Thermoelectric cooler/heater integrated in printed circuit board

Patent metadata

Field	Value
Publication number	US-9516790-B2
Application number	US-201414247870-A
Country	US
Kind code	B2
Filing date	Apr 8, 2014
Priority date	Apr 9, 2013
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A circuit board is provided that includes at least one Peltier heat pump device with at least one pair of semiconductor members arranged thermally in parallel and electrically in series. The at least one pair of semiconductor members is at least partially embedded in the circuit board.

First claim

What is claimed is:

1. A circuit board, comprising at least one Peltier heat pump device, the Peltier heat pump device comprising at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, the at least one pair of thermoelectric semiconductor members being at least partially embedded in the circuit board.

2. The circuit board of claim 1 , wherein the Peltier heat pump device further comprises at least one first cooler/heater surface and at least one second heater/cooler surface, each pair of thermoelectric semiconductor members extending between a common first cooler/heater surface and a different second heater/cooler surface.

3. The circuit board of claim 2 , wherein at least one of the at least one of first cooler/heater surface and the at least one of the second heater/cooler surface is at least partially embedded in the circuit board.

4. The circuit board of claim 2 , wherein the first cooler/heater surface is arranged laterally adjacent the at least one second heater/cooler surface.

5. The circuit board of claim 1 , wherein the Peltier heat pump device further comprises at least one first cooler/heater surface and at least one second heater/cooler surface, the at least one first cooler/heater surface, and wherein the at least one second heater/cooler surface, and the at least one pair of thermoelectric semiconductor members are generally coplanar and arranged within the circuit board.

6. The circuit board of claim 1 , wherein each pair of thermoelectric semiconductor members comprises a first semiconductor member of a first conductivity type and a second semiconductor member of a second conductivity type which opposes the first conductivity type.

7. The circuit board of claim 6 , wherein a first metallic electrode extends between the first semiconductor member and the second semiconductor member and provides one of a cooler surface and a heater surface.

8. The circuit board of claim 6 , wherein adjacent pairs of thermoelectric semiconductor members are electrically connected to one another by a second metallic electrode which extends between semiconductor members of differing conductivity type of adjacent pairs of thermoelectric semiconductor elements.

9. The circuit board of claim 8 , wherein the second metallic electrode extends laterally from the semiconductor members and provides a heat dissipation surface.

10. The circuit board of claim 6 , wherein the first thermoelectric member is arranged above the second thermoelectric member and is electrically connected to the second thermoelectric member by at least one via.

11. The circuit board of claim 1 , wherein the Peltier heat pump device further comprises at least one of:
a first cooler/heater surface embedded within the circuit board and a plurality of thermally conductive vias that extends from the first cooler/heater surface to an electronic device which is to be cooled and/or heated; and
a second heater/cooler surface embedded within the circuit board and a plurality of thermally conductive vias extends from the second heater/cooler surface to an outer surface of the circuit board.

12. The circuit board of claim 11 , wherein copper layers available in the circuit board serve as the first cooler/heater surface and the second heater/cooler surface.

13. The circuit board of claim 11 , wherein the first cooler/heater surface and the second heater/cooler surface further provide at least one electrode electrically connected to the at least one pair of thermoelectric semiconductor members.

14. The circuit board of claim 11 , wherein the Peltier heat pump device further comprises at least one first cooler/heater surface and at least one second heater/cooler surface, the at least one first cooler/heater surface being arranged in a first plane, the at least one second heater/cooler surface being arranged in a second plane spaced at a distance from the first plane, and the at least one pair of thermoelectric semiconductor members extending between the at least one first cooler/heater surface in the first plane and the at least one second heater/cooler surface in the second plane.

15. The circuit board of claim 1 , wherein the Peltier heat pump device comprises at least two layers, wherein each layer comprises at least one first cooler/heater surface and at least one second heater/cooler surface, and wherein the at least one first cooler/heater surface, the at least one second heater/cooler surface, and the at least one pair of semiconductor members are generally coplanar and arranged within the circuit board.

16. A circuit board, comprising at least one Peltier heat pump device, the Peltier heat pump device comprising at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, the at least one pair of thermoelectric semiconductor members being at least partially embedded in the circuit board, wherein each pair of thermoelectric semiconductor members comprise a first semiconductor member and a second semiconductor member and wherein a first metallic electrode extends between the first semiconductor member and the second semiconductor member.

17. The circuit board of claim 16 wherein the first semiconductor member is of a first conductivity type and the second semiconductor is of a second conductivity type which opposes the first conductivity type.

18. The circuit board of claim 16 wherein the first metallic electrode extends between the first semiconductor member and the second semiconductor member to provide one of a cooler surface and a heater surface.

19. The circuit board of claim 16 wherein adjacent pairs of thermoelectric semiconductor members are electrically connected to one another by a second metallic electrode which extends between semiconductor members of differing conductivity type of adjacent pairs of semiconductor elements.

20. A circuit board, comprising at least one Peltier heat pump device, the Peltier heat pump device comprising at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, at least one first cooler/heater surface and at least one second heater/cooler surface, wherein the at least one first cooler/heater surface and the at least one second heater/cooler surface is at least partially embedded in the circuit board.

Assignees

• Harman Becker Automotive Systems Gmbh

Inventors

• Noshadi Valod

Classifications

• H05K1/0209

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• H05K2201/10219

  Thermoelectric component · CPC title

• H05K1/16

  incorporating printed electric components, e.g. printed resistors, capacitors or inductors · CPC title

• H05K1/0206

  by printed thermal vias · CPC title

• H05K7/205 Primary

  Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201) · CPC title