Protective film forming composition, protective film forming sheet, and chip provided with protective film

Patent metadata

Field	Value
Publication number	US-9890293-B2
Application number	US-201415032515-A
Country	US
Kind code	B2
Filing date	Nov 10, 2014
Priority date	Nov 8, 2013
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

A composition for protective film formation capable of forming a protective film excellent in attachability by a tape mounter or the like, with good visibility at a laser-printed portion and heat dissipation properties, allowing a protective film-equipped chip having high reliability to be manufactured, and a sheet for protective film formation and a protective film-equipped chip are provided. The composition for protective film formation contains a polymer component (A), a curable component (B), and a heat conductive filler (C) having an average particle size of 2.0 to 10.0 μm. The content of components that are liquid at 25° C. contained in the composition for protective film formation is 20 to 70 parts by mass relative to 100 parts by mass of the total of the (A) component and the (B) component.

First claim

The invention claimed is:

1. A composition for protective film formation, the composition comprising
(A) a polymer component (A);
(B) a curable component (B); and
(C) a heat conductive filler (C) having an average particle size of 2.0 to 10.0 μm, wherein:
a content of components that are liquid at 25° C. contained in the composition is 20 to 70 parts by mass relative to 100 parts by mass of the total of the (A) component and the (B) component; and
a content of the (C) component is 52 to 65 volume % relative to 100 volume % of a total amount of the composition.

2. The composition according to claim 1 , wherein the heat conductive filler (C) is a particle comprising one or more components selected from the group consisting of alumina, zinc oxide, magnesium oxide, titanium, silicon carbide, boron nitride, aluminum nitride, and glass.

3. The composition according claim 1 , wherein the heat conductive filler (C) is a spherical heat conductive filler.

4. The composition according to claim 1 , wherein the polymer component (A) comprises an acrylic-based polymer (A1) which is a copolymer having a constituent unit (a1) derived from an alkyl (meth)acrylate having an alkyl group with 1 to 18 carbon atoms and a constituent unit (a2) derived from a functional group-containing monomer.

5. The composition according to claim 1 , wherein
a content of the polymer component (A) is 3 to 45 mass %,
a content of the curable component (B) is 3 to 45 mass %, and
a content of the heat conductive filler (C) is 35 to 90 mass %, relative to 100 mass % of the total amount of the composition.

6. A sheet for protective film formation, the sheet comprising a protective film formation layer formed of the composition of claim 1 .

7. The sheet according to claim 6 , wherein the protective film formed by curing the protective film formation layer has a thermal conductivity of 2.0 W/(m·K) or more.

8. The sheet according to claim 6 , wherein the protective film formed by curing the protective film formation layer has a gloss value of 10 or more.

9. A protective film-equipped chip having, on the chip, a protective film formed by curing the protective film formation layer of the sheet of claim 6 .

Assignees

• Lintec Corp

Inventors

• Yamamoto Daisuke
• Yoneyama Hiroyuki

Classifications

• H10W74/473

  containing a filler · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/012

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title

• H01L23/295

  Electricity · mapped topic

• C09D133/08 Primary

  Homopolymers or copolymers of acrylic acid esters · CPC title