Methods for adhesive bonding of electronic devices

Patent metadata

Field	Value
Publication number	US-9647189-B2
Application number	US-201615006232-A
Country	US
Kind code	B2
Filing date	Jan 26, 2016
Priority date	Jan 26, 2015
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

In accordance with certain embodiments, electronic components such as light-emitting elements are bonded to connection points on a substrate via pressure applied via a membrane and curing of a pressure-activated adhesive.

First claim

What is claimed is:

1. A method of fabricating an electronic device, the electronic device comprising a plurality of electronic components each bonded to a connection point on a substrate, the method comprising:
positioning each of the plurality of electronic components over a different connection point on the substrate;
providing a pressure-activated adhesive between each electronic component and its connection point;
providing a membrane over the plurality of electronic components and the substrate;
without adhering the membrane to the electronic components or to the substrate, applying a pressure, via the membrane, substantially simultaneously between each electronic component and its connection point;
curing the pressure-activated adhesive, thereby bonding each electronic component to its connection point; and
after applying the pressure via the membrane, removing an entirety of the membrane from the electronic device.

2. The method of claim 1 , wherein applying the pressure via the membrane comprises application of a fluid pressure to the membrane.

3. The method of claim 2 , further comprising reducing a pressure in a region between the membrane and the substrate.

4. The method of claim 2 , wherein the fluid pressure is at least partially applied to a surface of the membrane opposite the plurality of electronic components by a gas.

5. The method of claim 1 , wherein the membrane comprises a flexible membrane.

6. The method of claim 1 , wherein curing the pressure-activated adhesive comprises applying heat thereto.

7. The method of claim 1 , wherein (i) at least one connection point comprises two conductive traces defining a gap therebetween, and (ii) at least one electronic component comprises two spaced-apart contacts to each be bonded to one of the conductive traces.

8. The method of claim 1 , wherein the pressure-activated adhesive comprises an anisotropic conductive adhesive.

9. The method of claim 1 , wherein the pressure-activated adhesive comprises an isotropic conductive adhesive.

10. The method of claim 1 , wherein at least two of the electronic components have different sizes and/or heights.

11. The method of claim 1 , wherein the electronic components are positioned over the substrate such that a first pair of electronic components are separated by a first spacing and a second pair of electronic components are separated by a second spacing different from the first spacing.

12. The method of claim 1 , wherein at least one of the electronic components comprises a light-emitting diode.

13. The method of claim 1 , wherein at least one of the electronic components is unpackaged.

14. The method of claim 1 , wherein at least one of the electronic components is packaged.

15. The method of claim 1 , wherein the substrate comprises a flexible web extending between a supply roll and a take-up roll.

16. The method of claim 1 , wherein, when pressure is applied via the membrane, the membrane substantially conforms to the shapes of the underlying electronic components.

17. The method of claim 16 , further comprising disposing a force multiplier between at least one electronic component and the membrane.

18. The method of claim 1 , wherein, when pressure is applied via the membrane, the membrane conforms only partially to the shapes of the underlying electronic components.

19. A method of fabricating an electronic device, the electronic device comprising a plurality of electronic components each bonded to a connection point on a substrate, the method comprising:
positioning each of the plurality of electronic components over a different connection point on the substrate;
providing a pressure-activated adhesive between each electronic component and its connection point;
providing a membrane over the plurality of electronic components and the substrate;
disposing a protective layer between at least one electronic component and the membrane;
applying a pressure, via the membrane, substantially simultaneously between each electronic component and its connection point; and
curing the pressure-activated adhesive, thereby bonding each electronic component to its connection point,
wherein, after curing the pressure-activated adhesive, the protective layer is disposed over the at least one electronic component and is adhered to at least a portion of the substrate.

20. A method of fabricating an electronic device, the electronic device comprising a plurality of electronic components each bonded to a connection point on a substrate, the method comprising:
positioning each of the plurality of electronic components over a different connection point on the substrate;
providing a pressure-activated adhesive between each electronic component and its connection point;
providing a membrane over the plurality of electronic components and the substrate;
disposing a shaped protective layer between at least one electronic component and the membrane;
applying a pressure, via the membrane, substantially simultaneously between each electronic component and its connection point; and
curing the pressure-activated adhesive, thereby bonding each electronic component to its connection point,
wherein, after curing the pressure-activated adhesive, the shaped protective layer covers the at least one electronic component and is bonded to at least a portion of the substrate, and wherein the shaped protective layer comprises a curved portion that is disposed over the at least one electronic component.

21. The method of claim 19 , further comprising, after the pressure is applied via the membrane, removing an entirety of the membrane from the electronic device.

22. The method of claim 20 , further comprising, after the pressure is applied via the membrane, removing an entirety of the membrane from the electronic device.

Assignees

• Tischler Michael A
• Amini Alborz
• Cooledge Lighting Inc

Inventors

• Tischler Michael A
• Amini Alborz

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07125

  Means for controlling the bonding environment, e.g. valves or vacuum pumps · CPC title