Power conversion apparatus

Patent metadata

Field	Value
Publication number	US-9877419-B2
Application number	US-201615099873-A
Country	US
Kind code	B2
Filing date	Apr 15, 2016
Priority date	Sep 14, 2012
Publication date	Jan 23, 2018
Grant date	Jan 23, 2018

Abstract

An object of the present invention is to improve the cooling performance of a capacitor module used in a power conversion apparatus. The power conversion apparatus according to the present invention includes a power semiconductor module, a capacitor module, a flow path forming body that forms a flow path through which a cooling refrigerant flows. The flow path forming body includes a first flow path forming body that forms a first flow path part for cooling the power semiconductor module, and a second flow path forming body that forms a second flow path part for cooling the capacitor module. The first flow path forming body is provided on a side portion of the second follow path forming body and is integrally formed with the second flow path forming body. The second flow path forming body forms a housing space for housing the capacitor module above the second flow path part. The first flow path part is formed at a position facing the side wall that forms the housing space. The power semiconductor module is inserted into the first flow path part.

First claim

The invention claimed is:

1. A power conversion apparatus comprising:
a power semiconductor module converting DC power to AC power;
a capacitor module for smoothing the DC power;
a conductor plate connecting the power semiconductor module with the capacitor module;
a flow path forming body forming a flow path through which a cooling refrigerant flows; and
a wall defining a first housing space for housing the power semiconductor module and a second housing space for housing the capacitor module,
wherein the wall is connected with the flow path forming body, and
the conductor plate is thermally connected to the wall through an insulating member.

2. The power conversion apparatus according to claim 1 , wherein
the power semiconductor module has
a module sealant sealing a power semiconductor element,
a first radiating portion forming a first radiating surface facing a surface of the module sealant, and
a second radiating portion forming a second radiating surface facing another surface of the module sealant, and

the first radiating portion and the second radiating portion are connected to the flow path forming body.

3. The power conversion apparatus according to claim 1 , wherein
the conductor plate has
a positive electrode conductor plate, and
a negative electrode conductor plate facing the positive electrode conductor plate through an insulating layer.

4. The power conversion apparatus according to claim 3 , wherein
a laminated portion of the conductor plate where the positive electrode conductor plate and the negative electrode conductor plate are laminated with the insulating layer therebetween is arranged at a position facing to the wall in a laminating direction of the positive electrode conductor plate and the negative conductor plate, and
a portion of the conductor plate without interposing the insulating layer is formed at a position facing to the power semiconductor module.

5. The power conversion apparatus according to claim 1 , wherein
the flow path forming body has
a first flow path forming body that forms a first flow path part for cooling the power semiconductor module, and
a second flow path forming body that forms a second flow path part for cooling the capacitor module,

the first flow path forming body is provided on a side portion of the second flow path forming body and is integrally formed with the second flow path forming body,
the second flow path forming body forms the second housing space above the second flow path part,
the first flow path part is formed at a position facing the wall, and
the power semiconductor module is inserted into the first flow path part.

6. The power conversion apparatus according to claim 5 , wherein
a sum of a height of the capacitor module and a height of the second flow path part is smaller than a height of the power semiconductor module.

7. The power conversion apparatus according to claim 5 , wherein
the flow path forming body has a straight fin protruding to the inside of the second flow path.

8. The power conversion apparatus according to claim 1 , comprising
an auxiliary power semiconductor module for driving an auxiliary motor that is different from a motor driven by the power semiconductor module,
wherein the flow path forming body has
a first flow path forming body that forms a first flow path part for cooling the first power semiconductor module,
a second flow path forming body that forms a second flow path part for cooling the capacitor module, and
a third flow path forming body that forms a third flow path part for cooling the auxiliary power semiconductor module,

wherein the third flow path part is formed in such a way that when the third flow path part is projected along an arrangement direction of the capacitor module and the second flow path part, a shadow portion of the third flow path part does not overlap a shadow portion of the capacitor module and the power semiconductor module, and
wherein the auxiliary power semiconductor module is provided at a position facing the third flow path part.

9. The power conversion apparatus according to claim 1 , comprising
a case for housing the power semiconductor module, the capacitor module, and the flow path forming body,
wherein the case has a void portion so that an area surrounding the capacitor module has an air layer.

10. The power conversion apparatus according to claim 1 , wherein
the power semiconductor module comprises a plurality of power semiconductor modules, each having a rectangular shape with a side in a power semiconductor longitudinal direction and a side in a power semiconductor short direction,
the capacitor module has a rectangular shape with a side in a capacitor longitudinal direction and a side in a capacitor short direction, and
the plurality of power semiconductor modules are provided so that the sides in the power semiconductor short direction arranged in a line along the side in the capacitor longitudinal direction.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Suzuki Hideyo
• KOSUGA Masashi

Classifications

• H05K5/02

  Details · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/20927 Primary

  Liquid coolant without phase change · CPC title

• H02P27/06

  using DC to AC converters or inverters (H02P27/05 takes precedence) · CPC title

• H02M7/003 Primary

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title