Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method
US-2024404859-A1 · Dec 5, 2024 · US
US9896277B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9896277-B2 |
| Application number | US-201214438462-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 29, 2012 |
| Priority date | Oct 29, 2012 |
| Publication date | Feb 20, 2018 |
| Grant date | Feb 20, 2018 |
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Official abstract text for this publication.
A component supply device is arranged adjacent to a mounter which mounts components on a board and supplies components to the mounter. This component supply device includes a replenishment section provided with a magazine which houses a component carrying member on which multiple components are arranged on a base material, and a conveyance section which conveys a component carrying member housed in the magazine and which is equipped with side surface number one to which the replenishment section is attached and side surface number two which is arranged adjacent to the mounter. The replenishment section is slidably attached with respect to side surface number one of the conveyance section.
Opening claim text (preview).
The invention claimed is: 1. A component supply device which is arranged adjacent to a mounter which mounts components on a board, the component supply device supplying the components to the mounter, comprising: a replenishment section provided with a magazine which houses a component carrying member on which multiple components are arranged; and a conveyance section including a moving table which conveys the component carrying member and which is equipped with a first side surface to which the replenishment section is attached and a second side surface which is arranged adjacent to the mounter, wherein the replenishment section is slidably attached in a first direction to the first side surface of the conveyance section, a slide block extends in a second direction outward from a side surface of the replenishment section that faces the first side surface of the conveyance section, the slide block includes first rollers with axes of rotation in the second direction and second rollers with axes of rotation in a third direction which is a height direction of the replenishment section, an engagement groove in the first side surface of the conveyance section has a length in the first direction and a depth in the second direction, when the slide block slides in the first direction within the engagement groove, the first rollers contact a bottom portion of the engagement groove and the second rollers contact a first side portion and a second side portion of the engagement groove. 2. The component supply device according to claim 1 , wherein the replenishment section is slidable in the first direction within a width of the conveyance section. 3. The component supply device according to claim 2 wherein the replenishment section is slidable in the first direction within a range in which the replenishment section is not separated from the conveyance section. 4. The component supply device according to claim 2 wherein the width in which the replenishment section is slidable is half or greater than a width of the mounter in the second direction. 5. The component supply device according to claim 1 , wherein the component carrying member is a wafer. 6. The component supply device according to claim 1 , wherein the slide block is fixed to the side surface of the replenishment section by a base block. 7. The component supply device according to claim 6 , wherein a top portion of the engagement groove includes a frame member that includes a protrusion that extends in the third direction and contacts the second rollers of the slide block.
Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title
Docking arrangements · CPC title
by means of a cart or a vehicle · CPC title
the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames · CPC title
Electricity · mapped topic
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