Bond pad sharing for powering a multiplicity of electrical components

US9899047B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9899047-B2
Application numberUS-201314050725-A
CountryUS
Kind codeB2
Filing dateOct 10, 2013
Priority dateOct 10, 2013
Publication dateFeb 20, 2018
Grant dateFeb 20, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus, comprising: a slider comprising a plurality of electrical bond pads coupled to bias sources; a plurality of electrical components of the slider each coupled to at least one of the electrical bond pads; at least one of the electrical bond pads is a shared electrical bond pad coupled to at least two of the electrical components; and circuitry configured to operate the plurality of electrical components alternately with respect to one another. 2. The apparatus of claim 1 , wherein the plurality of electrical components comprises disparate electrical components. 3. The apparatus of claim 1 , wherein: the plurality of electrical components comprises at least two readers; and the at least two readers are coupled to the shared electrical bond pad. 4. The apparatus of claim 3 , wherein a termination load is connected to an unshared electrical bond pad as between the at least two readers. 5. The apparatus of claim 1 , wherein: the plurality of electrical components comprises at least two readers and at least one contact sensor; and the contact sensor and one of the at least two readers are coupled to the shared electrical bond pad. 6. The apparatus of claim 5 , wherein: the one reader coupled to the shared electrical bond pad is configured to operate at times when the contact sensor is not operating; and the other of the at least two readers is configured to operate at times when the contact sensor is operating. 7. The apparatus of claim 5 , wherein the slider comprises a dummy contact sensor coupled to the one of the at least two readers coupled to the shared electrical bond pad. 8. The apparatus of claim 1 , wherein the plurality of electrical components comprises a writer; and the writer is coupled between one of the electrical bond pads and a ground. 9. The apparatus of claim 1 , wherein: the plurality of electrical components comprises a writer heater and at least two readers; and the writer heater and one of the at least two readers are coupled to the shared electrical bond pad. 10. The apparatus of claim 1 , wherein: the plurality of electrical components comprises three readers, and pairs of the three readers are coupled to one of three shared electrical bond pads. 11. The apparatus of claim 1 , wherein: the plurality of electrical components comprises a writer heater and a reader heater; and the writer heater and reader heater are coupled to the shared electrical bond pad. 12. The apparatus of claim 11 , wherein: the writer heater and reader heater are coupled in parallel between the two shared electrical bond pads; and each of the writer and reader heaters is coupled in series to a respective diode, the writer and reader heaters configured to operate alternately depending on the direction of current flow between the two shared electrical bond pads. 13. A system, comprising: a bond pad set electrically connected to a plurality of electrical components and comprising at least one ground pad and at least one electrical bond pad, the at least one electrical bond pad shared between two or more of the electrical components; and circuitry configured to operate the plurality of electrical components alternately with respect to one another. 14. The system of claim 13 , wherein the plurality of electrical components comprises disparate electrical components. 15. The system of claim 13 , wherein the plurality of electrical components comprises at least two readers. 16. The system of claim 13 , wherein the plurality of electrical components comprises at least two readers, and a termination load is connected to an unshared electrical bond pad as between the at least two readers.

Assignees

Inventors

Classifications

  • Magnetic conditionning of heads, e.g. biasing · CPC title

  • Disposition of heads, e.g. matrix arrangement · CPC title

  • Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title

  • G11B5/4853Primary

    Constructional details of the electrical connection between head and arm · CPC title

  • relative to rotating disc · CPC title

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Frequently asked questions

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What does patent US9899047B2 cover?
A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.
Who is the assignee on this patent?
Seagate Technology Llc
What technology area does this patent fall under?
Primary CPC classification G11B5/4853. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 20 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).