Electric power conversion apparatus

Patent metadata

Field	Value
Publication number	US-9648791-B2
Application number	US-201514822446-A
Country	US
Kind code	B2
Filing date	Aug 10, 2015
Priority date	Mar 11, 2008
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

First claim

What is claimed is:

1. A power semiconductor module, comprising:
a plurality of power semiconductor elements that constitute an upper arm circuit and a lower arm circuit; and
a conducting plate that is continuous with a terminal for supplying direct current power to the power semiconductor elements, wherein:
the terminal includes a first DC terminal and a second DC terminal;
the conducting plate includes a first DC conduction plate and a second DC conduction plate;
the first DC conduction plate comprises a protruded portion that has a shape protruded toward the second DC conducting plate in a width direction of the first DC conducting plate, and in the protruded portion the first DC terminal is connected with the first DC conduction plate;
each of the first DC conduction plate and the second DC conduction plate includes a main surface that is wider than other surfaces of the conducting plate and a side surface that is narrower than the main surface;
the protruded portion of the first DC conduction plate is coplanar with the main surface of the first DC conduction plate;
the side surface of the protruded portion and the side surface of the second DC conduction plate are formed so as not to face to one another, and
the side surface of the first DC terminal and the side surface of the second DC terminal are formed so as to face to one another.

2. The power semiconductor module according to claim 1 , further comprising:
an AC terminal that transmits alternating current power generated through switching operation of the plurality of power semiconductor elements, wherein:
the first DC terminal is disposed between the second DC terminal and the AC terminal.

3. The power semiconductor module, according to claim 1 , wherein:
the first DC conduction plate has a bending portion that is formed between the protruded portion and the first DC terminal.

4. The power semiconductor module, according to claim 1 , further comprising:
a mold resin that seals part of the conduction plate, wherein
the protruded portion is disposed inside the mold resin, and
the first DC terminal and the second DC terminal are disposed outside the mold resin.

5. An electric power conversion apparatus, comprising:
a power semiconductor module according to claim 1 ;
a capacitor that smoothes direct current power; and
a DC bus bar that connects the power semiconductor module with the capacitor, wherein:
the DC bus bar comprises a first bus bar terminal that is connected with a main surface of the first DC terminal and a second bus bar terminal that is connected with a main surface of the second DC terminal.

6. The power semiconductor module, according to claim 1 , wherein the power semiconductor elements are disposed between the first and second DC conduction plates.

7. The power semiconductor module, according to claim 1 , wherein the first and second DC terminals have a comb-shaped tip.

Assignees

• Hitachi Ltd

Inventors

• Tokuyama Takeshi
• Nakatsu Kinya
• Saito Ryuichi
• Horiuchi Keisuke
• Satoh Toshiya
• Miyazaki Hideki

Classifications

• H10W90/763

  between laterally-adjacent chips · CPC title

• B60L50/51

  characterised by AC-motors · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07651

  characterised by changes in properties of the strap connectors during connecting · CPC title

• H10W72/60

  Strap connectors, e.g. thick copper clips for grounding of power devices · CPC title