Array substrate comprising a barrier layer pattern and the method for manufacturing the same, and liquid crystal display device
US-9632382-B2 · Apr 25, 2017 · US
US9893066B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9893066-B2 |
| Application number | US-201715432165-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 14, 2017 |
| Priority date | Oct 5, 2015 |
| Publication date | Feb 13, 2018 |
| Grant date | Feb 13, 2018 |
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A semiconductor transistor device includes an oxide semiconductor layer having an active surface, a source electrode, a drain electrode, a gate electrode and a control capacitor. The gate electrode, the source electrode and the drain electrode are directly in contact with the active surface. The gate electrode is disposed between the drain electrode and the source electrode. The gate electrode, the source electrode and the drain electrode are separated from each other. The control capacitor is electrically connected to the gate electrode through a connection.
Opening claim text (preview).
What is claimed is: 1. A method for fabricating a semiconductor transistor device, comprising: forming an oxide semiconductor layer having an active surface; forming a source electrode, a drain electrode and a gate electrode separated from each other and directly in contact with the active surface, wherein the gate electrode is disposed between the drain electrode; and forming a control capacitor to electrically connect to the gate electrode through a connection. 2. The method according to claim 1 , wherein the gate electrode, the source electrode, and the drain electrode are formed on a substrate; and the oxide semiconductor layer is formed on the gate electrode, the source electrode, and the drain electrode, so as to make the active surface facing the substrate. 3. The method according to claim 1 , wherein the oxide semiconductor layer is formed on a substrate, and the source electrode, and the drain electrode are formed on the active surface departs from the substrate. 4. The method according to claim 1 , further comprising steps of forming a conductive layer on one side of the oxide semiconductor layer opposite to the active surface. 5. The method according to claim 1 , further comprising steps of forming a directive current (DC) circuit or a radio frequency (RF) circuit electrically connected to the control capacitor.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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