Electric power converter

Patent metadata

Field	Value
Publication number	US-2016157381-A1
Application number	US-201514919161-A
Country	US
Kind code	A1
Filing date	Oct 21, 2015
Priority date	Oct 21, 2014
Publication date	Jun 2, 2016
Grant date	—

Abstract

An electric power converter includes a semiconductor module constituting a power conversion circuit, a capacitor electrically connected to the semiconductor module, and a cooling member for cooling the capacitor. The capacitor includes an element body provided with internal electrode, and a pair of end-face-electrodes provided on both end faces of the element body and connected to the internal electrode. The pair of end-face-electrodes are connected with a pair of bus bars, respectively, in a manner of surface contact. The capacitor is disposed in a state where one of the pair of end-face-electrodes is facing the cooling member. The end-face-electrode facing the cooling member is in contact with the cooling member via the bus bar.

First claim

What is claimed is:

1 . An electric power converter comprising:
semiconductor module constituting an electric power conversion circuit; a capacitor electrically connected to the semiconductor module; and a cooling member for cooling the capacitor; wherein, the capacitor includes an element body provided with internal electrode, and a pair of end-face-electrodes provided on both end faces of the element body and connected to the internal electrode; the pair of end-face-electrodes are connected with a pair of bus bars, respectively, in a manner of surface contact. the capacitor is disposed in a state where at least one of the pair of end-face-electrodes is facing the cooling member; and the end-face-electrode facing the cooling member is in contact with the cooling member via the bus bar.

2 . The electric power converter according to claim 1 , wherein,
amounts of heat of the pair of end-face-electrodes received from the semiconductor module are different from each other, and an end-face-electrode that receives a large heat amount faces the cooling member.

3 . The electric power converter according to claim 1 , wherein,
one of the end-face-electrodes faces the cooling member, and both of the pair of bus bars connected to the pair of end-face-electrodes are in contact with the cooling member.

4 . The electric power converter according to claim 1 , wherein,
the cooling member faces both of the pair of end-face-electrodes, while each of the pair of end-face-electrode is in contact with the cooling member via the bus bar 5 .

5 . The electric power converter according to claim 1 , wherein,
there is provided a body pressing member for pressing the capacitor to the cooling member.

6 . The electric power converter according to claim 1 , wherein
the bus bars have extended portions that extend in a direction perpendicular to an aligning direction of the pair of end-face-electrodes; the extended portions are interposed between the cooling member and the semiconductor modules; and the extended portions are provided with terminal pressing members for pressing the extension portions against the cooling member by pressing the semiconductor modules towards the cooling member.

7 . The electric power converter according to claim 1 , wherein,
the entire surfaces of the pair of end-face-electrodes opposite to the element body are connected to the bus bars, respectively.

8 . The electric power converter according to claim 1 , wherein
a dimension of the element body in an aligning direction of the pair of end-face electrodes is smaller than a maximum dimension among external dimensions of the element body in a direction perpendicular to the aligning direction.

Assignees

• Denso Corp

Inventors

• Takeuchi Kazuya
• Okamura Makoto
• Handa Yuuichi
• Hirasawa Naoki
• Ichijo Hiromi
• Tanabe Ryota
• Matsuoka Tetsuya

Classifications

• H10W40/611

  Bolts or screws · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/205 Primary

  Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201) · CPC title

• H02M7/003

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

• H05K7/20436

  Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title