Light emitting diode and data transmission and reception apparatus

Patent metadata

Field	Value
Publication number	US-9905725-B2
Application number	US-201514864896-A
Country	US
Kind code	B2
Filing date	Sep 25, 2015
Priority date	Jul 15, 2015
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

A light emitting diode, including a semiconductor epitaxial structure, a first electrode and a second electrode is provided. The semiconductor epitaxial structure includes a plurality stacked light-emitting layers, and each of the light-emitting layers respectively emits different range of wavelength of light. The first electrode is electrically connected to the semiconductor epitaxial structure. The second electrode is electrically connected to the semiconductor epitaxial structure. Furthermore, a data transmission and reception apparatus is provided.

First claim

What is claimed is:

1. A light emitting diode chip, applied to a visible light communication system, the light emitting diode chip comprising:
a semiconductor epitaxial structure comprising a plurality of stacked light emitting layers for emitting a spectrum with at least three wavelength peaks, the stacked light emitting layers comprising at least two quantum well layers for emitting at least two of the wavelength peaks, an electroluminescent quantum well layer and a plurality of wavelength conversion layers;
a first electrode, electrically connected to the semiconductor epitaxial structure; and
a second electrode, electrically connected to the semiconductor epitaxial structure.

2. The light emitting diode chip as claimed in claim 1 , wherein the semiconductor epitaxial structure further comprises:
a first type doped semiconductor layer; and
a second type doped semiconductor layer, wherein the light emitting layers are stacked between the first type doped semiconductor layer and the second type doped semiconductor layer.

3. The light emitting diode chip as claimed in claim 2 , wherein the semiconductor epitaxial structure further comprises a plurality of spacers, and each of the spacers is located between adjacent light emitting layers.

4. The light emitting diode chip as claimed in claim 2 , wherein the light emitting layers comprise a first light emitting layer, a second light emitting layer, and a third light emitting layer, and the first light emitting layer, the second light emitting layer, and the third light emitting layer respectively emit a light beam with a range of wavelength from 600 nanometers to 750 nanometers, a light beam with a range of wavelength from 500 nanometers to 600 nanometers, and a light beam with a range of wavelength from 420 nanometers to 500 nanometers.

5. The light emitting diode chip as claimed in claim 1 , wherein the semiconductor epitaxial structure comprises a plurality of stacked light emitting units, and each of the light emitting units comprises:
a first type doped semiconductor layer; and
a second type doped semiconductor layer, wherein each of the light emitting layers is located between the first type doped semiconductor layer and the second type doped semiconductor layer.

6. The light emitting diode chip as claimed in claim 5 , wherein the light emitting layers in each of the light emitting units respectively emit a light beam with a range of wavelength from 600 nanometers to 750 nanometers, a light beam with a range of wavelength from 500 nanometers to 600 nanometers, and a light beam with a range from 420 nanometers to 500 nanometers.

7. The light emitting diode chip as claimed in claim 5 , wherein one of the light emitting layers comprises a wavelength conversion layer, while remaining of the light emitting layers comprise a plurality of electroluminescent quantum well layers.

8. The light emitting diode chip as claimed in claim 7 , wherein the electroluminescent quantum well layers comprise a first electroluminescent quantum well layer and a second electroluminescent quantum well layer.

9. The light emitting diode chip as claimed in claim 5 , wherein the semiconductor epitaxial structure further comprises a plurality of tunnel junction layers, and each of the tunnel junction layers is located between adjacent light emitting units.

10. The light emitting diode chip as claimed in claim 1 , wherein the light emitting diode further comprises:
a first type doped semiconductor layer; and
a second type doped semiconductor layer, wherein the electroluminescent quantum well layer is located between the first type doped semiconductor layer and the second type doped semiconductor layer.

11. The light emitting diode chip as claimed in claim 1 , wherein the electroluminescent quantum well layer emits a light beam with a range of wavelength from 420 nanometers to 500 nanometers, and the wavelength conversion layers respectively emit a light beam with a range of wavelength from 500 nanometers to 600 nanometers and a light beam with a range of wavelength from 600 nanometers to 750 nanometers.

12. The light emitting diode chip as claimed in claim 11 , wherein the wavelength conversion layers comprise a first photoluminescent quantum well layer and a second photoluminescent quantum well layer.

13. The light emitting diode chip as claimed in claim 11 , wherein the wavelength conversion layers comprise a first photoluminescent quantum well layer and a phosphor layer.

14. The light emitting diode chip as claimed in claim 1 , wherein the electroluminescent quantum well layer emits a light beam with a range of wavelength from 320 nanometers to 420 nanometers, and the wavelength conversion layers respectively emit a light beam with a range of wavelength from 420 nanometers to 500 nanometers, a light beam with a range of wavelength from 500 nanometers to 600 nanometers, and a light beam with a range of wavelength from 600 nanometers to 750 nanometers.

15. The light emitting diode chip as claimed in claim 14 , wherein the wavelength conversion layers comprise a first photoluminescent quantum well layer, a second photoluminescent quantum well layer, and a third photoluminescent quantum well layer.

16. The light emitting diode chip as claimed in claim 14 , wherein the wavelength conversion layers comprise a first photoluminescent quantum well layer, a phosphor layer, and a second phosphor layer.

17. The light emitting diode chip as claimed in claim 14 , wherein the wavelength conversion layers comprise a first photoluminescent quantum well layer, a second photoluminescent quantum well layer, and a phosphor layer.

18. A data transmission and reception apparatus, comprising:
a data transmission module, wherein the data transmission module comprises at least one light emitting diode chip as claimed in claim 1 ; and
a data reception module, wherein the data reception module receives a light beam emitted by the at least one light emitting diode chip.

19. The data transmission and reception apparatus as claimed in claim 18 , wherein the distance between the data transmission module and the data reception module is less than 50 meters.

20. A light emitting diode chip, applied to a visible light communication system, the light emitting diode chip comprising:
a semiconductor epitaxial structure comprising a plurality of tunnel junction layers, a plurality of stacked light emitting layers for emitting a spectrum with at least three wavelength peaks, the stacked light emitting layers comprising at least two quantum well layers for emitting at least two of the wavelength peaks, a plurality of stacked light emitting units, each of the tunnel junction layers is located between adjacent light emitting units, wherein each of the light emitting units comprises:
a first type doped semiconductor layer; and
a second type doped semiconductor layer, wherein each of the light emitting layers is located between the first type doped semiconductor layer and the second type doped semiconductor layer;
a first electrode, electrically connected to the semiconductor epitaxial structure; and
a second electrode, electrically connected to the semiconductor epitaxial structure.

Assignees

• Univ Southern Taiwan Sci & Tec

Inventors

• Lee Ming Lun

Classifications

• H01L33/08

  Electricity · mapped topic

• H04B10/43

  using a single component as both light source and receiver, e.g. using a photoemitter as a photoreceiver · CPC title

• H01L33/382

  Electricity · mapped topic

• H01L33/06 Primary

  Electricity · mapped topic

• H04B10/116

  Visible light communication · CPC title