Piezoelectric package-integrated synthetic jet devices

Patent metadata

Field	Value
Publication number	US-9902152-B2
Application number	US-201615199899-A
Country	US
Kind code	B2
Filing date	Jun 30, 2016
Priority date	Jun 30, 2016
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

Embodiments of the invention include a piezoelectric package integrated jet device. In one example, the jet device includes a vibrating membrane positioned between first and second cavities of an organic substrate, a piezoelectric material coupled to the vibrating membrane which acts as a first electrode, and a second electrode in contact with the piezoelectric material. The vibrating membrane generates fluid flow through an orifice in response to application of an electrical signal between the first and second electrodes.

First claim

The invention claimed is:

1. A jet device, comprising:
a vibrating membrane positioned between first and second cavities of an organic substrate;
a piezoelectric material coupled to the vibrating membrane, wherein the vibrating membrane acts as a first electrode; and
a second electrode in contact with the piezoelectric material, wherein the vibrating membrane generates a fluid flow through an orifice in response to application of an electrical signal between the first and second electrodes.

2. The jet device of claim 1 , wherein the jet device is integrated with the organic substrate and wherein the organic substrate is fabricated with panel level processing.

3. The jet device of claim 1 , wherein the vibrating membrane is positioned above the first cavity and below the second cavity of the organic substrate to allow vibrations of the vibrating membrane.

4. The jet device of claim 3 , wherein a Helmholtz frequency of the second cavity approximately matches a resonant frequency of the vibrating membrane and a frequency of the electrical signal.

5. The jet device of claim 1 , wherein the vibrating membrane has any type of in-plane shape defined by lithography during panel level fabrication of the organic substrate.

6. The jet device of claim 1 , wherein, upon application of the electrical signal, the vibrating membrane alternates between upward and downward vibration with the upward vibration causing fluid flow to be expelled through the orifice to an environment and the downward vibration causing fluid flow to be pulled in through the orifice from the environment.

7. A organic package substrate comprising:
a plurality of organic dielectric layers and a plurality of conductive layers to form the organic package substrate;
first and second cavities formed in the organic package substrate; and
a piezoelectric micro-pump device integrated with the organic package substrate, the piezoelectric micro-pump device including a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material, wherein the piezoelectric micro-pump device is suspended with respect to the first and second cavities of the organic package substrate and wherein the piezoelectric micro-pump device generates a fluid flow caused by an application of an electrical signal between the first and second electrodes.

8. The organic package substrate of claim 7 , wherein the first electrode comprises a vibrating membrane and wherein, upon application of the electrical signal, the Vibrating membrane alternates between upward and downward vibration with the upward vibration causing fluid flow to be expelled through an orifice to an environment and the downward vibration causing fluid flow to be pulled in through the orifice from the environment.

9. The organic package substrate of claim 8 , wherein the vibrating membrane is positioned above the first cavity and below the second cavity of the organic package substrate to allow vibrations of the vibrating membrane.

10. The organic package substrate of claim 7 , further comprising:
a vibrating membrane;
an insulating layer coupled to the vibrating membrane; and
the first electrode interposed between the insulating layer and the piezoelectric material.

11. The organic package substrate of claim 7 , wherein the organic package substrate is fabricated with panel level processing.

12. A microelectronic device comprising:
a plurality of organic dielectric layers and a plurality of conductive layers to form an organic substrate; and
an array of piezoelectric micro-pump devices integrated with the organic substrate, each of the piezoelectric micro-pump devices including a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material, wherein each piezoelectric micro-pump device is capable of generating a fluid flow caused by an application of an electrical signal between the first and second electrodes and wherein the array of piezoelectric micro-pump devices includes n different sizes of micro-pump devices with n being an integer.

13. The microelectronic device of claim 12 , wherein the first electrode of each micro-pump device comprises a vibrating membrane and wherein, upon application of the electrical signal, the vibrating membrane alternates between upward and downward vibration with the upward vibration causing fluid flow to be expelled through an orifice to an environment and the downward vibration causing fluid flow to be pulled in through the orifice from the environment.

14. The microelectronic device of claim 13 , wherein the vibrating membrane is positioned above a first cavity and below a second cavity of the organic substrate to allow vibrations of the vibrating membrane.

15. The microelectronic device of claim 12 , wherein each micro-pump device further comprises:
a vibrating membrane;
an insulating layer coupled to the vibrating membrane; and
a first electrode interposed between the insulating layer and the piezoelectric material.

16. The microelectronic device of claim 12 , wherein the organic substrate is fabricated with panel level processing.

17. A computing device comprising:
at least one processor to process data; and
an organic package substrate coupled to the at least one processor, the organic package substrate including:
a plurality of organic dielectric layers and a plurality of conductive layers to form the organic package substrate,
a piezoelectric jet device having a vibrating membrane positioned between first and second cavities of the organic package substrate,
a piezoelectric material coupled to the vibrating membrane, wherein the vibrating membrane acts as a first electrode, and
a second electrode in contact with the piezoelectric material,

wherein the vibrating membrane generates a fluid flow through an orifice in response to application of an electrical signal between the first and second electrodes.

18. The computing device of claim 17 , wherein the jet device is integrated with the organic package substrate and wherein the organic package substrate is fabricated with panel level processing.

19. The computing device of claim 17 , wherein the vibrating membrane is positioned above the first cavity and below the second cavity of the organic package substrate to allow vibrations of the vibrating membrane.

20. The computing device of claim 17 , further comprising:
a printed circuit board coupled to the organic package substrate.

Assignees

• Intel Corp

Inventors

• Eid Feras
• Liff Shawna M
• Oster Sasha N
• Sounart Thomas L
• Dogiamis Georgios C
• Elsherbini Adel A
• Swan Johanna M

Classifications

• B41J2/14298 Primary

  of disc type · CPC title

• B41J2002/14266

  Sheet-like thin film type piezoelectric element · CPC title

• B41J2/14201

  Structure of print heads with piezoelectric elements · CPC title

• B41J2/14233 Primary

  of film type, deformed by bending and disposed on a diaphragm · CPC title

• B41J2202/13

  Heads having an integrated circuit · CPC title