Imprint method, imprint apparatus, and article manufacturing method

Patent metadata

Field	Value
Publication number	US-9880463-B2
Application number	US-201213490547-A
Country	US
Kind code	B2
Filing date	Jun 7, 2012
Priority date	Jun 10, 2011
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

A method of performing an imprint process on each of a plurality of shot regions of a substrate, wherein each shot region includes at least one of at least one valid chip area and at least one invalid chip area, the invalid chip area including an inhibited area in which resin coating is inhibited, the imprint process for a shot region including both the invalid chip area and the valid chip area includes coating the valid chip area of the shot region with the resin, bringing a pattern surface of a mold into contact with the resin, and curing the resin, and in the step of coating, at least the inhibited area of the invalid chip area is not coated with the resin.

First claim

What is claimed is:

1. An imprint method of performing an imprint process on each of a plurality of shot regions of a substrate, wherein:
the plurality of shot regions include a peripheral shot region that includes an outer periphery of the substrate and a non-peripheral shot region that does not include the outer periphery of the substrate,
the peripheral shot region includes a valid chip area from which a valid chip is obtained and an invalid chip area from which no valid chip is obtained,
the invalid chip area includes a first area and a second area,
the first area captures an uncured resin that becomes pushed outwardly toward the outer periphery of the substrate when a mold and the uncured resin are contacted with each other, and includes the outer periphery of the substrate,
the second area is located at an inner side of the first area, and
for the imprint process for the peripheral shot region, the method comprises:
a supplying step of supplying the uncured resin to the second area, without supplying the uncured resin to the first area;
a contacting step of bringing a pattern surface of the mold into contact with the uncured resin on the peripheral shot region;
a curing step of curing the resin while the uncured resin and the pattern surface are in contact with each other; and
a releasing step of releasing the pattern surface of the mold from the resin cured in the curing step.

2. The method according to claim 1 , wherein:
the mold includes a first mold that forms a pattern in the non-peripheral shot region and a second mold that forms a pattern in the peripheral shot region, and
the imprint process is performed on the non-peripheral shot region using the first mold, and
the imprint process is performed on the peripheral shot region using the second mold.

3. The method according to claim 1 , wherein:
the mold has a first pattern surface that forms a pattern in the non-peripheral shot region and a second pattern surface that forms a pattern in the peripheral shot region, and
the imprint process is performed on at least the non-peripheral shot region using the first pattern surface, and
the imprint process is performed on the peripheral shot region using the second pattern surface.

4. An article manufacturing method comprising:
a pattern forming step of forming a pattern on a substrate by performing an imprint process on each of a plurality of shot regions of the substrate according to the method of claim 1 ; and
a processing step of processing the substrate on which the pattern is formed in the pattern forming step, to manufacture the article.

5. The imprint method according to claim 1 , wherein the first area is ring shaped corresponding to the outer periphery of the substrate.

6. The imprint method according to claim 1 , wherein:
the mold includes a flat surface,
the contacting step contacts part of the uncured resin on the peripheral shot region with the flat surface.

7. An imprint method of performing an imprint process on each of a plurality of shot regions of a substrate, wherein:
the plurality of shot regions include a peripheral shot region that includes an outer periphery of the substrate and a non-peripheral shot region that does not include the outer periphery of the substrate,
the peripheral shot region includes a valid chip area from which a valid chip is obtained and an invalid chip area from which no valid chip is obtained,
the invalid chip area including a first area and a second area,
the first area captures an uncured resin that becomes pushed outwardly toward the outer periphery of the substrate when a mold and the uncured resin are contacted with each other, and includes the outer periphery of the substrate,
the second area is located at an inner side of the first area, and
for the imprint process for the peripheral shot region, the method comprises:
a supplying step of supplying the uncured resin to the non-peripheral shot region and the second area, without supplying the first area with the uncured resin;
a contacting step of bringing a pattern surface of the mold into contact with the uncured resin on the peripheral shot region;
a curing step of curing the resin while the uncured resin and the pattern surface are in contact with each other; and
a releasing step of releasing the pattern surface of the mold from the resign resin cured in the curing step,
wherein the supplying step supplies the uncured resin on the substrate with a decreased amount of density of the uncured resin toward the first area.

8. An article manufacturing method comprising:
a pattern forming step of forming a pattern on a substrate by performing an imprint process on each of a plurality of shot regions of the substrate according to the method of claim 7 ; and
a processing step of processing the substrate on which the pattern is formed in the pattern forming step, to manufacture the article.

Assignees

• Wakabayashi Kohei
• Matsumoto Hideki
• Sakai Fumio
• Mizuno Makoto
• Canon Kk

Inventors

• Wakabayashi Kohei
• Matsumoto Hideki
• Sakai Fumio
• Mizuno Makoto

Classifications

• B82Y40/00

  Manufacture or treatment of nanostructures · CPC title

• B82Y10/00

  Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• H10P76/204

  of organic photoresist masks · CPC title