Wire bonding apparatus and method of manufacturing semiconductor device

Patent metadata

Field	Value
Publication number	US-9899348-B2
Application number	US-201615235121-A
Country	US
Kind code	B2
Filing date	Aug 12, 2016
Priority date	Feb 14, 2014
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

A wire bonding apparatus includes: a bonding tool 40 into and through a wire 42 passes; a control unit 80 that performs a movement process of the bonding tool 40 for cutting the wire 42 after forming a wire loop 90 between first and second bonding points of a bonding target 100 ; and a monitoring unit 70 that supplies a predetermined electric signal between the wire 42 through the bonding tool 40 and the bonding target 100 , and monitors whether the wire 42 is cut or not based on an output of the supplied electric signal. The control unit 80 continues the movement process of the bonding tool 40 while the wire 42 is determined not to be cut, and stops the movement process of the bonding tool 40 when the wire 42 is determined to be cut, based on a monitoring result from the monitoring unit 70 . This can shorten the operation time of the wire bonding, and improve the process efficiency of the wire bonding.

First claim

The invention claimed is:

1. A wire bonding apparatus, comprising:
a bonding tool for allowing a wire to be inserted thereinto and to pass therethrough;
a control unit that performs a movement process of the bonding tool for cutting the wire after forming a wire loop between a first bonding point and a second bonding point of a bonding target; and
a monitoring unit that supplies a predetermined electric signal between the wire inserted into and passing through the bonding tool and the bonding target, and monitors whether the wire is cut or not based on an output of the supplied electric signal, wherein
the control unit is configured to continue the movement process of the bonding tool during a period in which the wire is determined not to be cut, and to stop the movement process of the bonding tool when the wire is determined to be cut, based on a monitoring result from the monitoring unit.

2. The wire bonding apparatus according to claim 1 , wherein
the predetermined electric signal is an alternate-current electric signal or a direct-current pulse signal.

3. The wire bonding apparatus according to claim 2 , wherein
an output of the supplied electric signal is an output associated with a capacitance between the wire and the bonding target, and
the monitoring unit is configured to determine whether the wire is cut or not based on comparison between the output associated with the capacitance and a predetermined threshold.

4. The wire bonding apparatus according to claim 1 , wherein
the monitoring unit is configured to indicate that cutting of the wire is abnormal when the wire is determined to be cut before starting the movement process of the bonding tool for cutting the wire.

5. The wire bonding apparatus according to claim 1 , wherein
the wire bonding to be performed on the bonding target is a wedge bonding system.

6. The wire bonding apparatus according to claim 1 , wherein
the movement process of the bonding tool for cutting the wire includes moving the bonding tool in a direction parallel to a bonding surface.

7. The wire bonding apparatus according to claim 1 , wherein
the control unit is configured to move the bonding tool in a direction vertical to a bonding surface while stopping the movement process of the bonding tool for cutting the wire, when the monitoring unit determines that the wire is cut.

8. The wire bonding apparatus according to claim 1 , wherein
the wire is an aluminum wire.

9. A method of manufacturing a semiconductor device, the method including cutting a wire after forming a wire loop between a first bonding point and a second bonding point of a bonding target by means of a bonding tool, the method comprising:
supplying a predetermined electric signal between the wire inserted into and passing through the bonding tool and the bonding target, thereby monitoring whether the wire is cut or not based on an output of the supplied electric signal, wherein
the wire cutting step includes continuing the movement process of the bonding tool for cutting the wire during a period in which the wire is determined not to be cut, and stopping the movement process of the bonding tool when the wire is determined to be cut, based on a result of the monitoring.

Assignees

• Shinkawa Kk

Inventors

• Sekine Naoki

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07533

  Ultrasonic bonding, e.g. thermosonic bonding · CPC title

• H10W72/07531

  Techniques · CPC title

• H10W72/07521

  Aligning · CPC title

• H10W72/07502

  using an auxiliary member · CPC title