Press-forming mold and method for manufacturing protective film for press-forming mold

US9902093B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9902093-B2
Application numberUS-201214009522-A
CountryUS
Kind codeB2
Filing dateApr 3, 2012
Priority dateApr 18, 2011
Publication dateFeb 27, 2018
Grant dateFeb 27, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A press-forming mold has a protective film for preventing seizing during press-forming formed on at least a forming surface that comes into contact with a formed body. The protective film is formed by PVD. An arbitrary selection section extracted from the surface of the protective film is divided into a plurality of individual sections; and, when the gradient of the surface at the n th division point is represented by (dZn/dXn), taking N to represent the number of divisions, the root-mean-square RΔq calculated by the following numerical expression is no greater than 0.032. R ⁢ ⁢ Δ ⁢ ⁢ q = 1 N ⁢ ∑ n = 1 N ⁢ ⁢ ( d ⁢ ⁢ Z n d ⁢ ⁢ X n ) 2 It is thereby possible to improve the seizing resistance of a press-forming mold having a protective film formed by PVD.

First claim

Opening claim text (preview).

What is claimed is: 1. A press-forming mold comprising: a protective film for preventing seizing during press-forming, which is formed on at least a forming surface that comes into contact with a formed body, wherein: said protective film is formed by PVD; an arbitrary selection section extracted from the surface of the protective film is divided into a plurality of individual sections; and, when the n th division point from an end of said selected section is defined as being located a distance of dXn in the direction of extension of said selected section and dZn in the height direction from the (n−1) th division point, and the gradient of the surface at said n th division point is represented by (dZn/dXn), taking N to represent the number of divisions, the root-mean-square RΔq calculated by the following expression is no greater than 0.032: R ⁢ ⁢ Δ ⁢ ⁢ q = 1 N ⁢ ∑ n = 1 N ⁢ ⁢ ( d ⁢ ⁢ Z n d ⁢ ⁢ X n ) 2 . 2. The press-forming mold according to claim 1 , wherein said protective film is one that is formed by PVD in which a metal material containing at least 50 atom % of Al is used as a target. 3. The press-forming mold according to claim 2 , wherein said protective film is one in which a first thin film comprising a TiAlN-based material is formed on a side that comes into contact with said formed body. 4. The press-forming mold according to claim 3 , wherein said protective film is one in which a second thin film comprising a CrN-based material is formed on said forming surface, and said first thin film formed on the second thin film. 5. A method for manufacturing a protective film for a press-forming mold in which a protective film for preventing seizing during press-forming is formed on at least a forming surface of the press-forming mold that comes into contact with a formed body, the method comprising: forming a protective film by PVD on said forming surface in a reaction gas atmosphere using, as a target, a metallic material to become said protective film; and polishing the surface of the protective film; wherein in said polishing the surface of the protective film, the polishing is performed so that: an arbitrary selection section extracted from the surface of said protective film is divided into a plurality of individual sections; and when the n th division point from an end of said selected section is defined as being located a distance of dXn in the direction of extension of said selected section and dZn in the height direction from the (n−1) th division point, and the gradient of the surface at said n th division point is represented by (dZn/dXn), the root-mean-square RΔq calculated by the following expression is no greater than 0.032: R ⁢ ⁢ Δ ⁢ ⁢ q = 1 N ⁢ ∑ n = 1 N ⁢ ⁢ ( d ⁢ ⁢ Z n d ⁢ ⁢ X n ) 2 . 6. The press-forming mold according to claim 1 , wherein the protective film comprises: a first film formed on the forming surface and comprising a CrN-based material and having a thickness in range from 2μ to 5μ; and a second film formed on the first film and comprising a TiAlN-based material and having a thickness in range from 1μ to 5μ. 7. The press-forming mold according to claim 1 , wherein the root-mean-square RΔq is equal to or less than 0.030. 8. The press-forming mold according to claim 1 , wherein the PVD comprises arc ion plating. 9. A method for manufacturing a protective film for a press-forming mold, the method comprising: forming a thin film on the mold comprising: placing the mold on a rotary table connected to a bias power source in a chamber; supplying a process gas into the chamber; placing a target comprising a metal material and connected to an arc power source in the chamber; supplying power from the bias and arc po

Assignees

Inventors

Classifications

  • Nitrides (C23C14/0617 takes precedence) · CPC title

  • B21D37/01Primary

    Selection of materials · CPC title

  • B29C33/68Primary

    Release sheets · CPC title

  • Mechanical treatment (involving removal of material C23C14/588) · CPC title

  • C23C14/32Primary

    by explosion; by evaporation and subsequent ionisation of the vapours {, e.g. ion-plating}(C23C14/34 - C23C14/48 take precedence) · CPC title

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What does patent US9902093B2 cover?
A press-forming mold has a protective film for preventing seizing during press-forming formed on at least a forming surface that comes into contact with a formed body. The protective film is formed by PVD. An arbitrary selection section extracted from the surface of the protective film is divided into a plurality of individual sections; and, when the gradient of the surface at the n th divisio…
Who is the assignee on this patent?
KASHI Takaharu, Yamamoto Kenji, Nippon Koshuha Steel Co Ltd, and 1 more
What technology area does this patent fall under?
Primary CPC classification B21D37/01. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).