Electronic circuit package

Patent metadata

Field	Value
Publication number	US-9907179-B2
Application number	US-201615137106-A
Country	US
Kind code	B2
Filing date	Apr 25, 2016
Priority date	Apr 25, 2016
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin formed of a composite magnetic material including a thermosetting resin material and a magnetic filler, the magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component; and a metal film connected to the power supply pattern and covering at least a top surface of the magnetic mold resin. A volume resistance value of the magnetic mold resin is equal to or larger than 10 10 Ω, and a resistance value at an interface between the top surface of the magnetic mold resin and the metal film is equal to or larger than 10 6 Ω.

First claim

What is claimed is:

1. An electronic circuit package comprising:
a substrate having a power supply pattern;
an electronic component mounted on a surface of the substrate;
a magnetic mold resin formed of a composite magnetic material including a thermosetting resin material and a magnetic filler, the magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component; and
a metal film connected to the power supply pattern and covering at least a top surface of the magnetic mold resin,
wherein a volume resistance value of the magnetic mold resin is equal to or larger than 10 10 Ω, and a resistance value at an interface between the top surface of the magnetic mold resin and the metal film is equal to or larger than 10 6 Ω.

2. The electronic circuit package as claimed in claim 1 , wherein the metal film further covers a side surface of the magnetic mold resin, and a resistance value at an interface between the side surface of the magnetic mold resin and the metal film is equal to or larger than 10 6 Ω.

3. The electronic circuit package as claimed in claim 1 , further comprising an insulating material provided between the magnetic mold resin and the metal film.

4. The electronic circuit package as claimed in claim 1 , wherein the magnetic filler includes a soft magnetic metal.

5. The electronic circuit package as claimed in claim 4 , wherein a surface of the magnetic filler is coated by an insulation coat.

6. The electronic circuit package as claimed in claim 5 , wherein a film thickness of the insulation coat is equal to or larger than 10 nm.

7. The electronic circuit package as claimed in claim 4 , wherein a shape of the magnetic filler is substantially spherical.

8. The electronic circuit package as claimed in claim 4 , wherein a main component of the magnetic filler is at least one magnetic material selected from a group consisting of Fe, Fe—Co, Fe—Ni, Fe—Al, and Fe—Si.

9. The electronic circuit package as claimed in claim 1 , wherein the magnetic mold resin further include a non-magnetic filler.

10. The electronic circuit package as claimed in claim 1 , wherein the metal film is mainly composed of at least one metal selected from a group consisting of Au, Ag, Cu, and Al.

11. The electronic circuit package as claimed in claim 10 , wherein the surface of the metal film is covered with an antioxidant film.

12. The electronic circuit package as claimed in claim 1 , wherein the power supply pattern is exposed to a side surface of the substrate, and the metal film contacts the power supply pattern exposed on the side surface of the substrate.

13. The electronic circuit package as claimed in claim 1 , further comprising a non-magnetic member provided between the electronic component and the magnetic mold resin.

Assignees

• Tdk Corp

Inventors

• Kawabata Kenichi

Classifications

• H10W42/284

  shielding resins · CPC title

• H10W42/287

  materials for magnetic shielding, e.g. ferromagnetic materials · CPC title

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title