Method of manufacturing a motion sensor device

Patent metadata

Field	Value
Publication number	US-9880192-B2
Application number	US-201514609234-A
Country	US
Kind code	B2
Filing date	Jan 29, 2015
Priority date	Sep 16, 2011
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

A Micro-Electro-Mechanical System (MEMS) device includes a sensing element, and a proof mass over and overlapping at least a portion of the sensing element. The proof mass is configured to be movable toward the sensing element. A protection region is formed between the sensing element and the proof mass. The protection region overlaps a first portion of the sensing element, and does not overlap a second portion of the sensing element, wherein the first and the second portions overlap the proof mass.

First claim

What is claimed is:

1. A method comprising:
forming a sensing element of a Micro-Electro-Mechanical System (MEMS) device over a substrate;
bonding a proof mass of the MEMS device over the sensing element, wherein the proof mass is configured to rotate along a rotation axis; and
forming a protection region between the sensing element and the proof mass, wherein the protection region is configured to prevent the proof mass from hitting the sensing element, wherein in a top view of the MEMS device, the protection region has a first edge substantially flush with a second edge of the proof mass, with the second edge being parallel to a longitudinal direction of the rotation axis, and the second edge being farthest from the rotation axis among all edges of the proof mass, and wherein in the top view, no additional protection region is formed between the protection region and the rotation axis.

2. The method of claim 1 , wherein the forming the protection region comprises:
blanket forming a protection layer over an entirety of the sensing element; and
patterning the protection layer to leave a remaining portion of the protection layer as the protection region.

3. The method of claim 2 , wherein the protection region is aligned to a corner region of the proof mass, and wherein a portion of the protection layer aligned to a center region of the proof mass is removed during the patterning.

4. The method of claim 2 , wherein after the patterning, portions of the protection layer aligned to edge regions of the proof mass are removed.

5. The method of claim 2 , wherein after the patterning, a portion of the protection layer aligned to an edge region of the proof mass is left as the protection region.

6. The method of claim 1 , wherein the bonding comprises bonding anchor regions to a metal layer over the substrate, with the anchor regions attached to opposite ends of the rotation axis.

7. The method of claim 1 , wherein the bonding comprises an eutectic bonding.

8. The method of claim 1 , wherein the proof mass is configured to rotate around the rotation axis in a first direction in response to an acceleration of the proof mass, and to rotate around the rotation axis in a second direction opposite to the first direction in response to a deceleration of the proof mass.

9. The method of claim 1 , wherein the protection region comprises a metal nitride.

10. The method of claim 1 , wherein the protection region covers an entirety of a surface of the sensing element that faces the proof mass.

11. A method comprising:
forming a sensing element of a Micro-Electro-Mechanical System (MEMS) device over a substrate;
bonding a proof mass of the MEMS device over the sensing element, wherein the proof mass is configured to rotate around a rotation axis in a first direction in response to an acceleration of the proof mass, and to rotate around the rotation axis in a second direction opposite to the first direction in response to a deceleration of the proof mass; and
forming a protection region between the sensing element and the proof mass, wherein the protection region is configured to prevent the proof mass from hitting the sensing element.

12. The method of claim 11 , wherein the forming the protection region comprises:
blanket forming a protection layer over an entirety of the sensing element; and
patterning the protection layer to leave a remaining portion of the protection layer as the protection region.

13. The method of claim 12 , wherein after the patterning, a portion of the protection layer aligned to an edge region of the proof mass is left as the protection region.

14. The method of claim 11 , wherein the bonding comprises bonding anchor regions to a metal layer over the substrate, with the anchor regions attached to opposite ends of the rotation axis.

15. The method of claim 11 , wherein the bonding comprises an eutectic bonding.

16. A method comprising:
forming a sensing element of a Micro-Electro-Mechanical System (MEMS) device over a substrate;
bonding a proof mass of the MEMS device over the sensing element, wherein the proof mass is configured to rotate along a rotation axis, wherein the proof mass has a first portion and a second portion on opposite sides of the rotation axis, and the first portion is wider than the second portion; and
forming a protection region between the sensing element and the proof mass, wherein the protection region is configured to prevent the proof mass from hitting the sensing element, and the protection region is formed of a metal nitride.

17. The method of claim 16 , wherein the first portion has a first edge parallel to the rotation axis, with the first edge being a farthest edge of the first portion from the rotation axis, and the second portion has a second edge parallel to the rotation axis, with the second edge being an additional farthest edge of the second portion from the rotation axis, and wherein the first edge and the rotation axis has a first distance, and the second edge and the rotation axis has a second distance smaller than the first distance.

18. The method of claim 17 , further comprising forming a plurality of protection regions between the sensing element and the proof mass, wherein in a top view of the MEMS device, all protection regions are adjacent to either the first edge or the second edge.

19. The method of claim 16 , wherein the bonding comprises an eutectic bonding.

20. The method of claim 16 , wherein the proof mass is configured to rotate around the rotation axis in a first direction in response to an acceleration of the proof mass, and to rotate around the rotation axis in a second direction opposite to the first direction in response to a deceleration of the proof mass.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Cheng Shyh-Wei
• Hsu Yu-Ting
• Hsu Hsi-Cheng
• Wang Chih-Yu
• Weng Jui-Chun
• Chu Che-Jung

Classifications

• Y10T29/43

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• G01P2015/0871

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• H01G5/16

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