Inertial and pressure sensors on single chip

Patent metadata

Field	Value
Publication number	US-9908771-B2
Application number	US-201414504545-A
Country	US
Kind code	B2
Filing date	Oct 2, 2014
Priority date	Oct 3, 2013
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

In accordance with one embodiment, a single chip combination inertial and pressure sensor device includes a substrate, an inertial sensor including a movable sensing structure movably supported above the substrate, and a first fixed electrode positioned adjacent to the movable sensing structure, and a pressure sensor including a gap formed in the sensor at a location directly above the movable sensing structure, and a flexible membrane formed in a cap layer of the device, the flexible membrane defining a boundary of the gap and configured to flex toward and away from the gap in response to a variation in pressure above the flexible membrane.

First claim

The invention claimed is:

1. A single chip combination inertial and pressure sensor device, comprising:
a substrate;
an inertial sensor including a movable sensing structure movably supported above the substrate, and a first fixed electrode positioned adjacent to the movable sensing structure;
a pressure sensor including a gap formed in the pressure sensor at a location directly above the movable sensing structure, and a flexible membrane formed in a cap layer of the device, the flexible membrane defining a boundary of the gap and configured to flex toward and away from the gap in response to a variation in pressure above the flexible membrane; and
a support post extending from the substrate to the cap layer through a hole in the movable sensing structure.

2. A single chip combination inertial and pressure sensor device, comprising:
a substrate;
an inertial sensor including a movable sensing structure movably supported above the substrate, and a first fixed electrode positioned adjacent to the movable sensing structure; and
a pressure sensor including a gap formed in the pressure sensor at a location directly above the movable sensing structure, and a flexible membrane formed in a cap layer of the device, the flexible membrane defining a boundary of the gap and configured to flex toward and away from the gap in response to a variation in pressure above the flexible membrane, wherein:
the first fixed electrode is located in the substrate directly beneath the movable sensing structure; and
the movable sensing structure is configured as an electrode in the pressure sensor.

3. The device of claim 2 , wherein the movable sensing structure is formed in a device layer, the device further comprising:
a second fixed electrode formed in the device layer at a first location adjacent to the movable sensing structure; and
a third fixed electrode formed in the device layer at a second location adjacent to the movable sensing structure.

4. The device of claim 3 , wherein:
the flexible membrane is configured as a movable electrode.

5. The device of claim 4 , further comprising:
a first connector extending between the first fixed electrode and an upper surface of the cap layer; and
a nitride spacer within the cap layer, the nitride spacer electrically isolating the first connecter within the cap layer.

6. The device of claim 5 , wherein:
the first connector extends through a first buried oxide layer located between the substrate and the device layer; and
the first connector extends through a second buried oxide layer located between the device layer and the cap layer.

7. The device of claim 6 , further comprising:
a second connector extending from the second fixed electrode to the upper surface of the cap layer, wherein the nitride spacer includes a first side portion in direct contact with the first connector and a second side portion in direct contact with the second connector.

8. The device of claim 7 , further comprising:
a piezoresistive element attached to the flexible membrane.

9. The device of claim 3 , wherein:
a fourth fixed electrode is defined in the cap layer at a location directly between the movable sensing structure and the flexible membrane;
the flexible membrane is configured as a movable electrode;
the support post extends into the cap layer; and
the support post is electrically isolated from the fourth fixed electrode by a non-conductive cap.

10. The device of claim 9 , further comprising:
a first connector extending between the first fixed electrode and an upper surface of the cap layer; and
a nitride spacer within the cap layer, the nitride spacer electrically isolating the first connecter within the cap layer.

11. The device of claim 10 , wherein:
the first connector extends through a first buried oxide layer located between the substrate and the device layer; and
the first connector extends through a second buried oxide layer located between the device layer and the cap layer.

12. The device of claim 11 , further comprising:
a second connector extending from the second fixed electrode to the upper surface of the cap layer, wherein the nitride spacer includes a first side portion in direct contact with the first connector and a second side portion in direct contact with the second connector.

13. The device of claim 2 , further comprising:
a piezoresistive element attached to the flexible membrane.

14. A single chip stacked inertial and pressure sensor device, comprising:
a substrate;
an inertial sensor including a movable sensing structure movably supported above the substrate, and a first and second fixed electrodes positioned adjacent to the movable sensing structure; and
a pressure sensor including a gap formed in the pressure sensor at a location adjacent to the movable sensing structure, and a flexible membrane formed in a cap layer of the device, the flexible membrane defining a boundary of the gap and configured to flex toward and away from the gap in response to a variation in pressure above the flexible membrane;
wherein one of the first or second fixed electrodes is located in the substrate beneath the movable sensing structure and the movable sensing structure is configured as an electrode in the pressure sensor.

15. The device of claim 14 , wherein:
the flexible membrane is configured as a movable electrode.

16. The device of claim 14 , further comprising:
a first connector extending between the first fixed electrode and an upper surface of the cap layer; and
a nitride spacer within the cap layer, the nitride spacer electrically isolating the first connecter within the cap layer.

17. The device of claim 16 , wherein:
the first connector extends through a first buried oxide layer located between the substrate and the device layer; and
the first connector extends through a second buried oxide layer located between the device layer and the cap layer.

18. The device of claim 17 , further comprising:
a second connector extending from the second fixed electrode to the upper surface of the cap layer, wherein the nitride spacer includes a first side portion in direct contact with the first connector and a second side portion in direct contact with the second connector.

19. The device of claim 14 , further comprising:
a piezoresistive element attached to the flexible membrane.

Assignees

• Bosch Gmbh Robert

Inventors

• Feyh Ando
• Obrien Gary

Classifications

• G01P15/0802

  Details · CPC title

• B81B2201/025

  Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242 · CPC title

• G01L19/12

  Alarms or signals · CPC title

• B81B2201/0264

  Pressure sensors · CPC title

• G01P15/125

  by capacitive pick-up · CPC title