Electrolysis copper-alloy foil, method of the same, electrolytic-solution using the production, negative electrode aggregation used the same, secondary battery, and electrode of the same

Patent metadata

Field	Value
Publication number	US-9890463-B2
Application number	US-201313965291-A
Country	US
Kind code	B2
Filing date	Aug 13, 2013
Priority date	Jul 29, 2011
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

The invention relates to an electrolytic copper alloy foil having large mechanical strength in an ordinary state and showing resistant to heat deterioration even when it is heated to 300° C. or more. That electrolytic copper alloy foil, which contains tungsten copper, preferably incorporates tungsten into copper foil as a copper alloy, has a tensile strength at ordinary temperature of 650 MPa, has a tensile strength after heat treatment at 300° C. for 1 hour of 450 MPa or more, and has a conductivity of 80% or more. Further preferably, the electrolytic copper foil has an elongation at ordinary temperature of 2.5% or more and an elongation after treatment at 300° C. for 1 hour of 3.5% or more. The electrolytic copper foil is produced by adding a thiourea compound, tungsten salt, and chloride ions to a sulfuric acid-copper sulfate electrolyte and performing electrolytic deposition.

First claim

The invention claimed is:

1. An electrolytic copper alloy foil comprising from 0.0001 to 0.060 wt % of tungsten,
wherein the tungsten is at least partially incorporated as an oxide.

2. An electrolytic copper alloy foil, comprising from 0.001 to 0.055 wt % of tungsten,
wherein the electrolytic copper alloy foil has a tensile strength at ordinary temperature of 650 MPa or more and a tensile strength after treatment at 300° C. for 1 hour of 450 MPa or more.

3. An electrolytic copper alloy foil, comprising from 0.001 to 0.055 wt % of tungsten,
wherein the electrolytic copper alloy foil has a tensile strength at ordinary temperature of 650 MPa or more and a tensile strength after treatment at 300° C. for 1 hour of 450 MPa or more, and
wherein the electrolytic copper alloy foil has an elongation at ordinary temperature of 2.5% or more, and an elongation after treatment at 300° C. for 1 hour of 3.5% or more.

4. An electrolytic copper alloy foil, comprising:
from 0.0001 to 0.060 wt % of tungsten; and
chlorine.

5. An electrolytic copper alloy foil, comprising:
from 0.0001 to 0.060 wt % of tungsten; and
from 0.005 to 0.040 wt % of chlorine.

6. An electrolytic copper alloy foil comprising from 0.0001 to 0.060 wt % of tungsten,
wherein the electrolytic copper alloy foil has a peak intensity ratio I<220>/I<200> obtained by X-ray diffraction between a peak intensity I<220> of a crystal orientation I<220> and a peak intensity I<200> of a crystal orientation I<200> of 1.2 or more.

7. An electrode, comprising an electrolytic copper alloy foil comprising from 0.0001 to 0.060 wt % of tungsten as a negative electrode current collector, wherein the electrode is suitable for a lithium ion secondary cell, and wherein the electrolytic copper alloy foil deposits silicon, germanium, tin, an alloyed compound thereof, an active material comprising silicon, germanium, tin, or an alloyed compound thereof as a principal ingredient on the surface of the electrolytic copper alloy foil.

8. A method for producing the electrolytic copper alloy foil of claim 2 , the method comprising:
adding from 10 to 1,000 ppm of tungsten, from 1 to 20 ppm of at thiourea compound, and from 1 to 100 ppm of an chlorine ion as an additive to a copper sulfate electrolyte, thereby forming the electrolytic copper foil,
wherein the electrolytic copper alloy foil comprises from 0.001 to 0.055 wt % of tungsten, and
wherein the electrolytic copper alloy foil has a tensile strength at ordinary temperature of 650 MPa or more, a tensile strength after treatment at 300° C. for 1 hour of 450 MPa or more, and a conductivity of 80% or more.

Assignees

• Furukawa Electric Co Ltd

Inventors

• Suzuki Akitoshi
• Shinozaki Kensaku
• Fujisawa Kimiko
• Tsuruta Takahiro
• Ezura Takeshi
• Shinozaki Jun
• Ebisugi Masato
• Sasaki Hirokazu
• Yamazaki Satoshi

Classifications

• C25D7/0614

  Strips or foils · CPC title

• C22C9/00

  Alloys based on copper · CPC title

• H01M4/662

  Alloys (collectors of lead alloys H01M4/685) · CPC title

• C25D3/58

  containing more than 50% by weight of copper · CPC title

• C25D1/04

  Wires; Strips; Foils · CPC title