Component built-in multilayer substrate fabricating method and component built-in multilayer substrate

Patent metadata

Field	Value
Publication number	US-2016007480-A1
Application number	US-201514856895-A
Country	US
Kind code	A1
Filing date	Sep 17, 2015
Priority date	May 17, 2013
Publication date	Jan 7, 2016
Grant date	—

Abstract

A fabricating method according to the present disclosure is a component built-in multilayer substrate fabricating method for incorporating a component ( 12 ) in a resin multilayer substrate ( 11 ) formed by laminating and pressing thermoplastic resin sheets ( 111 a to 111 d ) so as to crimp them to each other. With the fabricating method according to the present disclosure, a metal pattern ( 13 ) is provided on a component mounting surface of the thermoplastic resin sheet ( 111 a ). Further, the component ( 12 ) is inserted in the area sandwiched by the metal pattern ( 13 ). Out of widths relating to the area sandwiched by the metal pattern ( 13 ), the width in the component mounting surface side is assumed to be a width W 2 , and the width in the component-insertion side is assumed to be a width W 3 , the width W 2 being equal to or larger than a width W 1 of the component but less than the width W 3 .

First claim

What is claimed is:

1 . A component built-in multilayer substrate fabricating method for incorporating a component in a resin multilayer substrate formed by laminating and pressing thermoplastic resin sheets so as to crimp them to each other, the method comprising the steps of:
providing a guide pattern on a component mounting surface of a first thermoplastic resin sheet which constitutes the thermoplastic resin sheets; and inserting the component in an area sandwiched by the guide pattern; wherein, out of widths relating the area sandwiched by the guide pattern, a width in the component mounting surface side is assumed to be a width W 2 , and a width in the component insertion side is assumed to be a width W 3 , the width W 2 being equal to or larger than a width W 1 of the component but less than the width W 3 .

2 . The component built-in multilayer substrate fabricating method according to claim 1 , further comprising the step of bringing a second thermoplastic resin sheet constituting the thermoplastic resin sheets into contact with the component mounting surface,
wherein the second thermoplastic resin sheet is provided with an opening portion formed in its main surface, the component is positioned in the opening portion when viewed in a direction normal to the component mounting surface, and the opening portion has a width W 4 which is equal to or larger than the width W 3 .

3 . The component built-in multilayer substrate fabricating method according to claim 1 , wherein
assuming that the component has a largest width of a width W 5 when the component is inclined with respect to the component mounting surface, the width W 2 is equal to or less than the width W 5 .

4 . The component built-in multilayer substrate fabricating method according to claim 1 , wherein the guide pattern comprises a metal pattern.

5 . The component built-in multilayer substrate fabricating method according to claim 2 , wherein the guide pattern comprises a metal pattern.

6 . The component built-in multilayer substrate fabricating method according to claim 3 , wherein the guide pattern comprises a metal pattern.

7 . A component built-in multilayer substrate including a resin multilayer substrate formed from thermoplastic resin sheets being laminated, and a component incorporated in the resin multilayer substrate, comprising:
a guide pattern formed on a component mounting surface inside the resin multilayer substrate; wherein the component is placed on an area of the component mounting surface which is sandwiched by the guide pattern, out of side surfaces of the guide pattern, the side surface closer to the component is tapered in such a way as to be gradually narrowed toward the component mounting surface.

8 . The component built-in multilayer substrate according to claim 7 , wherein the guide pattern comprises a metal pattern.

9 . The component built-in multilayer substrate fabricating method according to claim 1 , wherein the component is a radio frequency integrated circuit.

10 . The component built-in multilayer substrate fabricating method according to claim 2 , wherein the component is a radio frequency integrated circuit.

11 . The component built-in multilayer substrate according to claim 7 , wherein the component is a radio frequency integrated circuit.

12 . The component built-in multilayer substrate fabricating method according to claim 1 , wherein the component is a ferrite core.

13 . The component built-in multilayer substrate fabricating method according to claim 2 , wherein the component is a ferrite core.

14 . The component built-in multilayer substrate according to claim 7 , wherein the component is a ferrite core.

15 . The component built-in multilayer substrate fabricating method according to claim 1 , wherein the resin multilayer substrate is a portion of an antenna module.

16 . The component built-in multilayer substrate fabricating method according to claim 2 , wherein the resin multilayer substrate is a portion of an antenna module.

17 . The component built-in multilayer substrate according to claim 7 , wherein the resin multilayer substrate is a portion of an antenna module.

Assignees

• Murata Manufacturing Co

Inventors

• Yosui Kuniaki

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H05K3/30 Primary

  Assembling printed circuits with electric components, e.g. with resistors · CPC title

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title

• H05K1/0298

  Multilayer circuits · CPC title

• H01Q1/12

  Supports; Mounting means · CPC title