Motion sensor device and methods for forming the same

Patent metadata

Field	Value
Publication number	US-8960003-B2
Application number	US-201213353059-A
Country	US
Kind code	B2
Filing date	Jan 18, 2012
Priority date	Sep 16, 2011
Publication date	Feb 24, 2015
Grant date	Feb 24, 2015

Abstract

A Micro-Electro-Mechanical System (MEMS) device includes a sensing element, and a proof mass over and overlapping at least a portion of the sensing element. The proof mass is configured to be movable toward the sensing element. A protection region is formed between the sensing element and the proof mass. The protection region overlaps a first portion of the sensing element, and does not overlap a second portion of the sensing element, wherein the first and the second portions overlap the proof mass.

First claim

What is claimed is:

1. A device comprising:
a Micro-Electro-Mechanical System (MEMS) device comprising:
a sensing element;
a proof mass over and overlapping at least a portion of the sensing element, wherein the proof mass is configured to be movable toward the sensing element; and
a protection region between the sensing element and the proof mass, wherein the protection region overlaps a first portion of the sensing element, and does not overlap a second portion of the sensing element, and wherein the first and the second portions overlap the proof mass, and wherein the protection region is formed of a material, wherein the material is disposed to regions overlapping a corner region of the proof mass, and wherein none of the material overlaps a center region of the proof mass.

2. The device of claim 1 , wherein the protection region is formed of a material, wherein the material is disposed to regions overlapping a corner region of the proof mass, and wherein none of the material overlaps an edge region of the proof mass.

3. The device of claim 1 , wherein the protection region has a greater hardness than the sensing element.

4. The device of claim 1 , wherein the sensing element comprises aluminum copper, and wherein the protection region comprises a metal nitride.

5. The device of claim 1 , wherein the sensing element comprises aluminum copper, and wherein the protection region comprises an oxide or silicon nitride.

6. The device of claim 1 , wherein the proof mass comprises silicon.

7. A device comprising:
a Micro-Electro-Mechanical System (MEMS) device comprising:
a sensing element comprising aluminum;
a proof mass comprising silicon, wherein the proof mass, the sensing element, and an air-gap between the sensing element and the proof mass form a capacitor of the MEMS device; and
a plurality of protection regions in contact with the sensing element and between the sensing element and the proof mass, wherein the plurality of the protection regions overlaps regions selected from the group consisting essentially of edge regions of the proof mass and corner regions of the proof mass, and wherein no protection region is formed to overlap a center region of the proof mass.

8. The device of claim 7 , wherein the sensing element comprises aluminum copper, and the proof mass comprises silicon, and wherein the plurality of protection regions has a greater hardness than aluminum copper.

9. The device of claim 7 , wherein the plurality of the protection regions overlaps the corner regions of the proof mass.

10. The device of claim 7 , wherein the plurality of the protection regions overlaps the edge regions of the proof mass.

11. The device of claim 7 , wherein the plurality of the protection regions is formed of a material selected from the group consisting essentially of a metal nitride, an oxide, and titanium tungsten.

12. The device of claim 11 , wherein the plurality of the protection regions is formed of titanium nitride.

Assignees

• Cheng Shyh-Wei
• Hsu Yu-Ting
• Hsu Hsi-Cheng
• Wang Chih-Yu
• Weng Jui-Chun
• Chu Che-Jung
• Taiwan Semiconductor Mfg

Inventors

• Cheng Shyh-Wei
• Hsu Yu-Ting
• Hsu Hsi-Cheng
• Wang Chih-Yu
• Weng Jui-Chun
• Chu Che-Jung

Classifications

• Y10T29/43

  Electric condenser making · CPC title

• H01G5/16

  using variation of distance between electrodes · CPC title

• G01P15/125 Primary

  by capacitive pick-up · CPC title

• G01P2015/0871

  using stopper structures for limiting the travel of the seismic mass · CPC title