Silver-containing film and method for producing same
US-2024279816-A1 · Aug 22, 2024 · US
Silver-plated product
US9905951B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9905951-B2 |
| Application number | US-201314384972-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 1, 2013 |
| Priority date | Mar 14, 2012 |
| Publication date | Feb 27, 2018 |
| Grant date | Feb 27, 2018 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
There is provided a silver-plated product wherein a silver plating film having a thickness of not greater than 10 micrometers is formed on a base material of copper or a copper alloy and wherein the surface of the silver plating film has an arithmetic average roughness Ra of not greater than 0.1 micrometers, and the silver plating film has a {111} orientation ratio of not less than 35%.
First claim
Opening claim text (preview).
The invention claimed is: 1. A silver-plated product comprising: a base material; and a silver plating film formed on the base material, wherein a surface of the silver plating film has an arithmetic average roughness Ra of not greater than 0.1 micrometers, and the silver plating film has a {111} orientation ratio of not less than 35%. 2. A silver-plated product as set forth in claim 1 , wherein said base material is made of copper or a copper alloy. 3. A silver-plated product as set forth in claim 1 , wherein said silver plating film has a thickness of not greater than 10 micrometers. 4. A silver-plated product as set forth in claim 2 , wherein said silver plating film has a thickness of not greater than 10 micrometers. 5. A silver-plated product as set forth in claim 1 , wherein said {111} orientation ratio is 30 to 60%. 6. A silver-plated product as set forth in claim 1 , wherein said {111} orientation ratio is 40 to 60%.
Assignees
Inventors
Classifications
Pretreatment of metallic surfaces to be electroplated · CPC title
characterised by the material thereof {(containing gas-evolving material H01H33/765)} · CPC title
- H01R13/03Primary
characterised by the material, e.g. plating, or coating materials · CPC title
Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) · CPC title
Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] · CPC title
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Frequently asked questions
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- What does patent US9905951B2 cover?
- There is provided a silver-plated product wherein a silver plating film having a thickness of not greater than 10 micrometers is formed on a base material of copper or a copper alloy and wherein the surface of the silver plating film has an arithmetic average roughness Ra of not greater than 0.1 micrometers, and the silver plating film has a {111} orientation ratio of not less than 35%.
- Who is the assignee on this patent?
- Dowa Metaltech Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01R13/03. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).