SiC wafer producing method

Patent metadata

Field	Value
Publication number	US-9878397-B2
Application number	US-201715397386-A
Country	US
Kind code	B2
Filing date	Jan 3, 2017
Priority date	Jan 7, 2016
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

A SiC wafer is produced from an SiC ingot having an end surface by setting the focal point of a laser beam at a predetermined depth from the end surface. The depth corresponds to the thickness of the SiC wafer to be produced. The laser beam is applied to the end surface of the SiC ingot while relatively moving the focal point and the SiC ingot to thereby form a modified layer parallel to the end surface and cracks extending from the modified layer, thus forming a separation start point. The separation start point is formed by setting the numerical aperture of a focusing lens to form the focal point to 0.45 to 0.9 and substantially setting the M 2 factor of the laser beam between 5 and 50 to thereby set the diameter of the focal point to 15 to 150 μm.

First claim

What is claimed is:

1. An SiC wafer producing method for producing an SiC wafer from an SiC ingot having an end surface, comprising:
a separation start point forming step of setting a focal point of a laser beam having a transmission wavelength to the SiC ingot inside the SiC ingot at a predetermined depth from the end surface, which depth corresponds to the thickness of the SiC wafer to be produced, and next applying the laser beam to the end surface of the SiC ingot as relatively moving the focal point of the laser beam and the SiC ingot to thereby form a modified layer parallel to the end surface and cracks extending from the modified layer, thus forming a separation start point; and
a wafer separating step of separating a plate-shaped member having a thickness corresponding to the thickness of the SiC wafer from the SiC ingot at the separation start point after performing the separation start point forming step, thus producing the SiC wafer from the SiC ingot;
the separation start point forming step including the steps of setting the numerical aperture of a focusing lens for forming the focal point to 0.45 to 0.9 and substantially setting the M 2 factor of the laser beam to 5 to 50 to thereby set the diameter of the focal point to 15 to 150 μm.

2. The SiC wafer producing method according to claim 1 , wherein the power density at the focal point is set to (2 to 3)×10 5 W/cm 2 .

3. An SiC wafer producing method for producing an SiC wafer from an SiC ingot having a first surface, a second surface opposite to the first surface, a c-axis extending from the first surface to the second surface, and a c-plane perpendicular to the c-axis, the SiC wafer producing method comprising:
a separation start point forming step of setting a focal point of a laser beam having a transmission wavelength to the SiC ingot inside the SiC ingot at a predetermined depth from the first surface, which depth corresponds to the thickness of the SiC wafer to be produced, and next applying the laser beam to the first surface as relatively moving the focal point of the laser beam and the SiC ingot to thereby form a modified layer parallel to the first surface and cracks extending from the modified layer along the c-plane, thus forming a separation start point; and
a wafer separating step of separating a plate-shaped member having a thickness corresponding to the thickness of the SiC wafer from the SiC ingot at the separation start point after performing the separation start point forming step, thus producing the SiC wafer from the SiC ingot;
the separation start point forming step including:
a modified layer forming step of relatively moving the focal point of the laser beam in a first direction perpendicular to a second direction where the c-axis is inclined by an off angle with respect to a normal to the first surface and the off angle is formed between the first surface and the c-plane, thereby linearly forming the modified layer extending in the first direction; and
an indexing step of relatively moving the focal point in the second direction to thereby index the focal point by a predetermined amount;

the modified layer forming step including the steps of setting the numerical aperture of a focusing lens for forming the focal point to 0.45 to 0.9 and substantially setting the M 2 factor of the laser beam to 5 to 50 to thereby set the diameter of the focal point to 15 to 150 μm.

Assignees

• Disco Corp

Inventors

• Hirata Kazuya
• Morishige Yukio

Classifications

• B23K26/53 Primary

  for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title

• B28D5/0011

  with preliminary treatment, e.g. weakening by scoring · CPC title

• B23K26/0648

  comprising lenses · CPC title

• B23K26/0853

  Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane · CPC title

• B23K26/0626

  Energy control of the laser beam (B23K26/0622 takes precedence) · CPC title