Solder supply device including a solder cup and a nozzle section with a flange section that is elastically deformable

Patent metadata

Field	Value
Publication number	US-9878390-B2
Application number	US-201315100879-A
Country	US
Kind code	B2
Filing date	Dec 5, 2013
Priority date	Dec 5, 2013
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

Solder supply device includes solder cup that is tubular and open at one end, nozzle section for ejecting solder from the solder cup, flange section that is fixedly provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup, and inner tube an end of which holds the nozzle section and the other end of which extends from the opening of the solder cup; the flange section is formed from material that is elastically deformable and the flange section is engaged inside the cup with an outer edge section of the flange section in an elastically deformed state. The elastic force arising between the outer edge section of the flange section and the solder cup is smaller than the holding force of the nozzle section by the inner tube.

First claim

The invention claimed is:

1. A solder supply device comprising:
a solder container housing liquid solder, said solder container is tubular and open at a first end;
a nozzle, for ejecting solder from the solder container, that is inserted into the solder container;
a piston that is fixedly provided on an outer circumferential section of the nozzle and that is engaged inside of the solder container front an opening of the solder container;
a drive source that moves the solder container and the piston relatively; and
a holding member including a first end which holds at least one of the nozzle or the piston, and a second end which extends from the opening of the solder container,
wherein at least a portion of an outer edge section of the piston is formed from an elastically deformable material, the piston is engaged inside the solder container with at least the portion of the outer edge section in an elastically deformed state, and an elastic force arising between the outer edge section of the piston and an inside section of the solder container is smaller than a holding force of at least one of the nozzle and the piston by the holding member,
wherein the solder supply device is further provided with an outer tube that is tubular with an opening at a first end, said outer tube stores the solder container in a state where a second end of the solder container engages the opening of the outer tube,
wherein the solder container and the piston are relatively moved by air being supplied to an air chamber that is demarcated by the second end of the solder container and a second end of the outer tube, so as to supply solder from the tip of the nozzle,
wherein the holding member comprises:
an inner tube including a cylindrical tube section and a ring section covering an edge at a first end of the cylindrical tube section, the nozzle being held by the ring section; and
a fixed lid which is removably attached to the opening of the outer tube and which is fixed to a second end of the cylindrical tube section, and
wherein when the fixed lid is removed from the outer tube, the inner tube, the nozzle, and the solder cup are removed as one from the outer tube.

2. The solder supply device according to claim 1 , wherein
the solder supply device is further provided with a lock mechanism for detachably attaching at least one of the nozzle and the piston to the holding member, and the holding member holds at least one of the nozzle and the piston by at least one of the nozzle and the piston being attached to the holding member by the lock mechanism.

3. The solder supply device according to claim 1 , wherein
the nozzle is formed from an elastically deformable material,
the holding member holds the nozzle by elastic deformation of the nozzle, and
the elastic force arising between the outside edge section of the piston and the inside of the solder container is smaller than the elastic force which depends on the elastic deformation of the nozzle.

4. The solder supply device according to claim 1 , wherein
a total dimension of a thickness dimension of the piston and a length dimension of the holding member is longer than a depth dimension of the solder container.

5. The solder supply device according to claim 1 , wherein
a length dimension of the nozzle is shorter than a depth dimension of the solder container.

Assignees

• Fuji Machine Mfg
• Fuji Machine Mfg

Inventors

• Senga Akihiro
• Fukakusa Shoji

Classifications

• B41F15/405

  Spraying apparatus · CPC title

• B41F15/0881

  for printing on polyhedral articles · CPC title

• B23K3/0607

  Solder feeding devices · CPC title

• B05C17/00533

  comprising a piston · CPC title

• B23K3/0638 Primary

  for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · CPC title