Electronic grade glass substrate and making method

Patent metadata

Field	Value
Publication number	US-9902037-B2
Application number	US-201514931610-A
Country	US
Kind code	B2
Filing date	Nov 3, 2015
Priority date	Oct 24, 2011
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

An electronic grade glass substrate is provided with a recess, channel or step in one surface, and a first chamfer between the side surface of the recess, channel or step and the one surface. The side and bottom surfaces of the recess, channel or step are mirror finished, and the first chamfer is mirror finished.

First claim

The invention claimed is:

1. A method for manufacturing an electronic grade synthetic quartz glass substrate, comprising the steps of:
machining at least one surface of a glass substrate to form a recess, channel or step in the one surface, the recess, channel or step having side and bottom surfaces, and to form at least one chamfer selected from among a first chamfer between the side surface of the recess, channel or step and the one surface of the substrate, a second chamfer between the side and bottom surfaces of the recess, channel or step, the second chamfer being a curved surface having a radius of curvature of 0.1 to 5.0 mm, and a third chamfer between the bottom surface of the step and an end surface of the substrate, and
polishing the side and bottom surfaces of the recess, channel or step and the chamfers to mirror finish by a working portion of a rotary polishing tool having a Young's modulus of up to 7 GPa while keeping the working portion in contact with the side and bottom surfaces and the chamfers under independent constant pressures.

2. The method of claim 1 wherein the mirror finish polishing step includes keeping the working portion of the rotary polishing tool in contact with the bottom and side surfaces of the recess, channel or step and the chamfers under independent constant pressures in the range of 1 to 1,000,000 Pa.

3. The method of claim 1 wherein in the mirror finish polishing step, the working portion of the rotary polishing tool is kept in concurrent contact with the bottom and side surfaces of the recess, channel or step and the chamfers under independent pressures.

4. The method of claim 1 wherein in the mirror finish polishing step, the rotary polishing tool and the substrate are relatively moved such that the working portion may follow the profile of the recess, channel or step and the chamfers in the substrate.

5. The method of claim 4 wherein in the mirror finish polishing step, the rotary polishing tool is rotated about the recess or a substrate-holding platform is rotated such that the working portion may follow the profile of the recess, channel or step and the chamfers in the substrate.

Assignees

• Shinetsu Chemical Co

Inventors

• Okafuji Daiyu
• Yamazaki Hiroyuki
• Takeuchi Masaki

Classifications

• B24B37/04

  designed for working plane surfaces · CPC title

• Y10T428/24479

  including variation in thickness · CPC title

• B24B1/00

  Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes · CPC title

• B24B5/50

  characterised by a special design with respect to properties of the material of non-metallic articles to be ground, e.g. strings (cutting profiles into the treads of tyres B29D30/68) · CPC title

• G03F1/60

  Substrates · CPC title