Ring structure for chip packaging

Patent metadata

Field	Value
Publication number	US-9887144-B2
Application number	US-201113227983-A
Country	US
Kind code	B2
Filing date	Sep 8, 2011
Priority date	Sep 8, 2011
Publication date	Feb 6, 2018
Grant date	Feb 6, 2018

Abstract

A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner.

First claim

What is claimed is:

1. A ring structure for chip packaging, comprising:
a frame portion adaptable to bond to a substrate, the frame portion surrounding a semiconductor chip and defining an inside opening, the inside opening exposing a portion of a surface of the substrate;
at least one corner portion, the at least one corner portion extending from a corresponding corner of the frame portion toward the semiconductor chip, and an end of each corner portion of the at least one corner portion being a rounded end, wherein the at least one corner portion comprises a different material than the frame portion; and
at least one mid-section portion of the frame portion, wherein the at least one mid-section portion extends from a corresponding sidewall of the frame portion toward the semiconductor chip, and the at least one mid-section portion has a same shape as the at least one corner portion.

2. The ring structure of claim 1 , wherein the at least one corner portion comprises conductive material, metal, copper, tungsten, aluminum, polysilicon, silicide, ceramic, alloys thereof, or combinations thereof.

3. The ring structure of claim 1 , wherein the at least one corner portion is a plurality of corner portions.

4. The ring structure of claim 3 , wherein a corner portion of the plurality of corner portions is located adjacent to each corresponding corner of the frame portion.

5. The ring structure of claim 1 , wherein the at least one mid-section portion is a plurality of mid-section portions.

6. The ring structure of claim 5 , wherein a mid-section portion of the plurality of mid-sections portions is located adjacent to each sidewall of the frame portion.

7. The ring structure of claim 1 , wherein the at least one corner portion includes a first corner portion and a second corner portion, and the at least one mid-section portion is between the first corner portion and the second corner portion.

8. The ring structure of claim 1 , wherein an end of each mid-section portion of the at least one mid-section portion is rounded.

9. The ring structure of claim 1 , wherein the at least one mid-section portion comprises a different material from the frame portion.

10. The ring structure of claim 1 , wherein the at least one mid-section portion extends from the corresponding sidewall located between adjacent corner portions of the at least one corner portion.

11. A ring structure for chip packaging, comprising:
a frame portion adaptable to bond to a substrate, the frame portion having an inside opening for surrounding a semiconductor chip, the inside opening exposing a portion of a surface of the substrate; and
at least one mid-section portion, the at least one mid-section portion extending from a corresponding sidewall of the frame portion toward the inside opening, and an end of each mid-section portion of the at least one mid-section portion being a rounded end, wherein the at least one mid-section portion is perpendicular to the corresponding sidewall of the frame portion, and the at least one mid-section portion comprises a different material as the frame portion.

12. The ring structure of claim 11 , wherein the at least one mid-section portion comprises conductive material, metal, copper, tungsten, aluminum, polysilicon, silicide, ceramic, alloys thereof, or combinations thereof.

13. The ring structure of claim 11 , wherein the frame portion has a thickness ranging from 500 μm to 1000 μm.

14. The ring structure of claim 11 , further comprising a plurality of corner portions, wherein each corner portion of the plurality of corner portions extends from a corresponding corner of the inside opening of the frame portion.

15. The ring structure of claim 14 , wherein the at least one mid-section portion has a same shape as at least one corner portion of the plurality of corner portions.

16. An integrated circuit structure, comprising:
a substrate;
a semiconductor chip; and
a ring structure having:
a frame portion adaptable to bond to the substrate, the frame portion surrounding the chip and defining an inside opening, the inside opening exposing a portion of a surface of the substrate
at least one corner portion, the corner portion extending from a first location of the inside opening of the frame portion towards the chip, and an end of each corner portion of the corner portion being a rounded end, wherein the at least one corner portion comprises a different material as the frame portion; and
at least one mid-section portion, the at least one mid-section portion extending from a second location of the frame portion toward the inside opening, an end of each mid-section portion of the at least one mid-section portion being a rounded end, wherein the at least one mid-section portion is perpendicular to the corresponding sidewall of the frame portion, and the first location is spaced apart from the second location.

17. The integrated circuit structure of claim 16 , wherein the at least one corner portion comprises conductive material, metal, copper, tungsten, aluminum, polysilicon, silicide, ceramic, alloys thereof, or combinations thereof.

18. The integrated circuit structure of claim 16 , wherein the frame portion has a thickness ranging from 500 μm to 1000 μm.

19. The ring structure of claim 16 , wherein the at least one mid-section portion comprises a different material from the frame portion.

20. The ring structure of claim 16 , wherein the at least one mid-section portion has a same shape as the at least one corner portion.

Assignees

• Lin Wen Yi
• Liu Yu Chih
• Yew Ming Chih
• Lin Tsung Shu
• Su Bor Rung
• Lu Jing Ruei
• Lin Wei Ting
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Lin Wen Yi
• Liu Yu Chih
• Yew Ming Chih
• Lin Tsung Shu
• Su Bor Rung
• Lu Jing Ruei
• Lin Wei Ting

Classifications

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title