane without a thermocouple being present therein or thereon.

2. The infrared thermal sensor according to claim 1 , wherein the filling factor of the membrane in the cavity is less than 50%.

3. The infrared thermal sensor according to claim 1 , wherein the pressure in the cavity is less than 10 Pa.

4. The infrared thermal sensor according to claim 1 , wherein the beams in the plurality of beams are selected so that a ratio of the thermal resistance between the membrane and the substrate via radiation and convection and conduction through the gas medium in the cavity and through the part of the beam other than through the thermocouples, and the combined thermal resistance between the membrane and the substrate through the thermocouples via conduction is a value in the range of 0.9 to 1.1.

5. The infrared thermal sensor according to claim 1 , wherein the membrane is substantially circular in cross section in a plane parallel with the substrate.

6. The infrared thermal sensor according to claim 1 , wherein the cavity has a substantially polygonal cross section with n corners in a plane parallel with the substrate.

7. The infrared thermal sensor according to claim 6 , wherein the polygonal is a rectangle.

8. The infrared thermal sensor according to claim 1 ,
wherein the number of beams is three;
and wherein two beams comprise a thermocouple and one beam does not comprise a thermocouple, or one beam comprises a thermocouple and two beams do not comprise a thermocouple.

9. The infrared thermal sensor according to claim 1 ,
wherein the number of beams is four;
and wherein three beams comprise a thermocouple and one beam does not comprise a thermocouple, or two beams comprise a thermocouple and two beams do not comprise a thermocouple, or one beam comprises a thermocouple and three beams do not comprise a thermocouple.

10. The infrared thermal sensor according to claim 1 , wherein all the thermocouples are connected in series for providing a combined voltage signal indicative for the effect of the infrared radiation.

11. The infrared thermal sensor according to claim 1 , comprising at least two thermocouples, and wherein the two thermocouples are connected in anti-series for allowing determination of the zero-offset.

12. The infrared thermal sensor according to claim 1 , wherein each thermocouple consists of an n type poly-silicon resistor in combination with a p type poly-silicon resistor, placed on top of each other.

13. A sensor system comprising at least one infrared thermal sensor according to claim 1 .

14. A method for sensing infrared radiation comprising utilizing an infrared thermal sensor according to claim 1 .

Assignees

• Melexis Technologies Nv

Inventors

• Maes Ben
• Van Buggenhout Carl
• Van Der Wiel Appolonius Jacobus

Classifications

• G01J5/023 Primary

  Particular leg structure or construction or shape; Nanotubes · CPC title

• G01J5/12

  using thermoelectric elements, e.g. thermocouples · CPC title

• G01J5/16

  Arrangements with respect to the cold junction; Compensating influence of ambient temperature or other variables · CPC title

• G01J5/0225

  Shape of the cavity itself or of elements contained in or suspended over the cavity · CPC title

• G01J5/14

  Electrical features thereof · CPC title