Solder supply device including a nozzle with a piston and a demarcating member that demarcates an air chamber in which air is supplied to move the piston relative to a solder container

Patent metadata

Field	Value
Publication number	US-9883597-B2
Application number	US-201315100499-A
Country	US
Kind code	B2
Filing date	Dec 5, 2013
Priority date	Dec 5, 2013
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

A solder supply device provided with a solder cup housing liquid solder that is tubular and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; and an outer tube that demarcates an air chamber with the bottom surface of the solder cup. Solder is supplied from the tip of the nozzle section by the solder cup and the flange section being relatively moved by supplying air to the air chamber. Solder is supplied from the solder container without using an air cylinder, electromagnetic motor, or the like.

First claim

The invention claimed is:

1. A solder supply device comprising:
a solder container housing liquid solder that is tubular, is open at an opening provided at a first end of the solder container, and includes a bottom at a second end of the solder container;
an outer tube inside which the solder container is stored;
a nozzle, for ejecting solder from the solder container, that is inserted into the solder container;
a piston that is provided on an outer circumferential section of the nozzle and that is engaged inside of the solder container from the opening of the solder container; and
a demarcating member that demarcates an air chamber with at least one of the following: a surface of the second end of the solder container, an adapter attached to the surface of the second end of the solder container, or a surface of the piston facing the opening of the solder container,
wherein the solder supply device supplies solder from a tip of the nozzle by relatively moving the solder container and the piston by supplying air to the air chamber such that the piston advances inside the solder container between a first position and a second position, the piston being closer to the opening of the solder container in the first position than in the second position, and
wherein, in the second position of the piston, the solder container and the piston are removable from the outer tube as a single assembly from the outer tube.

2. The solder supply device according to claim 1 , wherein
the piston is provided on the outer circumferential section of the nozzle relatively movable to the nozzle,
the solder supply device is further provided with a lid that seals the opening of the solder container in a state with the tip of the nozzle inserted into the solder container, and
the lid functions as the demarcating member.

3. The solder supply device according to claim 1 , wherein
the piston is fixedly provided on the outer circumferential surface of the nozzle,
the outer tube is tubular with an opening at a first end of the outer tube and that stores the solder container in a state with the second end of the solder container engaged from the opening, and
the tube functions as the demarcating member.

4. The solder supply device according to claim 3 , wherein
the solder supply device is further provided with an inner tube that is tubular with an opening at first and second ends of the inner tube, holds the piston or the nozzle at the first end of the inner tube, extends from the opening of the solder container at the second end of the inner tube, and is fixed to the outer tube.

5. The solder supply device according to claim 4 , wherein
the inner tube is separable from the piston or the nozzle.

6. The solder supply device according to claim 4 , wherein
a surface of a second end of the outer tube is openable/closable.

7. The solder supply device according to claim 6 , wherein
the outer tube is swingably attached to a solder printer that prints solder on a target object.

8. The solder supply device according to claim 6 , wherein
a friction arising between the piston provided at the outer circumferential section of the nozzle and the inner circumferential surface of the solder container is greater than a holding force of the piston or the nozzle by the inner tube.

9. The solder supply device according to claim 2 , wherein
the solder supply device is detachably mounted on a solder printer that prints solder on a target object by a lock mechanism.

Assignees

• Fuji Machine Mfg

Inventors

• Senga Akihiro
• Fukakusa Shoji
• Hirukawa Ritsuo
• Fujita Yoji
• Yokoi Yoshimune

Classifications

• B23K2101/42

  Printed circuits · CPC title

• H05K3/3468 Primary

  Application of molten solder, e.g. dip soldering · CPC title

• B05C11/1002

  Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves · CPC title

• B05C17/00533

  comprising a piston · CPC title

• B41F15/42

  comprising squeegees or doctors · CPC title