Method for transferring objects onto a substrate using a compact particle film, including a step of producing connectors on the objects

Patent metadata

Field	Value
Publication number	US-9873227-B2
Application number	US-201314375858-A
Country	US
Kind code	B2
Filing date	Feb 8, 2013
Priority date	Feb 10, 2012
Publication date	Jan 23, 2018
Grant date	Jan 23, 2018

Abstract

A method for transferring objects onto a substrate, or running substrate, the objects to be transferred being placed in a transfer area containing a carrier liquid forming a conveyor, the objects being held by a compact film of particles floating on the carrier liquid of the transfer area, within which the objects are displaced with the film of particles to be transferred onto the substrate, making at least one connector on at least one of the objects, the connector being made by a substance comprising a polymerizable compound, put in contact with the object arranged within the transfer area, and then by polymerization of the substance.

First claim

The invention claimed is:

1. A method for transferring objects onto a substrate, comprising:
providing a transfer area including a carrier liquid forming a conveyor;
providing a film of particles floating on the carrier liquid;
placing the objects on the film of particles, the objects displacing a portion of the film of particles;
forming at least one connector between at least two consecutive objects of the objects placed on the film of particles, the at least one connector being in contact with at least one of said two consecutive objects and comprising a substance including a polymerisable compound, the forming comprising polymerising the substance; and
conveying the objects on the transfer area, the displaced portion of the film of particles keeping the objects on the carrier liquid during the conveying.

2. The method according to claim 1 , wherein the forming the at least one connector further comprises applying the substance including the polymerisable compound to the film of particles to connect the at least two consecutive objects spaced apart from each other within the transfer area, and then polymerising the substance.

3. The method according to claim 1 , wherein the forming the at least one connector further comprises applying the substance including the polymerisable compound to one of the at least two consecutive objects to connect the at least two consecutive objects to be stacked on each other within the transfer area, and then polymerising the substance.

4. The method according to claim 1 , wherein the substrate includes at least one through-hole housing the at least one connector formed between a lower surface of an object of the at least two consecutive objects and the film of particles.

5. The method according to claim 1 , wherein the at least one connector is an electric, thermal, optical, piezoelectric, or mechanical connector.

6. The method according to claim 1 , wherein the at least one connector is disposed on an upper surface of at least one of the at least two consecutive objects.

7. The method according to claim 1 , wherein the at least one connector is disposed on a lower surface of at least one of the objects by being interposed between the lower surface and the film of particles.

8. The method according to claim 1 , wherein the substance is in a form of a liquid or a paste.

9. The method according to claim 1 , wherein the substance is hydrophobic.

10. The method according to claim 1 , wherein the substance is based on a silicone resin, an epoxy resin, and/or a polyurethane resin.

11. The method according to claim 1 , wherein the substance comprises at least some particles taken from following materials: carbon black; carbon nanotubes; graphene; fibers, including at least one of carbon, steel, aluminium, or copper fibers; metal powders; and metal oxides.

12. The method according to claim 1 , wherein at least one of the at least two consecutive objects is placed in the transfer area, floats on the carrier liquid forming the conveyor, and is enclosed by the film of particles.

13. The method according to claim 1 , wherein at least one of the at least two consecutive objects is placed in the transfer area on the film of particles and depresses into the carrier liquid particles in the film of particles underlying said at least one of the at least two consecutive objects.

14. The method according to claim 1 , wherein the placed objects each have a large dimension greater than 0 . 2 cm.

15. The method according to claim 1 , wherein the placed objects are objects taken from the group of silicon chips, components of organic electronics, metallic elements, photovoltaic cells, battery cells, and micro-battery cells.

16. The method according to claim 1 , further comprising circulating particles of the film of particles and the carrier liquid by a tilted ramp attached to an inlet of the transfer area.

Assignees

• Commissariat Energie Atomique

Inventors

• Dellea Olivier
• Coronel Philippe
• Dreuilles Nicolas
• Fugier Pascal

Classifications

• H10W72/00

  Interconnections or connectors in packages · CPC title

• B05D2401/32

  applied as powders · CPC title

• B05D2252/02

  of indefinite length · CPC title

• B29K2509/08

  Glass · CPC title

• B05C3/18

  only one side of the work coming into contact with the liquid or other fluent material (B05C3/02 takes precedence) · CPC title