Method and device for fabricating flexible display device

Patent metadata

Field	Value
Publication number	US-9873241-B2
Application number	US-201314353722-A
Country	US
Kind code	B2
Filing date	Dec 16, 2013
Priority date	Jul 19, 2013
Publication date	Jan 23, 2018
Grant date	Jan 23, 2018

Abstract

A method for fabricating a flexible display device is provided. The method comprises: attaching a first flexible substrate of the flexible display device onto a conductive adhesive layer, wherein the conductive adhesive layer is disposed on a conductive rigid substrate; fabricating other parts of the flexible display device on the first flexible substrate; aging the conductive adhesive layer; peeling off the flexible substrate from the conductive rigid substrate so as to obtain the flexible display device.

First claim

What is claimed is:

1. A method for fabricating a flexible display device, comprising:
attaching a flexible substrate of the flexible display device onto a conductive adhesive layer, wherein the conductive adhesive layer is disposed on a conductive rigid substrate, the conductive rigid substrate is located at a side of the conductive adhesive layer away from the first flexible substrate and is more rigid than the first flexible substrate;
fabricating other parts of the flexible display device on the flexible substrate;
aging the conductive adhesive layer;
peeling off the flexible substrate from the conductive rigid substrate so as to obtain the flexible display device.

2. The method of claim 1 , wherein the conductive adhesive layer is an adhesive into which conductive particle or conductive polymer is added.

3. The method of claim 2 , wherein the conductive particle comprises gold, silver, copper, aluminum, zinc, iron, nickel conductive particles, the conductive polymer comprise polyacetylene, polythiophene, polypyrrole, polyaniline, polyhenylene, polyphenylene vinylene or polydiacetylene.

4. The method of claim 2 , wherein the conductive rigid substrate is a metal substrate, or the conductive rigid substrate comprises a conductive layer and a non-conductive rigid substrate.

5. The method of claim 1 , wherein the conductive adhesive layer further comprises silane adhesive, polyimide adhesive, or acrylate adhesive, and conductive particle or conductive polymer.

6. The method of claim 5 , wherein the conductive particle comprises gold, silver, copper, aluminum, zinc, iron, nickel conductive particles, the conductive polymer comprise polyacetylene, polythiophene, polypyrrole, polyaniline, polyhenylene, polyphenylene vinylene- or polydiacetylene.

7. The method of claim 5 , wherein the conductive rigid substrate is a metal substrate, or the conductive rigid substrate comprises a conductive layer and a non-conductive rigid substrate.

8. The method of claim 1 , wherein the conductive rigid substrate is a metal substrate, or the conductive rigid substrate comprises a conductive layer and a non-conductive rigid substrate.

9. The method of claim 8 , wherein the conductive layer is an indium tin oxide layer, the non-conductive rigid substrate is a glass substrate.

10. The method of claim 1 , wherein the step of aging the adhesive layer comprises aging the adhesive layer by scanning a back side of the conductive rigid substrate with a laser beam or by heating.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Cheng Hongfei
• Zhang Yuxin

Classifications

• H10P72/7442

  Separation by peeling · CPC title

• H10P72/7426

  used as a support during build up manufacturing of active devices · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H01L27/3244

  Electricity · mapped topic