Active cable heat sink

Patent metadata

Field	Value
Publication number	US-9893474-B1
Application number	US-201615292046-A
Country	US
Kind code	B1
Filing date	Oct 12, 2016
Priority date	Oct 12, 2016
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

A cable, system, and method for cooling a semiconductor chip on an active cable. The active cable includes a heat sink that is thermally coupled to the semiconductor chip and movable from a retracted position to an extended position. The heat sink is in the retracted position when the active cable is not installed in a card connector in a computer case. After the active cable is installed in the card connector, the heat sink is urged to the extended position in which the heat sink is exposed to air flow circulation within the computer case.

First claim

What is claimed is:

1. An electrical cable for engagement with a card connector, comprising:
a cable comprising multiple signal conductors;
a cable connector housing that includes a distal end, configured for engagement with a card connector housing of a card connector, and an opposing proximal end;
a paddle card arranged within the cable connector housing, the paddle card including:
a first plurality of contacts arranged along an edge of the paddle card facing the distal end of the cable connector housing, wherein the first plurality of contacts are configured to engage card connector contacts of the card connector;
a second plurality of contacts arranged along another edge of the paddle card toward the proximal end of the cable connector housing, wherein the second plurality of contacts are connected to respective ones of the multiple signal conductors;
a semiconductor chip arranged on the paddle card and in electrical communication with the first plurality of contacts and the second plurality of contacts, wherein the semiconductor chip is operable to modify electrical signals between the first and second plurality of contacts; and
an electroactive polymer (EAP) material arranged on the paddle card, wherein the EAP material is electrically coupled to at least one of the first plurality of contacts;

a heat sink thermally coupled to the semiconductor chip, wherein:
the heat sink is movable from a retracted position to an extended position when the cable connector is seated in the card connector,
the heat sink is positioned within the cable connector housing in the retracted position,
at least a portion of the heat sink extends through the cable connector housing and the card connector housing in the extended position;
the heat sink is movable between the retracted position and the extended position about a hinge,
the heat sink is pushed from the retracted position to the extended position;
the EAP material expands when the first plurality of contacts engage the card connector contacts and when the card connector contacts are receiving power, and
expansion of the EAP material pushes the heat sink to the extended position.

2. The electrical cable of claim 1 , wherein the hinge comprises a cylindrical shaft extending between opposing walls of the cable connector housing.

3. The electrical cable of claim 1 , wherein the heat sink directly contacts the semiconductor chip.

4. The electrical cable of claim 1 , further comprising a thermal interface disposed between the heat sink and the semiconductor chip.

5. The electrical cable of claim 4 , wherein the thermal interface is a thermal paste.

6. An electrical cable for engaging a card connector, comprising:
a cable comprising multiple signal conductors;
a cable connector housing that includes a distal end, configured for engagement with a card connector housing of a card connector, and an opposing proximal end;
a paddle card arranged within the cable connector housing, wherein the paddle card is movable between a first position and a second position within the cable connector housing, the paddle card including:
a first plurality of contacts arranged along an edge of the paddle card facing the distal end of the cable connector housing, wherein the first plurality of contacts are configured to engage card connector contacts of the card connector;
a second plurality of contacts arranged along another edge of the paddle card toward the proximal end of the cable connector housing, wherein the second plurality of contacts are connected to respective ones of the multiple signal conductors; and
a semiconductor chip arranged on the paddle card and in electrical communication with the first plurality of contacts and the second plurality of contacts, wherein the semiconductor chip is operable to modify electrical signals between the first and second plurality of contacts;

a heat sink thermally coupled to the semiconductor chip, wherein
the heat sink is movable from a retracted position to an extended position when the cable connector is seated in the card connector,
the heat sink is positioned within the cable connector housing in the retracted position,
at least a portion of the heat sink extends through the cable connector housing and the card connector housing in the extended position,
the heat sink is rigidly mounted to the semiconductor chip,
the heat sink is in the retracted position when the paddle card is in the first position and is in the extended position when the paddle card is in the second position,
the cable connector housing further comprises an electroactive polymer (EAP) material arranged on the cable connector housing between the cable connector housing and the paddle card on a side of the paddle card opposite the semiconductor chip and heat sink,
the EAP material is configured to be electrically coupled to the card connector, and
electrical power from the card connector causes the EAP material to expand, thereby causing the flexible paddle card to move from the first position to the second position and causing the heat sink to move from the retracted position to the extended position.

7. The electrical cable of claim 6 , wherein the first plurality of contacts of the paddle card contact the card connector contacts when the paddle card moves to the second position.

8. The electrical cable of claim 6 , further comprising a second EAP material that expands to push the paddle card toward the card connector contacts upon the flexible paddle card moving from the first position to the second position.

9. A system, comprising:
a computer card, comprising:
a data processing card; and
a card connector housing that includes a first end and an opposing second end, wherein the card connector housing includes a window arranged at a location between the first and second ends, wherein the card connector housing includes a plurality of card contacts arranged toward the first end and an opening at a second opposing end, and wherein the plurality of card contacts are operatively connected to the data processing card;
a tailstock arranged at the second end of the card connector housing; and

an electrical cable, comprising:
a cable comprising multiple signal conductors;
a cable connector housing that includes a distal end configured for engagement with the card connector housing and an opposing proximal end;
a paddle card arranged within the cable connector housing, the paddle card including:
a first plurality of contacts arranged along an edge of the paddle card facing the distal end of the cable connector housing, wherein the first plurality of contacts are configured to engage the plurality of card contacts of the card connector;
a second plurality of contacts arranged along another edge of the paddle card toward the proximal end of the cable connector housing, wherein the second plurality of contacts are connected to respective ones of the multiple signal conductors; and
a semiconductor chip arranged on the paddle card and in electrical communication with the first plurality of contacts and the second plurality of contacts, wherein the semiconductor chip is operable to modify electrical signals between the first and second plurality of contacts;

a heat sink thermally coupled to the semiconductor chip, wherein the heat sink is movable from a retracted position to an extended position when the cable connector is seated in the card connector, wherein the heat sink is positioned within the cable connector housing in the retracted position, wherein at least a portion of the heat sink extends through the cable connector housing and the window in the card connector housing in the extended position, and wherein the heat sink moves to the extended position a

Assignees

• IBM

Inventors

• Jandt Tyler
• Mann Phillip V
• Plucinski Mark D
• Shirk/Heath Sandra

Classifications

• H01R13/6592

  the conductive member being a shielded cable · CPC title

• H01R13/665 Primary

  with built-in electronic circuit (H01R13/70, H01R13/719 take precedence) · CPC title

• H01R9/03

  Connectors arranged to contact a plurality of the conductors of a multiconductor cable {, e.g. tapping connections} · CPC title