Flip-chip bonder with induction coils and a heating element

Patent metadata

Field	Value
Publication number	US-9875985-B2
Application number	US-201414543950-A
Country	US
Kind code	B2
Filing date	Nov 18, 2014
Priority date	Nov 18, 2014
Publication date	Jan 23, 2018
Grant date	Jan 23, 2018

Abstract

A method and apparatus for flip chip bonding using conductive and inductive heating to heat a plurality of solder bumps located between a chip carrier and a chip.

First claim

What is claimed is:

1. A method of forming a flip chip assembly comprising joining a chip to a chip carrier with a plurality of solder bumps, wherein joining the chip to the chip carrier comprises heating the plurality of solder bumps to a temperature greater than the reflow temperature of the plurality of solder bumps using conductive heating and inductive heating, wherein conductive heating is performed using a heating element located in a tool head, wherein the tool head is in direct contact with the chip during conductive heating, and wherein inductive heating is performed by an induction coil substantially encircling the tool head.

2. The method of claim 1 , wherein the chip has a substantially uniform temperature during heating.

3. The method of claim 1 , wherein the chip has a temperature gradient such that an edge of the chip has a higher temperature than a center of the chip.

4. The method of claim 3 , wherein inductive heating is controlled such that the temperature on the edge of the chip is higher than the temperature on the center of the chip.

5. The method of claim 1 , wherein a material of the chip carrier comprises, silicon, glass, or a composite.

6. A method of forming a flip chip assembly comprising joining a chip layer, comprising at least a first chip and a second chip, to a chip carrier with a plurality of solder bumps, wherein joining the chip layer to the chip carrier comprises heating the plurality of solder bumps to a temperature greater than the reflow temperature of the plurality of solder bumps using conductive heating and inductive heating, wherein conductive heating is performed using a heating element located in a tool head, wherein the tool head is in direct contact with the chip during conductive heating, and wherein inductive heating is performed by an induction coil substantially encircling the tool head.

7. The method of claim 6 , wherein the chip layer has a substantially uniform temperature during heating.

8. The method of claim 6 , wherein the chip layer has a temperature gradient such that an edge of the chip layer has a higher temperature than a center of the chip layer.

9. The method of claim 8 , wherein inductive heating is controlled such that the temperature on the edge of the chip layer is higher than the temperature on the center of the chip layer.

10. The method of claim 6 , wherein a material of the chip carrier comprises silicon, glass, or a composite.

11. A flip chip bonding apparatus comprising:
a tool base having a first surface;
a tool head having a second surface, wherein the first surface of the tool base and the second surface of the tool head are facing each other, and the tool head may be moved with respect to the tool base;
a conductive heating element located in the tool head; and
an inductive heating element substantially encircling the tool head.

12. The apparatus of claim 11 , wherein the inductive heating element is located on an outer portion of the tool head.

13. The apparatus of claim 11 , wherein the inductive heating element is located anterior to the tool head.

14. The apparatus of claim 11 , further comprising a temperature monitoring device that receives a temperature on an outer edge of a chip during bonding.

15. The apparatus of claim 14 , further comprising a inductive heating controller, wherein the inductive heating controller receives the temperature on the outer edge of the chip during bonding from the temperature monitoring device, and the inductive heating controller modifies the amount of energy emitted from the inductive heating element based on the temperature of the outer edge of the chip during bonding.

16. The apparatus of claim 11 , wherein the second surface of the tool head moves substantially perpendicular to the first surface of the tool base.

Assignees

• IBM

Inventors

• Nah Jae-Woong
• Quesnel Sébastien S
• Sakuma Katsuyuki

Classifications

• H05B6/105

  using a susceptor · CPC title

• B23K1/012

  Soldering with the use of hot gas · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• H05K2201/10674

  Flip chip · CPC title

• H05B6/06

  Control, e.g. of temperature, of power · CPC title