Camera module having an array sensor

Patent metadata

Field	Value
Publication number	US-9883168-B2
Application number	US-201514961510-A
Country	US
Kind code	B2
Filing date	Dec 7, 2015
Priority date	Sep 19, 2012
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

An exemplary embodiment of the present disclosure includes an array sensor arrayed with a plurality of image sensors, and a plurality of lens units respectively mounted on the plurality of image sensors.

First claim

What is claimed is:

1. A camera module, the camera module comprising:
an array sensor comprising a plurality of image sensors disposed on a first surface thereof and a ground line disposed on the first surface thereof;
a plurality of lens units disposed on the array sensor; and
a shield member comprising an upper plate having a plurality of windows formed at a position corresponding with that of the plurality of lens units, and a lateral plate extended from the upper plate to cover the lens units, the shield member being electrically connected with the ground line,
wherein the ground line is spaced apart from the plurality of image sensors and an outer periphery of the array sensor.

2. The camera module of claim 1 , further comprising a blocking member connected between each of the lens unit and the shield member, the blocking member being configured to block spill light, and the blocking member being disposed along an inner periphery of each window of the shield member.

3. The camera module of claim 2 wherein the blocking member is disposed along an outer periphery of an upper surface of the corresponding lens unit.

4. The camera module of claim 2 , wherein the blocking member includes epoxy.

5. The camera module of claim 1 , further comprising a PCB (Printed Circuit Board) electrically connected to the array sensor.

6. The camera module of claim 5 , further comprising a solder ball disposed on a bottom surface of the array sensor, the solder ball electrically connecting the array sensor to the PCB.

7. The camera module of claim 5 , wherein the PCB is formed with a cavity, and
wherein a portion of the array sensor is disposed within the cavity of the PCB, and coupled to a bottom surface of the PCB.

8. The camera module of claim 7 , wherein the PCB includes a plurality of through holes, and
wherein the lens units are respectively disposed on upper surfaces of the image sensors through the through holes.

9. The camera module of claim 1 , wherein the image sensors are disposed in one imaginary plane.

10. The camera module of claim 1 , wherein the shield member is in contact with the ground line.

11. The camera module of claim 1 , further comprising connection units extending between adjacent lens units of the plurality of lens units, the connection units being integrally formed with the adjacent lens units.

12. The camera module of claim 1 , wherein the shield member includes a partition extending from the upper plate of the shield member, the partition being disposed at an array sensor area between the lens units in order to isolate each of the lens units.

13. The camera module of claim 1 , wherein the lens units are directly mounted on respective image sensors.

14. A smart phone comprising the camera module of claim 1 .

15. A camera module, the camera module comprising:
an array sensor comprising a plurality of image sensors disposed on a first surface thereof and a ground line disposed on the first surface thereof;
a plurality of lens units disposed on the array sensor;
a shield member comprising an upper plate having a plurality of windows formed at a position corresponding with that of the plurality of lens units, and a lateral plate extended from the upper plate to cover the lens units, the shield member being electrically connected with the ground line; and
a blocking member connected between each of the lens units and the shield member to block spill light,
wherein the ground line is spaced apart from the plurality of image sensors and an outer periphery of the array sensor.

Assignees

• Lg Innotek Co Ltd

Inventors

• Kim Min Soo

Classifications

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title