Electronic module

Patent metadata

Field	Value
Publication number	US-9907181-B2
Application number	US-201414909180-A
Country	US
Kind code	B2
Filing date	Jul 3, 2014
Priority date	Jul 30, 2013
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die is at least partially embedded within the multilayer circuit board. The Peltier heat pump device has at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, and the at least one pair of semiconductor members are at least partially embedded in the circuit board.

First claim

The invention claimed is:

1. An electronic module for automotive applications, comprising:
a multilayer circuit board;
an electronic component mounted on a major surface of the multilayer circuit board and electrically coupled to at least one memory die, each of the at least one memory die being at least partially embedded within the multilayer circuit board; and
at least one Peltier heat pump device, each of the at least one Peltier heat pump device including at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, each of the at least one pair of semiconductor members being at least partially embedded in the circuit board and disposed at least in part between the electronic component and one or more of the at least one memory die.

2. The electronic module of claim 1 , wherein each of the at least one memory die is arranged at least partially beneath the electronic component.

3. The electronic module of claim 1 , wherein the multilayer circuit board comprises a plurality of insulation layers, and a plurality of conductive layers comprising electrically conductive traces.

4. The electronic module of claim 3 , wherein the multilayer circuit board further comprises at least one electrically conductive via, each of the at least one electrically conductive via extending through at least one insulation layer of the plurality of insulation layers.

5. The electronic module of claim 3 , wherein each of the at least one memory die is coupled to the electronic component by the plurality of electrically conductive traces arranged in at least one of the conductive layers of the multilayer circuit board and at least one electrically conductive via extending through at least one insulation layer of the plurality of insulation layers.

6. The electronic module of claim 3 , further comprising a cavity arranged in an insulation layer of the plurality of insulation layers, each of the at least one memory die being mounted in the cavity.

7. The electronic module of claim 6 , further comprising an encapsulant arranged in the cavity, the encapsulant covering at least side faces of each of the at least one memory die.

8. The electronic module of claim 1 , wherein the at least one pair of thermoelectric semiconductor members is at least two pairs of thermoelectric semiconductor members, each of the at least two pairs of thermoelectric semiconductor members comprises at least one first heater/cooler element and at least one second heater/cooler element, each of the at least two pairs of thermoelectric semiconductor members extending between a common one of the first heater/cooler element and a different one of the second heater/cooler element.

9. The electronic module of claim 8 , wherein the common one of the first heater/cooler element is arranged laterally adjacent to the different one of the second heater/cooler element.

10. The electronic module of claim 1 , wherein each of the at least one pair of semiconductor members is coplanar and arranged within the multilayer circuit board.

11. The electronic module of claim 1 , wherein each of the at least one pair of semiconductor members extends between at least one first heater/cooler element and at least one second heater/cooler element, each of the at least one first heater/cooler element and each of the at least one second heater/cooler element are co-planar and spaced apart from one another.

12. The electronic module of claim 1 , wherein each of the at least one pair of thermoelectric semiconductor members comprises at least one of the following:
a first heater/cooler element embedded within the multilayer circuit board from which a plurality of thermally conductive vias extends to the electronic component that should be cooled and/or heated, or
a second heater/cooler element embedded within the multilayer circuit board from which a plurality of thermally conductive vias extend to an outer surface of the multilayer circuit board.

13. The electronic module of claim 1 , wherein the electronic component comprises a system-on-chip architecture, and the memory die is a double data rate random access memory type memory chip.

14. The electronic module of claim 1 , wherein the electronic component includes one of a system-on-chip architecture (SoC), a processor, a freely programmable gate array (FPGA), and an application-specific integrated circuit (ASIC).

15. An electronic module for automotive applications, comprising:
an electronic component mounted on a multilayer circuit board and electrically coupled to at least one memory die, each of the at least one memory die being at least partially embedded within the multilayer circuit board; and
at least one Peltier heat pump device, each of the at least one Peltier heat pump device including at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, each of the at least one pair of semiconductor members being at least partially embedded within the multilayer circuit board and disposed at least in part between the electronic component and one or more of the at least one memory die.

16. The electronic module of claim 15 , wherein each of the at least one memory die is arranged at least partially beneath the electronic component.

17. The electronic module of claim 15 , wherein the multilayer circuit board comprises a plurality of insulation layers, and a plurality of conductive layers comprising electrically conductive traces.

18. The electronic module of claim 17 , wherein the multilayer circuit board further comprising at least one electrically conductive via, each of the at least one electrically conductive via extending through at least one insulation layer of the plurality of insulation layers.

19. The electronic module of claim 17 , wherein each of the at least one memory die is coupled to the electronic component by the plurality of electrically conductive traces arranged in at least one of the conductive layers of the multilayer circuit board and at least one electrically conductive via extending through at least one insulation layer of the plurality of insulation layers.

20. An electronic module for automotive applications, comprising:
a multilayer circuit board;
an electronic component mounted on the multilayer circuit board and electrically coupled to at least one memory die, the at least one memory die being at least partially embedded within the multilayer circuit board; and
at least one heat pump device, each of at least one heat pump device including at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, each of the at least one pair of semiconductor members being at least partially embedded within the multilayer circuit board and disposed at least in part between the electronic component and one or more of the at least one memory die.

Assignees

• Harman Becker Automotive Systems Gmbh

Inventors

• Kraft Guenther
• Orcic Krunoslac
• Berthomier Didier
• Schiemann Thomas
• Noshadi Valod

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title

• H10W90/00

  Package configurations · CPC title