Scalable high-density wireless neuroelectric sensor and stimulator array
US-9662498-B1 · May 30, 2017 · US
US9880148B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9880148-B1 |
| Application number | US-201715478129-A |
| Country | US |
| Kind code | B1 |
| Filing date | Apr 3, 2017 |
| Priority date | Mar 27, 2014 |
| Publication date | Jan 30, 2018 |
| Grant date | Jan 30, 2018 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A neuroelectric sensor and stimulator system includes a first antenna, a reader coupled to the first antenna for transmitting stimulation controls and power to a second antenna, and for receiving sensor data transmitted from the second antenna via the first antenna, and at least one neuroelectric sensor stimulator array including the second antenna, a rectifier coupled to the second antenna for extracting power transmitted from the first antenna, a controller coupled to the second antenna for decoding controls transmitted from the first antenna to the second antenna for the neuroelectric sensor stimulator array, a plurality of sensors, a multiplexer coupled to the controller and to the plurality of sensors for selecting a single sensor, and a plurality of stimulators coupled to the controller for stimulating neurons, wherein the rectifier, the controller, the plurality of sensors, the multiplexer, and the plurality of stimulators include graphene.
Opening claim text (preview).
What is claimed is: 1. A method for fabricating a graphene-based neuroelectric sensor comprising: providing a bio-compatible microbial cellulose (MBC) membrane on a handling wafer; passivating the bio-compatible microbial cellulose (MBC membrane with an atomic layer deposition (ALD) of dielectric, or with a bio-compatible polymer; transferring graphene over the passivated bio-compatible microbial cellulose (MBC) membrane; patterning the transferred graphene; etching the patterned graphene to form a graphene mesa structure; forming ohmic contacts on the graphene mesa structure for source and drain electrodes; and releasing the bio-compatible microbial cellulose (MBC membrane from the handling wafer. 2. The method of claim 1 further comprising etching to remove the ALD dielectric or the bio-compatible polymer from a background nonactive area. 3. The method of claim 1 further comprising: forming a gate electrode integrated with a gate dielectric. 4. The method of claim 1 further comprising: forming electrical contacts for a multiplexer and for an electrical ground. 5. The method of claim 1 wherein the handling wafer is Si or glass. 6. The method of claim 1 wherein etching the patterned graphene to form graphene mesa structures comprises oxygen plasma etching. 7. The method of claim 1 wherein forming ohmic contacts for source and drain electrodes comprises using a biocompatible Ti alloy. 8. The method of claim 3 wherein forming a gate electrode comprises using a biocompatible metal or a metal alloy. 9. The method of claim 4 wherein forming electrical contacts for a multiplexer and for an electrical ground comprises using a biocompatible metal or a metal alloy. 10. The method of claim 1 further comprising: passivating the source and drain electrodes with a biocompatible polymer. 11. The method of claim 3 further comprising: passivating the gate electrode with a biocompatible polymer. 12. The method of claim 4 further comprising: passivating the electrical contacts for the multiplexer and for the electrical ground with a biocompatible polymer. 13. The method of claim 1 wherein the graphene is grown by chemical vapor deposition.
Etching of wafers, substrates or parts of devices · CPC title
Carbon, e.g. diamond-like carbon · CPC title
using chemical vapour deposition [CVD] · CPC title
the semiconductor being diamond, semiconducting diamond-like carbon or graphene · CPC title
Atomic layer deposition [ALD] · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.