Multi channel semiconductor device having multi dies and operation method thereof

Patent metadata

Field	Value
Publication number	US-9899075-B2
Application number	US-201514795191-A
Country	US
Kind code	B2
Filing date	Jul 9, 2015
Priority date	Jul 9, 2014
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

A multi channel semiconductor device is disclosed. The multi channel device may include a substrate, a first die on the substrate and having a first channel to function as a first chip; and a second die on the substrate and having a second channel different from the first channel to function as a second chip and including the same storage capacity and physical size as the first die. An internal interface is disposed between the first and second dies. The internal interface is configured to transmit information for controlling internal operations of the first and second dies and first applied to a first recipient die of the first and second dies to the other die.

First claim

What is claimed is:

1. A semiconductor device comprising:
a package substrate;
a first die on the package substrate having a first channel to function as a first chip and a first pad to receive control information for controlling the first die;
a second die on the package substrate having a second channel to function as a second chip and a second pad to receive the control information, for controlling the second die, wherein the control information is applied to one of the first die and the second die, wherein the second channel is different from the first channel and the second die has same storage capacity and physical size as the first die; and
an internal interface that connects the first and second dies, the internal interface configured to transmit the control information to the second die when the control information is applied to the first die and transmit the control information to the first die when the control information is applied to the second die,
wherein the second die is mounted on the package substrate to be horizontally adjacent the first die.

2. The semiconductor device of claim 1 , wherein the control information is one of a reset signal for resetting operations of the first and second dies and a ZQ signal for ZQ calibration operations of the first and second dies.

3. The semiconductor device of claim 1 , wherein the semiconductor device is configured such that:
information from outside the semiconductor device having a first type is transmitted to the first die through the first channel without passing between the first die and the second die, and is transmitted to the second die through the second channel without passing between the first die and the second die; and
the control information for controlling internal operations of the first and second dies is a different type of information from the first type.

4. A semiconductor package comprising:
a package substrate;
a first die on the package substrate having a first channel to function as a first chip and a first pad to receive control information, the control information for controlling the first die;
a second die on the package substrate having a second channel to function as a second chip and a second pad to receive the control information, for controlling the second die, wherein the control information is applied to one of the first die and the second die, wherein the second channel is different from the first channel and the second die has same storage capacity and physical size as the first die; and
an internal interface that connects the first and second dies, the internal interface configured to transmit the control information to the second die when the control information is applied to the first die and transmit the control information to the first die when the control information is applied to the second die,
wherein the first die is horizontally adjacent the second die, and
wherein each of said first and second dies are configured to (a) receive first information from outside the semiconductor package without the first information physically passing through the other of the first and second dies to arrive at said first or second die, and (b) receive second information from the other of the first and second dies.

5. A semiconductor package comprising:
a package substrate;
a first chip mounted on the substrate;
a second chip mounted on the substrate to be horizontally adjacent the first chip;
a first channel connected to the first chip for receiving a first type of information at the first chip;
a second separate channel connected to the second chip for receiving the first type of information at the second chip; and
an internal interface connected between the first chip and the second chip, the internal interface configured to transmit a second type of information different from the first type from a buffer of the first or second chip to the other of the first or second chip, wherein the second type of information is used by both the first chip and the second chip,
wherein the internal interface is a conductive line extending along the package substrate between the first chip and the second chip, and connecting first terminals of the first chip to second terminals of the second chip.

6. The semiconductor package of claim 5 , wherein:
the first type of information is read/write access information; and
the second type of information is operation control information applied to both the first chip and the second chip to control operation of the respective chips.

7. The semiconductor package of claim 6 , wherein:
the second type of information relates to a reset command or a ZQ command.

8. The semiconductor package of claim 5 , wherein the semiconductor package is configured such that:
information having the first type is transmitted to the first chip through the first channel without passing between the first chip and the second chip, and is transmitted to the second chip through the second channel without passing between the first chip and the second chip.

9. The semiconductor package of claim 8 , wherein:
the second type of information is operation control information for the first and second chips.

10. The semiconductor package of claim 5 , further comprising:
a control circuit on at least one of the first and second chips, and configured to receive information of the second type.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Eom Yoon Joo
• Park Joon Young
• Bae Yongcheol
• Lee Won Young
• Jang Seongjin
• Choi Junghwan
• Choi Joosun

Classifications

• G11C11/4093

  Input/output [I/O] data interface arrangements, e.g. data buffers · CPC title

• G11C2207/105

  Aspects related to pads, pins or terminals · CPC title

• G11C11/4096 Primary

  Input/output [I/O] data management or control circuits, e.g. reading or writing circuits, I/O drivers or bit-line switches · CPC title

• G11C7/1084

  Data input buffers, e.g. comprising level conversion circuits, circuits for adapting load · CPC title