Mixtures, methods and compositions pertaining to conductive materials

Patent metadata

Field	Value
Publication number	US-9902863-B2
Application number	US-201615234310-A
Country	US
Kind code	B2
Filing date	Aug 11, 2016
Priority date	Mar 20, 2012
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

This invention pertains to mixtures and methods that can be used to produce materials comprising an electrically and/or thermally conductive coating as well as compositions that are materials that possess an electrically and/or thermally conductive coating. The mixtures and methods can be used to fabricate transparent conductive films and other transparent conductive materials.

First claim

The invention claimed is:

1. A method of forming a patterned conductive layer, the method comprising:
depositing a non-conductive layer on a substrate, wherein anisotropic conductive nanoparticles are deposited with a non-conductive additive that inhibits conduction between the anisotropic conductive nanoparticles; and
partially stripping the non-conductive additive from the nanoparticles by a physical or chemical treatment.

2. The method according to claim 1 , further comprising:
a) contacting at least part of at least one surface of the substrate with a mixture comprising
i) at least one alcohol solvent,
ii) at least one ester solvent,
iii) at least one cellulose ether therein solvated,
iv) the anisotropic conductive nanoparticles uniformly dispersed in the mixture, and
v) the non-conductive additive that inhibits conduction between the anisotropic conductive nanoparticles; and

b) permitting the alcohol solvent and the ester solvent of the mixture to evaporate to thereby form a non-conductive layer on the substrate.

3. The method according to claim 2 , wherein the anisotropic conductive nanoparticles of the mixture comprise a non-conductive additive coating that inhibits conduction between the anisotropic conductive nanoparticles.

4. The method according to claim 3 , wherein the anisotropic conductive nanoparticles are deposited with an additive capable of adhering to the surface of the nanoparticles and shielding the nanoparticles from conductively interacting with other nanoparticles, and the additive is also capable of being at least partially stripped from the anisotropic conductive nanoparticles by the physical or chemical treatment.

5. The method according to claim 3 , wherein the anisotropic conducting particles are deposited with an additive capable of being partially or fully stripped by irradiating the anisotropic conductive nanoparticles of the non-conductive layer.

6. The method according to claim 3 , wherein the anisotropic conducting particles are deposited with an additive capable of being partially or fully removed from the anisotropic conductive nanoparticles of the non-conductive layer by chemical treatment.

7. The method according to claim 3 , further comprising:
irradiating specific areas of the nonconductive layer to thereby selectively strip the non-conductive additive from the anisotropic conductive nanoparticles within the specific areas, and thereby render the specific areas conductive between the nanoparticles.

8. The method according to claim 3 , further comprising:
chemically treating specific areas of the non-conductive layer to thereby selectively strip the non-conductive additive from the anisotropic conductive nanoparticles within the specific areas, and thereby render the specific areas conductive between said nanoparticles.

9. The method according to claim 8 , wherein the chemically treating occurs by dipping, coating, spraying or painting the non-conductive layer or by applying a chemical treatment as a vapor.

10. The method according to claim 3 , wherein the anisotropic conductive nanoparticles are deposited with at least one additive selected from the group consisting of a UV-cured vinyl acrylate, a dimethylsiloxane cetyl trimethylammonium bromide, an alkyl dithiothiadiazole, a nadic methyl anhydride and a dicyandiamide.

11. The method according to claim 1 , wherein the anisotropic conductive nanoparticles are deposited with an additive capable of adhering to the surface of the nanoparticles and shielding the nanoparticles from conductively interacting with other nanoparticles, and the additive is also capable of being at least partially stripped from the anisotropic conductive nanoparticles by the physical or chemical treatment.

12. The method according to claim 1 , wherein the anisotropic conducting particles are deposited with an additive capable of being partially or fully stripped by irradiating the anisotropic conductive nanoparticles of the non-conductive layer.

13. The method according to claim 1 , wherein the anisotropic conducting particles are deposited with an additive capable of being partially or fully removed from the anisotropic conductive nanoparticles of the non-conductive layer by chemical treatment.

14. The method according to claim 1 , further comprising:
irradiating specific areas of the nonconductive layer to thereby selectively strip the non-conductive additive from the anisotropic conductive nanoparticles within the specific areas, and thereby render the specific areas conductive between the nanoparticles.

15. The method according to claim 14 , wherein, prior to the irradiating, areas of the nonconductive layer are masked with either a stencil or photo-patterned polymer layer which blocks the irradiating and protects the non-conductive additive to maintain a non-conductive state in the areas of the nonconductive layer.

16. The method according to claim 15 , wherein the irradiating occurs with UV light radiation.

17. The method according to claim 14 , wherein the irradiating occurs with UV light radiation.

18. The method according to claim 14 , wherein the irradiating is applied with a rastering laser or an electron beam.

19. The method according to claim 1 , further comprising:
chemically treating specific areas of the non-conductive layer to thereby selectively strip the non-conductive additive from the anisotropic conductive nanoparticles within the specific areas, and thereby render the specific areas conductive between said nanoparticles.

20. The method according to claim 19 , wherein the chemically treating occurs by dipping, coating, spraying or painting the non-conductive layer or by applying a chemical treatment as a vapor.

21. The method according to claim 19 , wherein, prior to the chemically treating, areas of the nonconductive layer are masked with either a stencil or photo-patterned polymer layer which blocks the chemically treating and protects the non-conductive additive to maintain a non-conductive state in the areas of the nonconductive layer.

22. The method according to claim 1 , wherein the anisotropic conductive nanoparticles are deposited with at least one additive selected from the group consisting of a UV-cured vinyl acrylate, a dimethylsiloxane cetyl trimethylammonium bromide, an alkyl dithiothiadiazole, a nadic methyl anhydride and a dicyandiamide.

Assignees

• Basf Se

Inventors

• Schultz David
• Glass James
• Garcia Benjamin W C

Classifications

• Y10T428/31678

  Of metal · CPC title

• H01B1/22

  the conductive material comprising metals or alloys · CPC title

• C09D7/20

  Diluents or solvents · CPC title

• C09D5/24

  Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title

• C09K5/08

  Materials not undergoing a change of physical state when used (C09K5/16, C09K5/20 take precedence) · CPC title