Power electronic subassembly with capacitor

Patent metadata

Field	Value
Publication number	US-9907215-B2
Application number	US-201615243168-A
Country	US
Kind code	B2
Filing date	Aug 22, 2016
Priority date	Aug 21, 2015
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

A power electronic subassembly having a housing and a capacitor arranged therein. The housing has an internally arranged cooling area, which is cooled by a cooling device integrated in the housing or an external cooling device. The capacitor has a contact device of a first polarity and a contact device of a second polarity and a capacitor busbar system. This capacitor busbar system comprises first and second sheet-like shaped metal bodies. The first metal body with the first contact device of the first polarity and the second metal body with the second contact device of the second polarity are electrically conductively connected. A first portion of the first metal body has a first subportion, which is arranged parallel to and at a distance from the cooling area, and a second subportion, which is in thermal contact with the cooling area, wherein the two subportions are connected by an intermediate portion.

First claim

What is claimed is:

1. A power electronic subassembly comprising:
a housing having an internally arranged cooling area, said cooling area being configured so that it can be cooled by a cooling device integrated into said housing; and
a capacitor device arranged in said housing, said capacitor device having a capacitor with a first contact device of a first polarity, a second contact device of a second polarity and a capacitor busbar system, said capacitor busbar system including a first sheet-like shaped metal body and a second sheet-like shaped metal body;
wherein said first and second sheet-like shaped metal bodies are connected in an electrically conducting manner and are arranged closely adjacent to one another over at least about 80% of their two-dimensional extent, and
wherein a first portion of said first shaped metal body has
a first subportion which is arranged parallel to and at a distance from said cooling area, and
a second subportion, which is in thermal contact with said cooling area, and which is connected to said first subportion by an intermediate portion.

2. The subassembly of claim 1 , further comprising an insulation film is disposed in between said first and second shaped metal bodies.

3. The subassembly of claim 1 ,
wherein said first portion has a meandering cross section; and
wherein said second subportion forms a U-shaped web with said adjacent intermediate portion.

4. The subassembly of claim 1 , wherein said second subportion forms a cup-shaped boss with an adjacent intermediate portion.

5. The subassembly of claim 1 , wherein said second subportion is in indirect thermal contact with said cooling area.

6. The subassembly of claim 5 , wherein an electrically insulating insulation device is arranged between said second subportion and said cooling area.

7. The subassembly of claim 6 , wherein said electrically insulating insulation device is a plastic film.

8. The subassembly of claim 6 , wherein said electrically insulating insulation device is an insulating ceramic layer.

9. The subassembly of claim 1 , wherein said capacitor is arranged on a side of said capacitor busbar system that is facing away from said cooling area.

10. The subassembly of claim 1 , wherein said second shaped metal body includes a first portion which is arranged substantially parallel to said first portion of said first shaped metal body, and has clearances for leading through said first contact devices.

11. The subassembly of claim 1 , wherein said first shaped metal body has at least one cutaway contact tab near said first subportion for electrical connection to one of said first and second contact devices.

12. The subassembly of claim 11 , wherein said electrical connection of said contact devices and said contact tabs is via material-bonding.

13. The subassembly of claim 1 , further comprising a power semiconductor module arranged in said housing, said power semiconductor module being connected polarity-appropriately to module connections of said capacitor busbar system.

14. The subassembly of claim 1 ,
wherein said housing has a cup-like depression having a bottom which forms said cooling area; and
wherein said capacitor is arranged in said depression.

15. The subassembly of claim 14 , wherein said depression is filled with an electrically insulating potting compound.

16. The subassembly of claim 1 , wherein said first and second sheet-like shaped metal bodies are arranged closely adjacent to one another over at least about 90% of their two-dimensional extent.

Assignees

• Semikron Elektronik Gmbh & Co Kg
• Semikron Gmbh & Co Kg

Inventors

• Backhaus Klaus
• Bittner Roland
• Lederer Marco
• Popp Rainer

Classifications

• H10W76/10

  Containers or parts thereof · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/43

  by flowing gases, e.g. forced air cooling · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H05K7/20

  Modifications to facilitate cooling, ventilating, or heating · CPC title