Antenna on integrated circuit package

Patent metadata

Field	Value
Publication number	US-9899341-B2
Application number	US-201615213320-A
Country	US
Kind code	B2
Filing date	Jul 18, 2016
Priority date	Jul 18, 2016
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

An antenna on integrated circuit (IC) package is disclosed. In an embodiment, an IC package comprises: a substrate; a radio frequency (RF) transceiver attached to the substrate; mold compound encapsulating the substrate; a shield layer formed on the mold compound; and one or more vias extending vertically through the shield layer and the mold compound, providing a conductive path to the RF transceiver. In another embodiment, a method comprises: attaching a radio frequency (RF) transceiver to a substrate; encapsulating the substrate with mold compound; forming a shield layer on the mold compound; and forming one or more vias through the shield layer and mold compound, providing a conductive path to the RF transceiver.

First claim

What is claimed is:

1. An integrated circuit (IC) package comprising:
a substrate;
a radio frequency (RF) transceiver attached to the substrate;
mold compound encapsulating the RF transceiver;
an electromagnetic interference (EMI) shield layer formed over the mold compound to provide at least a portion of an outer surface of the package; and
one or more vias extending vertically through the EMI shield layer and the mold compound, providing a conductive path to the RF transceiver.

2. The IC package of claim 1 , further comprising:
a printed circuit board (PCB) structure attached to the EMI shield layer and coupled to the via.

3. A method of fabricating an integrated circuit (IC) package, comprising:
attaching a radio frequency (RF) transceiver to a substrate;
encapsulating the RF transceiver with mold compound;
forming an electromagnetic interference (EMI) shield layer over the mold compound to provide at least a portion of an outer surface of the package; and
forming one or more vias through the EMI shield layer and mold compound, providing a conductive path to the RF transceiver.

4. The method of claim 3 , further comprising:
attaching a printed circuit board (PCB) structure to the EMI shield layer and coupling the PCB to the one or more vias.

5. An integrated circuit (IC) package comprising:
a substrate;
a radio frequency (RF) transceiver attached to the substrate;
a surface mount discrete component attached to the substrate and coupled to the RF transceiver;
mold compound encapsulating the surface mount discrete component;
an electromagnetic interference (EMI) shield layer formed over the mold compound to provide at least a portion of an outer surface of the package; and
an opening extending vertically through the EMI shield layer and the mold compound, the opening exposing a portion of the surface mount discrete component.

6. The IC package of claim 5 , further comprising:
an printed circuit board (PCB) structure attached to the EMI shield layer and coupled to the surface mount discrete component; and
an antenna formed on or affixed to the PCB structure.

7. A method of fabricating an integrated circuit (IC) package, comprising:
attaching a radio frequency (RF) transceiver to a substrate;
attaching a surface-mount device to the substrate;
coupling the surface-mount device to the RF receiver;
encapsulating the RF transceiver and surface-mount device with mold compound;
forming an electromagnetic interference (EMI) shield layer over the mold compound to provide at least a portion of an outer surface of the package; and
removing a portion of the EMI shield layer to expose a portion of the surface-mount device.

8. The method of claim 7 , further comprising:
attaching an antenna to the surface-mount device.

Assignees

• Atmel Corp

Inventors

• Hashemi Hassan
• Atia Mamdouh
• Radutnuy Igor

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title

• H10W44/248

  for antennas · CPC title