Heat sink attachment apparatus and method

Patent metadata

Field	Value
Publication number	US-9603286-B2
Application number	US-201314435049-A
Country	US
Kind code	B2
Filing date	Oct 17, 2013
Priority date	Oct 19, 2012
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

There is provided an electronic device. The electronic device includes a circuit board having heat generating components thereon. The electronic device further includes spring clips or bend tabs. The electronic device also includes a heat sink, disposed over the circuit board, through which heat from the circuit board and the components thereon is released. The heat sink has a generally flat horizontal base and a series of vertically directed fins. The heat sink is secured to at least one of the circuit board and at least one of the components thereon by the spring clips or bend tabs being positioned at a periphery of the horizontal base. The spring clips or bend tabs have distal contact prongs that contact and apply downward force on the horizontal base.

First claim

The invention claimed is:

1. An electronic device, comprising:
a circuit board having heat generating components thereon;
spring clips; and
a heat sink, disposed over the circuit board, through which heat from the circuit board and the components thereon is released or dissipated, and having a generally flat horizontal base and a series of vertically directed fins; and
a shield attached to at least one of a bottom surface of the circuit board or a bottom frame of the electronic device, the shield being further attached to the spring clips;
wherein the heat sink is secured to at least one of the circuit board or one or more of the components thereon by the spring clips being positioned at a periphery of the horizontal base, the spring clips having distal contact prongs that contact and apply downward force on the horizontal base.

2. The electronic device of claim 1 , wherein the shield is substantially permanently attached to the at least one of the bottom surface of the circuit board or the bottom frame of the electronic device.

3. The electronic device of claim 1 , wherein the shield is removably attached to the at least one of the bottom surface of the circuit board or the bottom frame of the electronic device.

4. The electronic device of claim 1 , wherein the shield comprises wrap-around bend tabs for attaching the shield to the at least one of the bottom surface of the circuit board or the bottom frame of the electronic device.

5. The electronic device of claim 1 , wherein the shield has sidewalls surrounding a periphery of the circuit board.

6. The electronic device of claim 1 , wherein the spring clips are removably attached to the shield.

7. The electronic device of claim 1 , wherein the heat sink comprises a series of grooves inter-dispersed between the series of fins on a top side of the horizontal base, and the distal contact prongs contact and apply downward force onto one or more of the grooves.

8. An electronic device, comprising:
a cover;
side walls perpendicular to the cover;
a bottom frame parallel to the cover;
a circuit board having heat generating components thereon, the circuit board mounted in a housing comprising the bottom frame, the side walls, and the cover;
bend tabs;
a shield attached to at least one of a bottom surface of the circuit board and a bottom frame of the electronic device, the shield being further attached to the bend tabs; and
a heat sink, disposed over the circuit board, through which heat from the circuit board and the components thereon is released, and having a generally flat horizontal base and a series of vertically directed fins;
wherein the heat sink is secured to at least one of the circuit board or one or more of the components thereon by the bend tabs being positioned on the horizontal base, the bend tabs having distal contact prongs that contact and apply downward force on the horizontal base.

9. The electronic device of claim 8 , wherein the shield is substantially permanently attached to the at least one of the bottom surface of the circuit board or the bottom frame of the electronic device.

10. The electronic device of claim 8 , wherein the shield is removably attached to the at least one of the bottom surface of the circuit board or the bottom frame of the electronic device.

11. The electronic device of claim 8 , wherein the shield comprises wrap-around bend tabs for attaching the shield to the at least one of the bottom surface of the circuit board or the bottom frame of the electronic device.

12. The electronic device of claim 8 , wherein the bend tabs are substantially permanently attached to the shield.

13. The electronic device of claim 8 , wherein the heat sink comprises a series of grooves inter-dispersed between the series of fins on a top side of the horizontal base, and the distal contact prongs contact and apply downward force onto one or more of the grooves.

14. A method, comprising:
providing a single piece of sheet metal;
forming vertical sidewalls on the sheet metal to surround a periphery of a horizontal circuit board;
providing tabs that protrude upward from the vertical sidewalls;
positioning the formed sheet metal so that the vertical sidewalls surround the periphery of the circuit board;
attaching the formed sheet metal to the circuit board or a frame component under the circuit board;
placing a heat sink over the circuit board, the heat sink for extracting heat from the circuit board and components thereon; and
bending, twisting, rotating or distorting the tabs to contact an upper surface of the heat sink, thereby applying a downward force on the heat sink to cause the heat sink to contact at least one of the circuit board or one or more of the components thereon.

15. The method of claim 14 , wherein said step of providing tabs that protrude upward from the vertical sidewalls comprises forming the tabs on the single piece of sheet metal.

16. The method of claim 14 , wherein said step of providing tabs that protrude upward from the vertical sidewalls comprises attaching the tabs to the vertical sidewalls.

Assignees

• Thomas Licensing
• Thomson Licensing

Inventors

• Carpenter Joseph Lee
• Cheah Sin Hui
• Proctor Christopher Michael William

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/641

  Snap-on arrangements, e.g. clips · CPC title

• H01L23/4093

  Electricity · mapped topic

• H01L2924/0002

  Electricity · mapped topic

• H05K7/20409 Primary

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title